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JP2012229363A Thermosetting resin composition and prepreg, laminate board and circuit board using the same 有权
标题翻译：热固性树脂组合物和PREPREG，层压板和使用它的电路板
公开(公告)号：JP2012229363A
公开(公告)日：2012-11-22
申请号：JP2011099681
申请日：2011-04-27
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： KYO TAMAKA , AKIYAMA MASANORI , IKEDA KENICHI , SHIMIZU HIROSHI
IPC分类号： C08G59/50 , B32B15/08 , B32B27/38 , C08J5/24
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition free of halogen, and small in fluctuation of relative permittivity and dielectric loss tangent; and to provide a prepreg, laminate board and circuit board each using the composition.SOLUTION: This thermosetting composition includes: (A) an aluminum salt of diethylphosphinic acid having a structure represented by general formula (1) and an average particle diameter of 0.5-3 μm; (B) a maleimide compound having an N-substituted maleimide group in the molecule; (C) a curing agent comprising a 6-substituted guanamine compound or dicyandiamide; and (D) an epoxy resin having at least two epoxy groups in one molecule (in formula, Rrepresents a phenyl, methyl, butyl, allyl, methoxy or benzyloxy group). The prepreg, laminate board and circuit board each using the composition are provided.
摘要翻译：要解决的问题：提供不含卤素的热固性树脂组合物，相对介电常数和介电损耗角正切的波动小; 并且提供每个使用该组合物的预浸料，层压板和电路板。该热固性组合物包括：（A）具有由通式（1）表示的结构且平均粒径为0.5-3μm的二乙基次膦酸的铝盐; （B）分子中具有N-取代马来酰亚胺基团的马来酰亚胺化合物; （C）包含6-取代的胍胺化合物或双氰胺的固化剂; 和（D）在一个分子中具有至少两个环氧基的环氧树脂（式中，R“表示苯基，甲基，丁基，烯丙基，甲氧基或苄氧基）。提供各自使用组合物的预浸料，层合板和电路板。版权所有（C）2013，JPO＆INPIT

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