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1. 发明专利

JP2012084923A Wiring plate for a composite material and a method of manufacturing the same 审中-公开
标题翻译：接线板复合材料及其制造方法
公开(公告)号：JP2012084923A
公开(公告)日：2012-04-26
申请号：JP2012010290
申请日：2012-01-20
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： BABA AKIO , TAKANO MARE , MADARAME TAKESHI , SAITO TETSUYA
IPC分类号： H05K1/03 , B32B15/08 , B32B18/00
摘要： PROBLEM TO BE SOLVED: To provide a new composite material for a wiring board which has superior heat resistance, moisture resistance and electric corrosion resistance, and also has both superior low stress properties and low coefficient of thermal expansion, in order to provide a composite material including insulation material having advantages of both inorganic material and organic material.SOLUTION: A composite material for a wiring board comprises a layer of inorganic material and a resin layer. In the composite material, difference of coefficient of thermal expansion between the inorganic material and resin is 10×10/°C or less.
摘要翻译：要解决的问题：为了提供具有优异的耐热性，耐湿性和耐电蚀性的布线板的新型复合材料，并且还具有优异的低应力性能和低的热膨胀系数，以提供包括具有无机材料和有机材料的优点的绝缘材料的复合材料。解决方案：一种用于布线板的复合材料包括无机材料层和树脂层。在复合材料中，无机材料与树脂之间的热膨胀系数差为10×10 -6 /℃以下。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2012054464A Multilayer printed wiring board, method of manufacturing the same, prepreg, metal foil with resin, resin film, and metal foil-clad laminate 有权
标题翻译：多层印刷线路板，其制造方法，PREPREG，具有树脂的金属箔，树脂膜和金属箔层压板
公开(公告)号：JP2012054464A
公开(公告)日：2012-03-15
申请号：JP2010196910
申请日：2010-09-02
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANO MARE , IIJIMA TOSHIYUKI , TANAKA MASASHI , OBATA KAZUHITO , TAKEUCHI KAZUMASA
IPC分类号： H05K3/46 , C08J5/24
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board capable of suppressing rising of a resistance value of an interlayer connection even if a bending part is provided to a region containing a through hole.SOLUTION: The multilayer printed wiring board includes a circuit board which includes a first insulating layer 100 comprising a cured resin originating from a first thermosetting resin, and a metal foil with a thickness of 1-35 μm arranged on both surfaces of the first insulating layer; and which is formed with a through hole 20 mutually connecting the metal foils arranged on both surfaces of a circuit layer 26 comprising the metal foil and the first insulating layer 100. The multilayer printed wiring board also includes a second insulating layer 200 which is provided at least on one surface of the circuit board, and has a thickness of 80 μm or less, comprising a cured resin originating from a second thermosetting resin which is at least one kind selected from a glycidyl acrylate resin and a polyamide imide resin. A bending part is provided to a region where the circuit board and the second insulating layer 200 are stacked.
摘要翻译：解决的问题：即使在包含通孔的区域设置弯曲部，也能够提供能够抑制层间连接的电阻值上升的多层印刷电路板。解决方案：多层印刷线路板包括电路板，该电路板包括第一绝缘层100，第一绝缘层100包括源自第一热固性树脂的固化树脂和布置在第二热固性树脂的两个表面上的厚度为1-35μm的金属箔第一绝缘层; 并且其形成有相互连接布置在包括金属箔的电路层26的两个表面上的金属箔和第一绝缘层100的通孔20.多层印刷线路板还包括第二绝缘层200，其设置在至少在电路板的一个表面上，并且具有80μm或更小的厚度，包括源自选自丙烯酸缩水甘油酯树脂和聚酰胺酰亚胺树脂中的至少一种的第二热固性树脂的固化树脂。将弯曲部设置在层叠电路基板和第二绝缘层200的区域。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2012031431A Thermosetting resin composition and method of producing the same 审中-公开
标题翻译：热固性树脂组合物及其制备方法
公开(公告)号：JP2012031431A
公开(公告)日：2012-02-16
申请号：JP2011242269
申请日：2011-11-04
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANO MARE , MIYAUCHI KAZUHIRO , BABA AKIO
IPC分类号： C08L63/00 , C08G59/62
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin composition which is excellent toughness in a high temperature without lowering excellent heat resistance or formability in a thermosetting resin, especially in an epoxy resin.SOLUTION: A thermosetting resin composition comprises (a) an epoxy resin, (b) a curing agent, and (c) a silicone polymer containing bifunctional siloxane units represented by formula RSiOin the molecule (wherein, R is equal or different organic group) as essential components.
摘要翻译：要解决的问题：提供一种环氧树脂组合物，其在高温下具有优异的韧性，而不降低热固性树脂，特别是在环氧树脂中的优异的耐热性或成形性。解决方案：热固性树脂组合物包含（a）环氧树脂，（b）固化剂，和（c）含有由式R 2表示的双官能硅氧烷单元的硅氧烷聚合物，分子（其中，R为相同或不同的有机基团）中的SB> SiO 2/2 作为必要成分。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2012025161A Metal foil with resin 审中-公开
标题翻译：金属箔与树脂
公开(公告)号：JP2012025161A
公开(公告)日：2012-02-09
申请号：JP2011170438
申请日：2011-08-03
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANO MARE , OBATA KAZUHITO , MATSUURA YOSHITSUGU , TANAKA MASASHI
IPC分类号： B32B15/092 , B32B15/08 , C08G59/40 , C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board having sufficient adhesiveness between wiring and a substrate and sufficient heat resistance and to provide metal foil with a resin using a curable resin composition which can form a prepreg having sufficiently suppressed breakages or cracks.SOLUTION: The metal foil with the resin includes a resin film comprising the curable resin composition and the metal foil arranged on at least one surface of the resin film. The curable resin composition contains a component (a): an acrylic polymer having a monomer unit derived from glycidyl (meth)acrylate, a component (b): an epoxy resin, a component (c): a phenolic resin, a component (d): a curing promotor, and a component (e): one or more thiol compounds selected from the group comprising alkyl thiols, phenyl thiols and thiol-based coupling agents.
摘要翻译：要解决的问题：提供一种印刷线路板，其在布线和基板之间具有足够的粘合性并具有足够的耐热性，并且可以使用可以形成具有充分抑制断裂或裂纹的预浸料的可固化树脂组合物来提供金属箔的树脂。解决方案：具有树脂的金属箔包括包含可固化树脂组合物和布置在树脂膜的至少一个表面上的金属箔的树脂膜。固化性树脂组合物含有成分（a）：具有源自（甲基）丙烯酸缩水甘油酯的单体单元的丙烯酸类聚合物，成分（b）：环氧树脂，（c）成分：酚醛树脂，成分（d ）：固化促进剂和组分（e）：一种或多种选自包括烷基硫醇，苯基硫醇和硫醇基偶联剂的硫醇化合物。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2011109122A Method for manufacturing multilayer printed wiring board 审中-公开
标题翻译：制造多层印刷线路板的方法
公开(公告)号：JP2011109122A
公开(公告)日：2011-06-02
申请号：JP2011002265
申请日：2011-01-07
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANO MARE , TAKEUCHI KAZUMASA , MASUDA KATSUYUKI , TANAKA MASASHI , OBATA KAZUHITO , OYAMA YUJI , MATSUURA YOSHITSUGU
IPC分类号： H05K3/46 , H05K1/03
CPC分类号： B32B27/04 , B29K2105/0872 , H05K1/0366 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/53883
摘要： PROBLEM TO BE SOLVED: To provide a prepreg for a printed wiring board and a metal foil clad laminate that have a small water absorption rate and size variation rate, and exhibit superior bending characteristics when the printed wiring board is molded, and to provide a method for manufacturing a multilayer printed wiring board using them. SOLUTION: The method for manufacturing the multilayer printed wiring board in which the prepreg for the printed wiring board is arranged on a surface of the printed wiring board, a metal foil or a metal foil clad laminate is arranged on a surface of the prepreg for the printed wiring board, and heating and pressing are carried out is characterized in that at least one or more of printed wiring boards is larger than the prepreg for the printed wiring board, and the amount of a resin oozing from the prepreg for the printed wiring board is ≤3 mm under heating and pressing conditions of ≤250°C and ≤10 MPa. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种具有小的吸水率和尺寸变化率的印刷线路板和金属箔覆层压板的预浸料，并且当印刷线路板被模制时表现出优异的弯曲特性，并且提供一种使用它们制造多层印刷线路板的方法。解决方案：制造多层印刷线路板的方法，其中印刷线路板的预浸料布置在印刷线路板的表面上，金属箔或金属箔覆层压板布置在印刷电路板的预浸料坯和加热和压制的特征在于，至少一个或多个印刷电路板比印刷电路板的预浸料坯大，并且从预浸料坯渗出的树脂的量印刷线路板在≤250°C和≤10MPa的加热和压制条件下≤3mm。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2011099113A Incombustible resin composition, and prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring board using the same 审中-公开
标题翻译：不锈钢树脂组合物和PREPREG，层压板，金属层压板，印刷线路板和多层印刷线路板
公开(公告)号：JP2011099113A
公开(公告)日：2011-05-19
申请号：JP2011011971
申请日：2011-01-24
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANO MARE , FUKUDA TOMIO , MIYATAKE MASATO
IPC分类号： C08K3/22 , C08L83/04 , B32B15/08 , B32B27/00 , B32B27/04 , B32B27/38 , C08J5/24 , C08K9/06 , C08K13/02 , C08L63/00 , H01L23/14 , H01L23/29 , H05K1/03
CPC分类号： B32B15/08 , C08K9/06 , H01L23/145 , H01L23/296 , H01L2924/0002 , H05K1/0373 , H05K2201/012 , H05K2201/0162 , H05K2201/0209 , Y10S428/901 , Y10T428/31511 , Y10T428/31515 , Y10T428/31522 , Y10T428/31663 , Y10T428/31721 , Y10T428/31862 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To manufacture a prepreg, a laminated plate, a copper-clad laminated plate, a printed wiring board, a multilayer wiring board, or the like, which exerts excellent flame retardance without heeding a bromine-containing material, and attains high heat resistance. SOLUTION: The incombustible resin composition includes a silicone polymer, a metal hydrate and a resin material as essential components, in which the metal hydrate is 20 wt.% or more in the total solids of the resin composition. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了制造在不注意含溴材料的情况下发挥优异的阻燃性的预浸料，层压板，覆铜层压板，印刷线路板，多层布线板等，，达到高耐热性。解决方案：不可燃树脂组合物包括硅树脂聚合物，金属水合物和作为必需组分的树脂材料，其中金属水合物在树脂组合物的总固体中为20重量％以上。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2010251783A Substrate for mounting semiconductor and semiconductor package 审中-公开
标题翻译：用于安装半导体和半导体封装的基板
公开(公告)号：JP2010251783A
公开(公告)日：2010-11-04
申请号：JP2010135506
申请日：2010-06-14
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： BABA AKIO , TAKANO MARE , MADARAME TAKESHI , SAITO TETSUYA
IPC分类号： H01L23/14 , H01L23/12 , H05K1/03
CPC分类号： H01L24/73 , H01L2224/32225 , H01L2224/45 , H01L2224/45015 , H01L2224/45144 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2224/83191 , H01L2224/92247 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/20752 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a small-sized semiconductor package having excellent advantage for reduction in size and high packing density and assuring excellent reliability by preventing reflow crack and also provide a substrate for mounting semiconductor that can be used for the semiconductor package and a method of manufacturing these semiconductor package and substrate. SOLUTION: The substrate for mounting semiconductor is constituted with an insulating substrate material 1 and a conductor pattern. When the insulating substrate material 1 is formed of resin having the post-hardening thermal expansion coefficient of 50×10 -6 /°C or less, reflow crack can be prevented because difference between the thermal expansion coefficients of a semiconductor chip 6 and the insulating substrate material 1 is small. In addition, when the insulating substrate material 1 is used for a semiconductor substrate, reflow crack does not occur, even if a vent-hole is not provided. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种小尺寸半导体封装，其具有优异的小尺寸和高封装密度的优点，并且通过防止回流裂纹确保优异的可靠性，并且还提供用于安装可用于半导体的半导体的基板封装和制造这些半导体封装和衬底的方法。解决方案：用于安装半导体的基板由绝缘基板材料1和导体图案构成。当绝缘基板材料1由后固化热膨胀系数为50×10 -6 /℃以下的树脂形成时，可以防止回流裂纹，因为热膨胀系数半导体芯片6和绝缘基板材料1小。此外，当半导体衬底使用绝缘衬底材料1时，即使没有设置通气孔，也不会发生回流裂纹。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2008179819A Flame-retardant resin composition, prepreg using it, laminated board, metal-clad laminated board, printed wiring board and multi-layer printed wiring board 有权
标题翻译：阻燃树脂组合物，使用它的复合板，层压板，金属层压板，印刷线路板和多层印刷线路板
公开(公告)号：JP2008179819A
公开(公告)日：2008-08-07
申请号：JP2008004770
申请日：2008-01-11
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANO MARE , FUKUDA TOMIO , MIYATAKE MASATO
IPC分类号： C08K3/22 , C08L83/04 , B32B15/08 , B32B27/00 , B32B27/18 , C08J5/24 , C08K9/06 , C08K13/02 , C08L101/00 , H01L23/14 , H01L23/29 , H05K1/03
CPC分类号： B32B15/08 , C08K9/06 , H01L23/145 , H01L23/296 , H01L2924/0002 , H05K1/0373 , H05K2201/012 , H05K2201/0162 , H05K2201/0209 , Y10S428/901 , Y10T428/31511 , Y10T428/31515 , Y10T428/31522 , Y10T428/31663 , Y10T428/31721 , Y10T428/31862 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a prepreg, a laminated board, a metal-clad laminated board, a printed wiring board and a multi-layer printed wiring board or the like revealing a superior flame retardancy without needing a material containing bromine and realizing a high heat resistance. SOLUTION: The flame-retardant resin composition comprises a silicone polymer, a metal hydrate and a resin material as an indispensable component, in which the metal hydrate is incorporated at least 20 wt.% in the total solid component of the resin composition. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供预浸料，层压板，覆金属层压板，印刷线路板和多层印刷线路板等，显示出优异的阻燃性，而不需要含有溴的材料并实现高耐热性。解决方案：阻燃树脂组合物包含硅氧烷聚合物，金属水合物和树脂材料作为不可缺少的组分，其中金属水合物在树脂组合物的总固体组分中加入至少20重量％。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2008111188A Copper foil for printed circuit board 审中-公开
标题翻译：印刷电路板用铜箔
公开(公告)号：JP2008111188A
公开(公告)日：2008-05-15
申请号：JP2007247627
申请日：2007-09-25
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANO MARE , FUKUDA TOMIO , ARATA MICHITOSHI , TOMIOKA KENICHI
IPC分类号： C23C22/00 , H01B5/02 , H05K1/09 , H05K3/38
CPC分类号： C23C2222/20
摘要： PROBLEM TO BE SOLVED: To provide copper oil exhibiting excellent adhesion with a resin upon a fine circuit fabrication stage, multilayer forming or the like.
SOLUTION: The copper foil is obtained by treating the surface having an Rz of 3.7 μm in copper foil with a beforehand three-dimensionally crosslinked silicone oligomer. The copper foil is preferably treated with a silane coupling agent as well.
COPYRIGHT: (C)2008,JPO&INPIT

10. 发明专利

JP2006307067A Composite, prepreg, metal-clad laminated board, printed-wiring board and its manufacturing method 审中-公开
标题翻译：复合材料，PREPREG，金属层压板，印刷线路板及其制造方法
公开(公告)号：JP2006307067A
公开(公告)日：2006-11-09
申请号：JP2005133138
申请日：2005-04-28
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANO MARE , KAMIYA MASAMI
IPC分类号： C08J5/04 , B32B15/08 , C08L101/00 , H05K1/03 , H05K1/11 , H05K3/00 , H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a composite suitable for the manufacture of a multilayer substrate, which is hard to generate the falling-off of a resin cured product or a reinforcing base material even when the thickness reduction is carried out in forming a prepreg, an insulation layer and the like. SOLUTION: The composite 100 has a structure in which the fibrous sheet 101 is arranged in the resin composition 102. The composite 100 has the through holes 103. The cured product of the resin composition 102 has a storage modulus at 20°C of 100-2,000 MPa. COPYRIGHT: (C)2007,JPO&INPIT

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