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1. 发明专利

JP2010265480A Novel thermosetting benzoxazine resin, method of producing the same and cured product of the same 审中-公开
标题翻译：新型热稳定苯并吖庚因树脂，其制造方法及其固化产物
公开(公告)号：JP2010265480A
公开(公告)日：2010-11-25
申请号：JP2010174971
申请日：2010-08-04
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUCHIKAWA SHINJI , KOBAYASHI KAZUHITO
IPC分类号： C08G73/06 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin which has high flexibility and toughness and, in addition, has high reliability as the thermosetting resin, to provide a production method well-suited for the thermosetting resin and to provide a cured product produced by curing the resin. SOLUTION: The thermosetting benzoxazine resin having a polybutadiene part in a skeleton and the production method of the thermosetting benzoxazine resin are disclosed. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种具有高柔性和韧性并且另外作为热固性树脂具有高可靠性的热固性树脂，以提供一种非常适合于热固性树脂的制备方法，并提供固化产物通过固化树脂生产。解决方案：公开了一种在骨架中具有聚丁二烯部分的热固性苯并恶嗪树脂和热固性苯并恶嗪树脂的制备方法。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2010196059A Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminated plate, using the same 审中-公开
标题翻译：印刷电路板的树脂组合物，以及使用它的帆布，PREPREG和金属层压板
公开(公告)号：JP2010196059A
公开(公告)日：2010-09-09
申请号：JP2010050775
申请日：2010-03-08
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MIZUNO YASUYUKI , FUJIMOTO DAISUKE , SHIMIZU HIROSHI , KOBAYASHI KAZUHITO , SUEYOSHI TAKAYUKI
IPC分类号： C08L79/04 , B32B15/08 , B32B15/092 , C08G59/40 , C08G73/06 , C08J5/24 , C08K5/3492 , C08L63/00 , C08L71/12 , H05K1/03
CPC分类号： C08G73/0655 , B32B15/08 , B32B2363/00 , C08G59/4014 , C08L63/00 , C08L79/04 , H05K1/0353 , C08L2666/20
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for printed wiring boards to be used for electronic devices in which operating frequency exceeds 1 GHz, and to provide a varnish, a prepreg and a metal clad-laminated plate using the same. SOLUTION: The resin composition for printed wiring boards includes a cyanate ester compound having 2 or more cyanato groups in the molecule and/or a prepolymer thereof and an epoxy resin containing at least one epoxy resin having a biphenyl skeleton in the molecule. A varnish, a prepreg, and a metal clad-laminated plate using the same are also provided. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于工作频率超过1GHz的电子设备的印刷线路板用树脂组合物，提供一种清漆，预浸料和使用该树脂的金属包覆层压板。解决方案：印刷电路板用树脂组合物包括分子中具有2个以上氰基的氰酸酯化合物和/或其预聚物，以及分子中含有至少一个具有联苯骨架的环氧树脂的环氧树脂。还提供了清漆，预浸料和使用其的金属包覆层压板。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2009041101A Insulating film-coated powder, and method for producing the same 有权
标题翻译：绝缘膜包覆粉末及其制造方法
公开(公告)号：JP2009041101A
公开(公告)日：2009-02-26
申请号：JP2008076584
申请日：2008-03-24
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MARUYAMA KOJI , KOBAYASHI KAZUHITO
IPC分类号： B22F1/02 , B22F3/00 , H01F1/24 , H01F1/26
摘要： PROBLEM TO BE SOLVED: To provide powder capable of obtaining a powder magnetic core having excellent mechanical properties and insulation properties, and to provide a method for producing the powder.
SOLUTION: The insulating film-coated powder is provided with an insulating film obtained from a coating liquid composition containing a silica particle surface-modified with an organosilane compound, polysilazane and a solvent.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供能够获得具有优异的机械性能和绝缘性能的粉末磁芯的粉末，并提供制造粉末的方法。绝缘膜包覆粉末设置有由含有有机硅烷化合物，聚硅氮烷和溶剂表面改性的二氧化硅粒子的涂布液组合物得到的绝缘膜。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2006257286A Cyano group-containing thermosetting benzoxazine resin, thermosetting resin composition and its application 有权
标题翻译：含氰基的含热敏苯乙烯类树脂，热固性树脂组合物及其应用
公开(公告)号：JP2006257286A
公开(公告)日：2006-09-28
申请号：JP2005077436
申请日：2005-03-17
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUCHIKAWA SHINJI , AKIYAMA MASANORI , KOBAYASHI KAZUHITO
IPC分类号： C08G73/06 , C08G59/40 , C08J5/24 , C08L63/00
摘要： PROBLEM TO BE SOLVED: To provide a printed circuit board material for electronic devices and a printed circuit board improved in adhesion, crack resistance and heat resistance.
SOLUTION: The present invention provides (1) a cyano group-containing thermosetting benzoxazine resin produced by reacting (a) a bifunctional phenol resin with (b) an aldehyde compound, (c) an amine compound containing one or more cyano groups and a primary amino group in one molecule and (d) an amine compound other than the component (c) containing one or more primary amino groups in one molecule, and (2) a thermosetting resin composition containing an epoxy resin having two or more epoxy groups in one molecule and its application.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于电子设备的印刷电路板材料和提高粘合性，抗裂性和耐热性的印刷电路板。解决方案：本发明提供（1）通过（a）双官能酚醛树脂与（b）醛化合物反应制备的含氰基的热固性苯并恶嗪树脂，（c）含有一个或多个氰基的胺化合物和一个分子中的伯氨基和（d）除了在一个分子中含有一个或多个伯氨基的组分（c）以外的胺化合物，和（2）含有具有两个或更多个环氧基的环氧树脂的热固性树脂组合物一个分子中的基团及其应用。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2006028294A Solventless one-pack thermosetting epoxy resin composition for filling gap 审中-公开
标题翻译：无溶剂一包热固化环氧树脂组合物填充GAP
公开(公告)号：JP2006028294A
公开(公告)日：2006-02-02
申请号：JP2004207267
申请日：2004-07-14
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MIYATAKE MASATO , KOBAYASHI KAZUHITO , FUKUDA TOMIO
IPC分类号： C08G59/32
摘要： PROBLEM TO BE SOLVED: To provide a solventless one-pack thermosetting resin composition for filling gaps which has high heat resistance and a low heat expansion coefficient and is low viscous, excellent in workability and preservation stability, and highly thixotropic.
SOLUTION: The solventless one-pack thermosetting epoxy resin composition comprises a trifunctional or higher functional epoxy resin, a curing agent, an inorganic filler and a surfactant having a weight-average molecular weight of at least 1,000.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种无粘性单组分热固性树脂组合物，用于填充间隙，其具有高耐热性和低热膨胀系数，并且粘性低，加工性和保存稳定性优异，触变性高。解决方案：无溶剂的单组分热固性环氧树脂组合物包含三官能或更高官能的环氧树脂，固化剂，无机填料和重均分子量至少为1,000的表面活性剂。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2007180571A Insulating material with copper foil and multilayer wiring board using same 有权
标题翻译：绝缘材料与铜箔和多层接线板使用相同
公开(公告)号：JP2007180571A
公开(公告)日：2007-07-12
申请号：JP2007033874
申请日：2007-02-14
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KAMISHIRO YASUSHI , KOBAYASHI KAZUHITO , TAKAHASHI ATSUSHI , MORITA KOJI , TANABE TAKAHIRO
IPC分类号： H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide an insulating material with copper foil which has a low thermal expansion coefficient and is excellent in insulation reliability, and a multilayer wiring board using the same.
SOLUTION: The insulating material with copper foil is formed of an insulating varnish and a copper foil, and does not contain glass cloth. The insulating varnish is composed of electrically insulating whiskers and a resin component, wherein the average diameter of the whiskers ranges 0.3-3.0 μm, while their average length is more than 10 times the average diameter and ranges 3-50 μm. The whiskers are obtained by removing metallic contaminants from commercially available electrically insulating whiskers to such an extent that the content of the residual metallic contaminants is 70 ppm or lower. The insulating material with copper foil is used to form the multilayer wiring board.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供具有低热膨胀系数并且绝缘可靠性优异的铜箔的绝缘材料以及使用该绝缘材料的多层布线板。
解决方案：铜箔绝缘材料由绝缘漆和铜箔形成，不含玻璃布。绝缘漆由电绝缘晶须和树脂成分组成，其中晶须的平均直径为0.3-3.0μm，平均长度大于平均直径的10倍，范围为3-50μm。通过从商业上可获得的电绝缘晶须去除金属污染物使残留金属污染物的含量为70ppm或更低的程度获得晶须。使用具有铜箔的绝缘材料形成多层布线板。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2005247889A Thermosetting resin composition, prepreg, and laminate using the same 审中-公开
标题翻译：热固性树脂组合物，PREPREG和使用它的层压板
公开(公告)号：JP2005247889A
公开(公告)日：2005-09-15
申请号：JP2004056058
申请日：2004-03-01
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： SUGAWARA IKUO , IKEDA KENICHI , KATO AKIRA , OSE MASAHISA , SHIMAOKA SHINJI , SUGANO TOMOYOSHI , FUKUDA TOMIO , KOBAYASHI KAZUHITO , MIYATAKE MASATO
IPC分类号： C08J5/24 , B32B15/08 , B32B15/092 , C08K3/22 , C08L63/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition flame-retarded without using any halogen-containing flame retardant, excellent in heat resistance, and coping with an environmental problem, to provide a prepreg, and to provide a laminate using the prepreg.
SOLUTION: The thermosetting resin composition is one comprising (a) an epoxy resin, (b) a curing agent, and (c) highly heat-resistant aluminum hydroxide having a 1% weight loss temperature of 250°C or higher, wherein 50 to 200 pts.wt. highly heat-resistant aluminum hydroxide (c) is present per 100 pts.wt. organic resin solids of the thermosetting resin composition.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种阻燃型热固性树脂组合物，不使用任何含卤素阻燃剂，耐热性优异并且能够应对环境问题，提供预浸料，并提供使用预浸料。解决方案：热固性树脂组合物是包含（a）环氧树脂，（b）固化剂和（c）具有1％重量损失温度为250℃或更高的高耐热氢氧化铝的组合物，其中50〜200重量份每100重量份存在高耐热氢氧化铝（c）热固性树脂组合物的有机树脂固体。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2010275557A Novel thermosetting benzoxazine resin and method for manufacturing the same 审中-公开
标题翻译：新型热稳定苯并噻吩类树脂及其制造方法
公开(公告)号：JP2010275557A
公开(公告)日：2010-12-09
申请号：JP2010154144
申请日：2010-07-06
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUCHIKAWA SHINJI , KOBAYASHI KAZUHITO
IPC分类号： C08G14/073 , B32B15/08 , C08G73/00
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin that has toughness in addition to high flexibility and also has high reliability as a thermosetting resin, a suitable method for manufacturing the same, and a cured product obtained by curing the resin.
SOLUTION: The thermosetting benzoxazine resin having a phenoxy moiety in the skeleton and a suitable method for manufacturing the same are provided.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决问题：为了提供除了高柔性以外还具有韧性的热固性树脂，并且作为热固性树脂具有高可靠性，其合适的制造方法以及通过使树脂固化获得的固化产物。解决方案：提供了骨架中具有苯氧基部分的热固性苯并恶嗪树脂及其制造方法。版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2010159427A Resin composition, prepreg, laminate and printed wiring board using the same 有权
标题翻译：树脂组合物，PREPREG，层压板和印刷线路板
公开(公告)号：JP2010159427A
公开(公告)日：2010-07-22
申请号：JP2010066892
申请日：2010-03-23
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MIYATAKE MASATO , FUKUDA TOMIO , TAKANO MARE , KOBAYASHI KAZUHITO
IPC分类号： C08L63/00 , C08G59/40 , C08J5/24 , C08K3/22 , C08L83/04 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition which contains a highly dispersed inorganic filler such as a metal hydrate, has high heat resistance, does not contain a halogen, and has flame retardancy, and to provide a laminate and a printed wiring board each using the same. SOLUTION: This resin composition is characterized by containing (A) an epoxy resin, (B) a curing agent, (C) a metal hydrate, (D) a silicone polymer having phenyl groups in the siloxane skeleton and having two or more functional groups at least one terminal, as essential components, wherein the content of the component (C) is 50 to 150 wt.% based on the total amount of the components (A) and (B). COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：待解决的问题：为了提供一种包含高度分散的无机填料如金属水合物的树脂组合物，具有高耐热性，不含卤素并具有阻燃性，并且提供层压体和印刷接线板各使用相同。解决方案：该树脂组合物的特征在于含有（A）环氧树脂，（B）固化剂，（C）金属水合物，（D）在硅氧烷骨架中具有苯基的硅氧烷聚合物，并具有两个或更多官能团至少一个末端作为必需成分，其中组分（C）的含量相对于组分（A）和（B）的总量为50至150重量％。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2006131749A Resin composition, prepreg, laminate and printed wiring board using the same 有权
标题翻译：树脂组合物，PREPREG，层压板和印刷线路板
公开(公告)号：JP2006131749A
公开(公告)日：2006-05-25
申请号：JP2004322176
申请日：2004-11-05
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MIYATAKE MASATO , FUKUDA TOMIO , TAKANO MARE , KOBAYASHI KAZUHITO
IPC分类号： C08L63/00 , B32B15/092 , C08J5/24 , C08K3/20 , C08L83/04 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition which contains a highly dispersed inorganic filler such as a metal hydroxide, has high heat resistance, does not contain a halogen, and has flame retardancy, and to provide a laminate and a printed wiring board each using the same. SOLUTION: This resin composition is characterized by containing (A) an epoxy resin, (B) a curing agent, (C) a metal hydroxide, (D) a silicone polymer having phenyl groups in the siloxane skeleton and having two or more functional groups at at least one terminal, as essential components, wherein the content of the component (C) is 50 to 150 wt.% based on the total amount of the components (A) and (B). COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供含有高度分散的无机填料如金属氢氧化物的树脂组合物，具有高耐热性，不含卤素并且具有阻燃性，并且提供层压体和印刷接线板各使用相同。该树脂组合物的特征在于含有（A）环氧树脂，（B）固化剂，（C）金属氢氧化物，（D）在硅氧烷骨架中具有苯基的硅氧烷聚合物，其具有两个或至少一个末端的更多官能团作为必要组分，其中组分（C）的含量相对于组分（A）和（B）的总量为50至150重量％。版权所有（C）2006，JPO＆NCIPI

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