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1. 发明专利

JP2005247889A Thermosetting resin composition, prepreg, and laminate using the same 审中-公开
标题翻译：热固性树脂组合物，PREPREG和使用它的层压板
公开(公告)号：JP2005247889A
公开(公告)日：2005-09-15
申请号：JP2004056058
申请日：2004-03-01
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： SUGAWARA IKUO , IKEDA KENICHI , KATO AKIRA , OSE MASAHISA , SHIMAOKA SHINJI , SUGANO TOMOYOSHI , FUKUDA TOMIO , KOBAYASHI KAZUHITO , MIYATAKE MASATO
IPC分类号： C08J5/24 , B32B15/08 , B32B15/092 , C08K3/22 , C08L63/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition flame-retarded without using any halogen-containing flame retardant, excellent in heat resistance, and coping with an environmental problem, to provide a prepreg, and to provide a laminate using the prepreg.
SOLUTION: The thermosetting resin composition is one comprising (a) an epoxy resin, (b) a curing agent, and (c) highly heat-resistant aluminum hydroxide having a 1% weight loss temperature of 250°C or higher, wherein 50 to 200 pts.wt. highly heat-resistant aluminum hydroxide (c) is present per 100 pts.wt. organic resin solids of the thermosetting resin composition.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种阻燃型热固性树脂组合物，不使用任何含卤素阻燃剂，耐热性优异并且能够应对环境问题，提供预浸料，并提供使用预浸料。解决方案：热固性树脂组合物是包含（a）环氧树脂，（b）固化剂和（c）具有1％重量损失温度为250℃或更高的高耐热氢氧化铝的组合物，其中50〜200重量份每100重量份存在高耐热氢氧化铝（c）热固性树脂组合物的有机树脂固体。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2008013773A Flame-retardant non-halogen epoxy resin composition, prepreg using it and laminate for electric wiring boards 审中-公开
标题翻译：阻燃非卤化物环氧树脂组合物，使用其和电路板的层压板
公开(公告)号：JP2008013773A
公开(公告)日：2008-01-24
申请号：JP2007208463
申请日：2007-08-09
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： OHORI KENICHI , IKEDA KENICHI
IPC分类号： C08G59/62 , B32B15/04 , B32B15/14 , C08J5/24 , C08L63/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin composition which is highly heat-resistant, tracking-resistant and safe and excellent in flame-retardance and a prepreg and a laminate for an electric wiring board using the composition.
SOLUTION: The flame-retardant non-halogen epoxy resin composition is composed of an epoxy resin, a hardener and an additive. (a) All of the materials contain ≤0.1 wt.% of halogen and antimony compounds. (b) At least one of the hardeners is a polycondensation product of a phenol, a compound having a triazine ring (except for benzoguanamine) and an aldehyde, a modified phenolic resin soluble in methyl ethyl ketone up to 80 wt.% of the solid and mixed with a novolac resin of a phenol. (c) The composition contains an additive having a function of assisting the flame-retardance. The prepreg and the laminate for an electric wiring board are prepared using the composition.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种耐高温，耐追溯，安全，阻燃性优异的环氧树脂组合物和预浸料，以及使用该组合物的电气布线板的层压体。解决方案：阻燃性非卤素环氧树脂组合物由环氧树脂，硬化剂和添加剂组成。（a）所有材料含有≤0.1重量％的卤素和锑化合物。（b）至少一种硬化剂是苯酚，具有三嗪环的化合物（苯并胍胺除外）和醛的缩聚产物，可溶于甲基乙基酮的改性酚醛树脂，至多80重量％的固体并与苯酚的酚醛清漆树脂混合。（c）组合物含有具有辅助阻燃功能的添加剂。使用该组合物制备预浸料和用于电气布线板的层压材料。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JPH11279378A Fire-retarding non-halogen epoxy resin composition, prepreg using the same, and laminated board for electric wiring board 失效
标题翻译：阻燃非卤化物环氧树脂组合物，使用其的PREPREG和用于电力布线板的层压板
公开(公告)号：JPH11279378A
公开(公告)日：1999-10-12
申请号：JP8516898
申请日：1998-03-31
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： OHORI KENICHI , NAKAMURA YOSHIHIRO , IKEDA KENICHI
IPC分类号： H05K1/03 , C08G59/40 , C08L63/00
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin composition comprising non-halogen and non- antimony compounds which shows heat resistance, tracking resistance, high safety and excellent fire retardation, and a prepreg using the same, and a laminated board for an electric wiring board.
SOLUTION: The fire retarding non-halogen and non-antimony epoxy resin composition comprises epoxy resins, hardening agents and additives, each material containing not more than 0.1 wt.% of a halogen and an antimony, (a) at least one epoxy resin being an epoxy resin having both an oxazoline ring and an epoxy group in a skeleton of a molecule, (b) at least one hardening agent being phenols, a compound having a triazine ring or a modified phenol resin from a polycondensation compound of aldehydes dissolved in a methylethylketone in a solid content of not more than 80 wt.%, (c) the additives including an additive showing an auxiliary fire retarding effect. The laminated board for an electric wiring board is obtained by the impregnating the resin composition as a varnish in a substrate, drying thereof to obtain a pre-preg, laminating metal foil on one side or both side of at least one pre-preg and forming thereof under heat and pressure.
COPYRIGHT: (C)1999,JPO
摘要翻译：要解决的问题：提供一种包含耐热性，耐追踪性，高安全性和优异的阻燃性的非卤素和非锑化合物的环氧树脂组合物和使用该环氧树脂的预浸料，以及用于电线的层压板板。解决方案：阻燃非卤素和非锑环氧树脂组合物包含环氧树脂，硬化剂和添加剂，每种材料含有不超过0.1重量％的卤素和锑，（a）至少一种环氧树脂为在分子骨架中具有恶唑啉环和环氧基的环氧树脂，（b）至少一种固化剂是酚类，具有三嗪环的化合物或改性酚醛树脂，所述缩醛化合物溶于甲基乙基酮，固含量不超过80重量％，（c）添加剂包括显示辅助阻燃效果的添加剂。通过将树脂组合物作为清漆浸渍在基材中，进行干燥而获得预浸料，在至少一个预浸料的一面或两面层压金属箔，形成电子布线板的层压板在热和压力下。

4. 发明专利

JP2007302904A Flame-retardant halogen-free epoxy resin composition, prepreg using the same and laminated plate for electric wiring board 审中-公开
标题翻译：阻燃无卤素环氧树脂组合物，使用它们的PREPREG和用于电线的层压板
公开(公告)号：JP2007302904A
公开(公告)日：2007-11-22
申请号：JP2007208462
申请日：2007-08-09
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： OHORI KENICHI , IKEDA KENICHI
IPC分类号： C08G59/62 , C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin composition that has excellent heat resistance, anti-tracking property, high safety and flame retardancy, and provide prepreg and laminated plate for electric wire board using the same.
SOLUTION: In an epoxy resin composition composed of epoxy resin, curing agent and additives, (a) the contents of halogen and antimony compounds are less than 0.1 wt.% in all of the materials, (b) at least one of the curing agent is a modified phenol resin being a polycondensate of a compound containing phenols and triazine ring and aldehyde and is dissolved in methyl ethyl ketone by less than 80 wt.% of solid component and additively, a novolac resin of phenols is mixed and (c) a flame-retardation-assisling action-having additive is included in this non-halogen epoxy resin composition (wherein the resin composition for sealing semiconductor is excluded). Further, the prepregs and laminated plate for electric wiring board using the non-halogen flame-retardant epoxy resin are provided.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有优异的耐热性，抗追踪性，高安全性和阻燃性的环氧树脂组合物，并提供使用该环氧树脂组合物的电线板的预浸料和层压板。解决方案：在由环氧树脂，固化剂和添加剂组成的环氧树脂组合物中，（a）卤素和锑化合物的含量在所有材料中小于0.1重量％，（b）至少一个固化剂是改性酚醛树脂，其是含酚和三嗪环和醛的化合物的缩聚物，并且通过少于80重量％的固体组分溶解在甲基乙基酮中，并且相加地，将酚醛清漆树脂混合（ c）在该无卤素环氧树脂组合物（其中不包括半导体密封用树脂组合物）中包含具有阻燃作用的添加剂。此外，提供了使用非卤素阻燃环氧树脂的电路板的预浸料和层压板。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JPH11281600A Flame retardation evaluation method 失效
标题翻译：阻燃评估方法
公开(公告)号：JPH11281600A
公开(公告)日：1999-10-15
申请号：JP8762898
申请日：1998-03-31
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： IKEDA KENICHI , NARABE YOSHIYUKI , SATO YOSHINORI
IPC分类号： G01N25/50 , G01N33/44
摘要： PROBLEM TO BE SOLVED: To quickly evaluate a lamination plate with less number of test pieces, by counting a weight change when the test pieces are exposed to flame.
SOLUTION: An initial test piece weight W
0 is measured. Then, the test piece is mounted to a retaining tool and then is exposed to the flame of a gas burner for a specific amount of time. Then, the flame of the gas burner is removed, temperature is cooled to a room temperature, a weight W of the test piece is measured, and flame exposure time is recorded. The test piece is mounted to the retaining tool again and is exposed to the flame of the gas burner for a specific amount of time. Then, the gas burner is removed, temperature is cooled to a room temperature, the weight of the test piece is measured, and the total flame exposure time up to this point is measured. It is repeated for a required number of times, and obtained data are inputted to an expression W/W
0 =exp (-βt) (W
0 : initial test piece weight, where w: test piece weight after exposure to flame, t: flame exposure time) to obtain β. When β is small, it is judged that fire retardation property is appropriate.
COPYRIGHT: (C)1999,JPO
摘要翻译：要解决的问题：通过计数试件暴露于火焰时的重量变化，快速评估具有较少试件数量的层压板。解决方案：测量初始试件重量W0。然后，将试件安装到保持工具上，然后暴露于气体燃烧器的火焰一段特定的时间。然后，除去气体燃烧器的火焰，将温度冷却至室温，测定试验片的重量W，记录火焰曝光时间。试件再次安装在固定工具上并暴露于气体燃烧器的火焰一段特定的时间。然后，将气体燃烧器取出，将温度冷却至室温，测定试验片的重量，测定直至该点的总火焰暴露时间。将其重复所需次数，并将得到的数据输入到表达式W / W0 = exp（-βt）（W0：初始试样重量，其中w：暴露于火焰后的试件重量，t：火焰暴露时间）获得β。当β小时，判断为阻燃性为宜。

6. 发明专利

JP2012229363A Thermosetting resin composition and prepreg, laminate board and circuit board using the same 有权
标题翻译：热固性树脂组合物和PREPREG，层压板和使用它的电路板
公开(公告)号：JP2012229363A
公开(公告)日：2012-11-22
申请号：JP2011099681
申请日：2011-04-27
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： KYO TAMAKA , AKIYAMA MASANORI , IKEDA KENICHI , SHIMIZU HIROSHI
IPC分类号： C08G59/50 , B32B15/08 , B32B27/38 , C08J5/24
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition free of halogen, and small in fluctuation of relative permittivity and dielectric loss tangent; and to provide a prepreg, laminate board and circuit board each using the composition.SOLUTION: This thermosetting composition includes: (A) an aluminum salt of diethylphosphinic acid having a structure represented by general formula (1) and an average particle diameter of 0.5-3 μm; (B) a maleimide compound having an N-substituted maleimide group in the molecule; (C) a curing agent comprising a 6-substituted guanamine compound or dicyandiamide; and (D) an epoxy resin having at least two epoxy groups in one molecule (in formula, Rrepresents a phenyl, methyl, butyl, allyl, methoxy or benzyloxy group). The prepreg, laminate board and circuit board each using the composition are provided.
摘要翻译：要解决的问题：提供不含卤素的热固性树脂组合物，相对介电常数和介电损耗角正切的波动小; 并且提供每个使用该组合物的预浸料，层压板和电路板。该热固性组合物包括：（A）具有由通式（1）表示的结构且平均粒径为0.5-3μm的二乙基次膦酸的铝盐; （B）分子中具有N-取代马来酰亚胺基团的马来酰亚胺化合物; （C）包含6-取代的胍胺化合物或双氰胺的固化剂; 和（D）在一个分子中具有至少两个环氧基的环氧树脂（式中，R“表示苯基，甲基，丁基，烯丙基，甲氧基或苄氧基）。提供各自使用组合物的预浸料，层合板和电路板。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JPS6178840A Production of flame-retardant laminated sheet 失效
标题翻译：阻燃层压板的生产
公开(公告)号：JPS6178840A
公开(公告)日：1986-04-22
申请号：JP20109684
申请日：1984-09-26
申请人： Hitachi Chem Co Ltd
发明人： NAKAMURA YOSHIHIRO , YOKOTA MITSUO , IKEDA KENICHI , NANAUMI KEN , OGI SHINJI
IPC分类号： C09K21/12 , B32B7/02 , B32B38/00 , C08J5/24 , C08K5/00 , C08K5/52 , C08L67/00
摘要： PURPOSE: To produce the titled laminated sheet having excellent flame retardance and moisture resistance, by impregnating a pretreating varnish- impregnated substrate with a thermosetting resin and carrying out molding.
CONSTITUTION: 1W4mol of phosphate or phosphite of formula I and/or II (wherein R
1 WR
3 are each alkyl, aryl) and 1W3mol of a polyhydric phenol (e.g. bisphenol A) are subjected to an ester exchange reaction at 100°C or above. The reaction product is added to a thermosetting resin (e.g. phenolic resin) to obtain varnish for pretreatment. A substrate such as paper, cloth or glass- mixed paper is impregnated with said varnish and then with a predetermined quantity of a thermosetting resin as varnish for after-treatment. Predetermined sheets of the substrates are laminated under pressure with heating to obtain a laminated sheet.
COPYRIGHT: (C)1986,JPO&Japio
摘要翻译：目的：制造具有优异的阻燃性和耐湿性的标准层合片，通过用热固性树脂浸渍预浸漆清洗基材并进行成型。构成：将1-4mol式I和/或II（其中R1-R3各自为烷基，芳基）和1-3mol多元酚（例如双酚A）的磷酸酯或亚磷酸酯在100度下进行酯交换反应 .C以上。将反应产物加入到热固性树脂（例如酚醛树脂）中以获得用于预处理的清漆。将诸如纸，布或玻璃混合纸的基材用所述清漆浸渍，然后用预定量的热固性树脂作为后处理用清漆浸渍。将预定片材的基材在加压下层压，得到层压片材。

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