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1. 发明申请

US20070040281A1 Semiconductor device and method of producing the same 审中-公开
标题翻译：半导体装置及其制造方法
公开(公告)号：US20070040281A1
公开(公告)日：2007-02-22
申请号：US11506517
申请日：2006-08-18
申请人： Hirokazu Nakayama , Akihiko Okubora , Yoichi Oya , Hirohito Miyazaki , Kris Baert , Ingrid De Wolf , Piet De Moor , Eric Beyne
发明人： Hirokazu Nakayama , Akihiko Okubora , Yoichi Oya , Hirohito Miyazaki , Kris Baert , Ingrid De Wolf , Piet De Moor , Eric Beyne
IPC分类号： H01L23/48 , H01L29/84 , H01L23/29 , H01L23/12
CPC分类号： B81B7/007 , B81B7/0041 , B81C2203/019 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/48091 , H01L2924/00014 , H01L2924/15311 , H01L2224/05599
摘要： To provide a semiconductor device configured that a micro device having a device substrate, a function element provided on the device substrate and having an oscillator or a movable part, first lands provided on a surface of the device substrate by being arranged on its outer circumference portion of the function element, and bumps provided to the first lands is mounted on the circuit board having second lands formed to correspond to the bumps, from the bump formation surface side, so that the bumps and the second lands are electrically connected; on which a sealing resin layer is formed to go round the outer circumference portion of the function element to fix connection portions of the bumps and the second lands, and to seal a clearance between the device substrate and the circuit board; and a cavity portion is formed between the function element and the circuit board.
摘要翻译：为了提供一种半导体器件，其被配置为具有器件基板的微器件，设置在器件基板上并具有振荡器或可移动部件的功能元件，首先通过布置在其外周部分上而设置在器件基板的表面上所述凸起和所述第二焊盘电连接，所述凸起和所述第二焊盘被电连接，所述凸起和所述第二焊盘被电连接到所述电路板上，所述电路板具有形成为与所述凸块相对应的第二焊盘，在其上形成密封树脂层以绕着功能元件的外周部分固定以固定凸块和第二焊盘的连接部分，并且密封装置基板和电路板之间的间隙; 并且在功能元件和电路板之间形成空腔部分。

2. 发明授权

US06714422B2 High frequency module device and method for its preparation 失效
标题翻译：高频模块装置及其制备方法
公开(公告)号：US06714422B2
公开(公告)日：2004-03-30
申请号：US09951148
申请日：2001-09-13
申请人： Akihiko Okubora , Tsuyoshi Ogawa , Hirokazu Nakayama , Yoichi Oya
发明人： Akihiko Okubora , Tsuyoshi Ogawa , Hirokazu Nakayama , Yoichi Oya
IPC分类号： H05K111
CPC分类号： H05K1/16 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01087 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , H03H3/00 , Y10T29/4913 , Y10T29/49155 , H01L2924/00012 , H01L2224/0401 , H01L2924/01033
摘要： A high frequency module device of a thin type, high precision and high functions in which the size and the cost of the package may be diminished. The module device includes a base substrate (2) and a high frequency device layer (4). The base substrate (2) is formed by forming a patterned wiring layer (9) on a first major surface (5a) of a core substrate (5) molded of an organic material exhibiting thermal resistance and high frequency characteristics. The uppermost layer of the base substrate (2) is planarized to form a high frequency device layer forming surface (3). The high frequency device layer portion (4) is formed on the high frequency device layer forming surface (3) by a thin film or thick film forming technique and includes intra-layer passive elements, made up of a resistor (27) and a capacitor (26). The passive elements are supplied with power or signals from the side base substrate.
摘要翻译：一种薄型，高精度和高功能的高频模块装置，其中包装的尺寸和成本可能减小。模块装置包括基底（2）和高频器件层（4）。通过在由耐热性和高频特性的有机材料成型的芯基板（5）的第一主表面（5a）上形成图案化的布线层（9）来形成基底基板（2）。将基底（2）的最上层平坦化，形成高频器件层形成面（3）。高频器件层部分（4）通过薄膜或厚膜形成技术形成在高频器件层形成表面（3）上，并且包括由电阻器（27）和电容器（26）。无源元件由侧基板提供电源或信号。

3. 发明授权

US06797890B2 High frequency module device and method for its preparation 失效
公开(公告)号：US06797890B2
公开(公告)日：2004-09-28
申请号：US10225800
申请日：2002-08-22
申请人： Akihiko Okubora , Tsuyoshi Ogawa , Hirokazu Nakayama , Yoichi Oya
发明人： Akihiko Okubora , Tsuyoshi Ogawa , Hirokazu Nakayama , Yoichi Oya
IPC分类号： H05K116
CPC分类号： H05K1/16 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01087 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , H03H3/00 , Y10T29/4913 , Y10T29/49155 , H01L2924/00012 , H01L2224/0401 , H01L2924/01033
摘要： A high frequency module device of a thin type, high precision and high functions in which the size and the cost of the package may be diminished. The module device includes a base substrate (2) and a high frequency device layer (4). The base substrate (2) is formed by forming a patterned wiring layer (9) on a first major surface (5a) of a core substrate (5) molded of an organic material exhibiting thermal resistance and high frequency characteristics. The uppermost layer of the base substrate (2) is planarized to form a high frequency device layer forming surface (3). The high frequency device layer portion (4) is formed on the high frequency device layer forming surface (3) by a thin film or thick film forming technique and includes intra-layer passive elements, made up of a resistor (27) and a capacitor (26). The passive elements are supplied with power or signals from the side base substrate.

4. 发明申请

US20060133764A1 Processing head for formation of mirror plane of optical waveguide sheet, processing apparatus, and method of forming mirror plane of optical waveguide 审中-公开
标题翻译：用于形成光波导片的镜面的加工头，加工装置以及形成光波导的镜面的方法
公开(公告)号：US20060133764A1
公开(公告)日：2006-06-22
申请号：US11281005
申请日：2005-11-17
申请人： Akihiko Okubora , Hirokazu Nakayama
发明人： Akihiko Okubora , Hirokazu Nakayama
IPC分类号： G02B6/00
CPC分类号： G02B6/43 , G02B6/13
摘要： An optoelectric device able to easily maintain a flexibility of a design so as to manage a design change and able to manage a production of a small amount and numerous varieties of products, and a method for the same, in which a processing head is provided at a top of a capillary unit, and a tip portion of the processing head has a first and a second planes crossing a symmetry axis of the processing head at an angle of 45° and crossing perpendicularly each other. The processing head is driven into an optical waveguide sheet in which an optical waveguide having a cladding and a core buried into the cladding is formed, at a position to be an end portion of the optical waveguide, so a shape of the first and the second planes is transferred at the end portion to form a mirror plane.
摘要翻译：一种光电器件，其能够容易地保持设计的灵活性，以便管理设计变化并且能够管理少量和多种产品的生产及其方法，其中处理头设置在毛细管单元的顶部和处理头的尖端部分具有第一和第二平面，该第一和第二平面以45°的角度与加工头部的对称轴线交叉并且彼此垂直交叉。将处理头驱动到光波导片中，在该光波导片中，在作为光波导的端部的位置处形成具有埋入包层中的包层和芯的光波导，因此第一和第二平面在端部转移以形成镜面。

5. 发明申请

US20070215913A1 Three-dimensional integrated device 失效
标题翻译：三维一体化设备
公开(公告)号：US20070215913A1
公开(公告)日：2007-09-20
申请号：US11715161
申请日：2007-03-07
申请人： Akihiko Okubora
发明人： Akihiko Okubora
IPC分类号： H01L29/80
CPC分类号： H01L25/0657 , H01L23/48 , H01L2225/06527 , H01L2225/06541 , H01L2225/06555 , H01L2924/0002 , H01P1/2005 , H01L2924/00
摘要： A three-dimensional integrated device includes at least two integrated circuit substrates laminated to each other, each of the integrated circuit substrates having at least one ground plane, at least one aperture provided at a desired location in the ground plane, the end of a microstrip line formed in a pair with the ground plane and placed in the aperture, and a transmitter and/or a receiver that is connected to the microstrip line and transmits and/or receives signals at a frequency substantially corresponding to the perimeter λ of the aperture. Each of the apertures in each of the integrated circuit substrates is superimposed on at least one of the apertures in the other integrated circuit substrates in the direction perpendicular to the ground planes, and the signals are transported in a contactless manner between the integrated circuit substrates through the apertures at a frequency substantially corresponding to the perimeter λ of the apertures.
摘要翻译：三维集成装置包括彼此层叠的至少两个集成电路基板，每个集成电路基板具有至少一个接地平面，设置在接地平面中的期望位置处的至少一个孔，微带的端部与接地平面成对配置并放置在孔中的线，以及发射器和/或接收器，其连接到微带线并以基本对应于孔的周长λ的频率发送和/或接收信号。每个集成电路基板中的每个孔径在垂直于接地平面的方向上叠加在其它集成电路基板中的至少一个孔中，并且信号以非接触方式在集成电路基板之间通过孔的频率基本上对应于孔的周长λ。

6. 发明授权

US06889155B2 High frequency module board device 失效
公开(公告)号：US06889155B2
公开(公告)日：2005-05-03
申请号：US10416683
申请日：2002-10-03
申请人： Tatsuya Ogino , Akihiko Okubora , Takayuki Hirabayashi , Takahiko Kosemura , Kuniyuki Hayashi
发明人： Tatsuya Ogino , Akihiko Okubora , Takayuki Hirabayashi , Takahiko Kosemura , Kuniyuki Hayashi
IPC分类号： H05K3/46 , H01F17/00 , H01L23/12 , H01L23/498 , H01L23/66 , H01P1/00 , H01P3/08 , H05K1/00 , H05K1/02 , H05K1/16 , H01L27/04
CPC分类号： H05K1/162 , H01F17/0006 , H01L23/49805 , H01L23/49822 , H01L23/66 , H01L24/48 , H01L2224/05599 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/45099 , H01L2224/48091 , H01L2224/85399 , H01L2924/00014 , H01L2924/01078 , H01L2924/01087 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19011 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H05K1/0224 , H05K1/024 , H05K1/0298 , H05K3/4688 , H05K2201/09672 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： The present invention relates to a high frequency module board device having a high frequency transmitting and receiving circuit for modulating and demodulating a high frequency signal. The high frequency module board device comprises a base board (2) whose main surface is formed as a build-up surface (2a) and a high frequency circuit part (3) formed on the build-up surface of the base board (2) and having passive elements formed. The base board (2) has an area (29) in which wiring is not formed in a lower layer from a fourth wiring layer (8b). The high frequency circuit part (3) has an upper electrode part (36) and a lower electrode part (35) in positions corresponding to the area (29) in which the wiring is not formed. Thus, since a capacitance (18) is provided just above the area (29) in which the wiring is not formed, a parasitic capacity that the capacitance (18) receives from ground patterns (14) is reduced. Accordingly, the characteristics of the capacitance (18) can be improved.

7. 发明授权

US06831357B2 Circuit substrate device, method for producing the same, semiconductor device and method for producing the same 有权
公开(公告)号：US06831357B2
公开(公告)日：2004-12-14
申请号：US10397608
申请日：2003-03-26
申请人： Yuji Nishitani , Tsuyoshi Ogawa , Hiroshi Asami , Akihiko Okubora
发明人： Yuji Nishitani , Tsuyoshi Ogawa , Hiroshi Asami , Akihiko Okubora
IPC分类号： H01L2348
CPC分类号： H01L21/6835 , H01L21/4857 , H01L23/49833 , H01L2221/68345 , H01L2221/68359 , H01L2224/16 , H01L2924/01078 , H01L2924/01087 , H01L2924/09701 , H01L2924/19041 , H05K3/0052 , H05K3/20 , H05K3/4602 , H05K3/4614 , H05K3/467 , H05K3/4682 , H05K3/4694 , H05K2201/0352 , H05K2201/09536 , H05K2203/061
摘要： A circuit substrate device composed of a circuit unit 2 and a multi-layer wiring substrate 3 in which a pattern conductor of the circuit unit 2 may be prevented from being warped or inundated. The circuit substrate device includes a circuit unit 2 having a pattern conductor formed by a thin film technique, and an insulating layer, and a multi-layer wiring substrate 3 having a connecting terminal portion 14 exposed from its major surface. The circuit unit is formed on a dummy substrate. The circuit unit is connected to the multi-layer wiring substrate 3 so that the pattern conductor is connected to the connecting terminal portion 14. The dummy substrate is then removed to give a structure comprised of the circuit unit 2 formed on the multi-layer wiring substrate 3. The pattern conductor of the circuit unit 2 is freed of warping or inundations along the direction of thickness of the circuit unit 2.

8. 发明授权

US06803324B2 Semiconductor device and its manufacturing method 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US06803324B2
公开(公告)日：2004-10-12
申请号：US10240330
申请日：2003-03-06
申请人： Tsuyoshi Ogawa , Yuji Nishitani , Akihiko Okubora
发明人： Tsuyoshi Ogawa , Yuji Nishitani , Akihiko Okubora
IPC分类号： H01L21469
CPC分类号： H05K3/4682 , H01L21/4846 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81005 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/1531 , H01L2924/18161 , H01L2924/19105 , H01L2924/19106 , H01L2924/3025 , H05K1/0237 , H05K1/0306 , H05K1/0313 , H05K1/095 , H05K1/16 , H05K1/162 , H05K1/165 , H05K1/167 , H05K1/183 , H05K3/0052 , H05K3/20 , H05K3/205 , H05K3/4605 , H05K3/4614 , H05K3/4644 , H05K3/467 , H05K3/4688 , H05K2201/09509 , H05K2201/09763 , H05K2203/016 , H05K2203/061 , H05K2203/1189 , H01L2924/00
摘要： A wiring circuit block is produced by forming a release layer on one of planarized principal surfaces of a mother substrate, forming an insulating layer on the release layer, patterning the insulating layer and forming a wiring layer on the patterned insulating layer, and separating the insulating layer and wiring layer from the release layer on the mother substrate. The circuit block has components, and deposited on the wiring layer, and is mounted on a base circuit board to provide a wiring device. Also, semiconductor chips are mounted on the circuit block, and the circuit block is mounted on a base circuit board to provide a semiconductor device.
摘要翻译：通过在母基板的平坦化主面之一上形成剥离层，在剥离层上形成绝缘层，对绝缘层进行图案化，在图案化绝缘层上形成布线层，分离绝缘层而制造布线电路块层和布线层从母基板上的释放层。电路块具有部件并且沉积在布线层上，并且安装在基板电路板上以提供布线装置。此外，半导体芯片安装在电路块上，并且电路块安装在基极电路板上以提供半导体器件。

9. 发明授权

US06753815B2 Antenna device 失效
公开(公告)号：US06753815B2
公开(公告)日：2004-06-22
申请号：US10275244
申请日：2003-01-16
申请人： Akihiko Okubora , Takayuki Hirabayashi , Norikazu Nakayama , Hiroyuki Arai
发明人： Akihiko Okubora , Takayuki Hirabayashi , Norikazu Nakayama , Hiroyuki Arai
IPC分类号： H01Q138
CPC分类号： H01Q9/14 , H01Q1/243 , H01Q1/36 , H01Q1/38 , H01Q9/0407 , H01Q9/0442 , H01Q21/30
摘要： The present invention is an antenna apparatus attached to an electronic device and includes an antenna section (11) having an antenna element (18) provided with two or more power supply points (19) and two or more earth points (20); and an earth point switch (21) which is provided correspondingly to each earth point (20) and connects or disconnects the earth point (20) from a ground. Selectively turning on or off the earth point switch (21) selects the earth point to adjust the resonance frequency.

10. 发明授权

US06528732B1 Circuit device board, semiconductor component, and method of making the same 失效
标题翻译：电路器件板，半导体元件及其制造方法
公开(公告)号：US06528732B1
公开(公告)日：2003-03-04
申请号：US09642498
申请日：2000-08-18
申请人： Akihiko Okubora , Takayuki Hirabayashi , Hideyuki Shikichi
发明人： Akihiko Okubora , Takayuki Hirabayashi , Hideyuki Shikichi
IPC分类号： H05K114
CPC分类号： H01P1/20327 , H01L23/642 , H01L23/66 , H01L2224/16 , H01L2924/00014 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/1305 , H01L2924/3011 , H01L2924/3025 , H01P1/2039 , H05K1/0237 , H05K3/4611 , Y10T29/49126 , H01L2924/00 , H01L2224/05599
摘要： A circuit device board having a desired characteristic is provided by bonding dielectric substrates. A printed board 11 carrying patterns 11a and 11b incorporating a resonator is joined by a prepreg 13 to a printed board 12 carrying patterns 12a and 12b, which are substantially identical to the patterns 11a and 11b, so that the patterns come opposite to each other. As a grounding conductor is provided on the outer side of each of the printed boards 11 and 12, a band-pass filter having the three-plate structure is completed. The patterns 11a and 12a are connected to each other for determining the signal input while the patterns 11b and 12b are connected to each other for determining the signal output. Accordingly, the frequency response can be obtained at a desired level regardless of the thickness of the prepreg 13.
摘要翻译：具有期望特性的电路器件板通过接合电介质基板而提供。一个载有图案11a和11b的共振器的印刷电路板11由预浸料13连接到承载图案12a和12b的印刷电路板12上，印刷电路板12基本上与图案11a和11b，使得图案彼此相反。由于在每个印刷电路板11和12的外侧设置接地导体，因此完成了具有三板结构的带通滤波器。图案11a和12a彼此连接以确定信号输入，同时图案11b和12b彼此连接以确定信号输出。因此，与预浸料13的厚度无关地，能够以所需的水平获得频率响应。

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