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1. 发明申请

US20070040281A1 Semiconductor device and method of producing the same 审中-公开
标题翻译：半导体装置及其制造方法
公开(公告)号：US20070040281A1
公开(公告)日：2007-02-22
申请号：US11506517
申请日：2006-08-18
申请人： Hirokazu Nakayama , Akihiko Okubora , Yoichi Oya , Hirohito Miyazaki , Kris Baert , Ingrid De Wolf , Piet De Moor , Eric Beyne
发明人： Hirokazu Nakayama , Akihiko Okubora , Yoichi Oya , Hirohito Miyazaki , Kris Baert , Ingrid De Wolf , Piet De Moor , Eric Beyne
IPC分类号： H01L23/48 , H01L29/84 , H01L23/29 , H01L23/12
CPC分类号： B81B7/007 , B81B7/0041 , B81C2203/019 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/48091 , H01L2924/00014 , H01L2924/15311 , H01L2224/05599
摘要： To provide a semiconductor device configured that a micro device having a device substrate, a function element provided on the device substrate and having an oscillator or a movable part, first lands provided on a surface of the device substrate by being arranged on its outer circumference portion of the function element, and bumps provided to the first lands is mounted on the circuit board having second lands formed to correspond to the bumps, from the bump formation surface side, so that the bumps and the second lands are electrically connected; on which a sealing resin layer is formed to go round the outer circumference portion of the function element to fix connection portions of the bumps and the second lands, and to seal a clearance between the device substrate and the circuit board; and a cavity portion is formed between the function element and the circuit board.
摘要翻译：为了提供一种半导体器件，其被配置为具有器件基板的微器件，设置在器件基板上并具有振荡器或可移动部件的功能元件，首先通过布置在其外周部分上而设置在器件基板的表面上所述凸起和所述第二焊盘电连接，所述凸起和所述第二焊盘被电连接，所述凸起和所述第二焊盘被电连接到所述电路板上，所述电路板具有形成为与所述凸块相对应的第二焊盘，在其上形成密封树脂层以绕着功能元件的外周部分固定以固定凸块和第二焊盘的连接部分，并且密封装置基板和电路板之间的间隙; 并且在功能元件和电路板之间形成空腔部分。

2. 发明申请

US20080182366A1 Hybrid module and method of manufacturing the same 失效
标题翻译：混合模块及其制造方法
公开(公告)号：US20080182366A1
公开(公告)日：2008-07-31
申请号：US12077486
申请日：2008-03-19
申请人： Tsuyoshi Ogawa , Hirokazu Nakayama , Hirohito Miyazaki , Namiko Takeshima
发明人： Tsuyoshi Ogawa , Hirokazu Nakayama , Hirohito Miyazaki , Namiko Takeshima
IPC分类号： H01L21/00
CPC分类号： H01L23/147 , G02B6/43 , H01L21/568 , H01L21/6835 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/82 , H01L25/0655 , H01L25/16 , H01L2224/05001 , H01L2224/05008 , H01L2224/05548 , H01L2224/12105 , H01L2224/24195 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/00
摘要： A hybrid module includes a silicon substrate having a plurality of part mounting openings formed therein, the plurality of part mounting openings composed of through holes, a plurality of mounted parts that are mounted in the part mounting openings such that input/output portion forming surfaces are substantially flush with a first main surface of the silicon substrate, a sealing layer that is formed of a sealing material filled into the part mounting openings and covers the mounted parts, with the input/output portion forming surfaces exposed from the first main surface of the silicon substrate, to fix the mounted parts in the part mounting openings, and a wiring layer that is formed on the first main surface of the silicon substrate, and has a wiring pattern connected to input/output portions that are provided on the input/output portion forming surfaces of the mounted parts exposed from the first main surface.
摘要翻译：混合模块包括具有形成在其中的多个部件安装开口的硅衬底，多个部件安装开口由通孔组成，多个安装部件安装在部件安装开口中，使得输入/输出部分形成表面为基本上与硅衬底的第一主表面齐平;密封层，其由填充到部件安装开口中的密封材料形成，并且覆盖安装部分，其中输入/输出部分形成表面从第一主表面露出硅基板，将安装部件固定在部件安装开口中;以及布线层，其形成在硅基板的第一主表面上，并且具有连接到设置在输入/输出端上的输入/输出部分的布线图案从第一主表面露出的安装部分的形成表面的部分。

3. 发明授权

US07915076B2 Hybrid module and method of manufacturing the same 失效
标题翻译：混合模块及其制造方法
公开(公告)号：US07915076B2
公开(公告)日：2011-03-29
申请号：US12077486
申请日：2008-03-19
申请人： Tsuyoshi Ogawa , Hirokazu Nakayama , Hirohito Miyazaki , Namiko Takeshima
发明人： Tsuyoshi Ogawa , Hirokazu Nakayama , Hirohito Miyazaki , Namiko Takeshima
IPC分类号： H01L21/00
CPC分类号： H01L23/147 , G02B6/43 , H01L21/568 , H01L21/6835 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/82 , H01L25/0655 , H01L25/16 , H01L2224/05001 , H01L2224/05008 , H01L2224/05548 , H01L2224/12105 , H01L2224/24195 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/00
摘要： A hybrid module includes a silicon substrate having a plurality of part mounting openings formed therein, the plurality of part mounting openings composed of through holes, a plurality of mounted parts that are mounted in the part mounting openings such that input/output portion forming surfaces are substantially flush with a first main surface of the silicon substrate, a sealing layer that is formed of a sealing material filled into the part mounting openings and covers the mounted parts, with the input/output portion forming surfaces exposed from the first main surface of the silicon substrate, to fix the mounted parts in the part mounting openings, and a wiring layer that is formed on the first main surface of the silicon substrate, and has a wiring pattern connected to input/output portions that are provided on the input/output portion forming surfaces of the mounted parts exposed from the first main surface.
摘要翻译：混合模块包括具有形成在其中的多个部件安装开口的硅衬底，多个部件安装开口由通孔组成，多个安装部件安装在部件安装开口中，使得输入/输出部分形成表面为基本上与硅衬底的第一主表面齐平;密封层，其由填充到部件安装开口中的密封材料形成，并且覆盖安装部分，其中输入/输出部分形成表面从第一主表面露出硅基板，将安装部件固定在部件安装开口中;以及布线层，其形成在硅基板的第一主表面上，并且具有连接到设置在输入/输出端上的输入/输出部分的布线图案从第一主表面露出的安装部分的形成表面的部分。

4. 发明申请

US20070080458A1 Hybrid module and method of manufacturing the same 审中-公开
标题翻译：混合模块及其制造方法
公开(公告)号：US20070080458A1
公开(公告)日：2007-04-12
申请号：US11528965
申请日：2006-09-27
申请人： Tsuyoshi Ogawa , Hirokazu Nakayama , Hirohito Miyazaki , Namiko Takeshima
发明人： Tsuyoshi Ogawa , Hirokazu Nakayama , Hirohito Miyazaki , Namiko Takeshima
IPC分类号： H01L23/48
CPC分类号： H01L23/147 , G02B6/43 , H01L21/568 , H01L21/6835 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/82 , H01L25/0655 , H01L25/16 , H01L2224/05001 , H01L2224/05008 , H01L2224/05548 , H01L2224/12105 , H01L2224/24195 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/00
摘要： A hybrid module includes a silicon substrate having a plurality of part mounting openings formed therein, the plurality of part mounting openings composed of through holes, a plurality of mounted parts that are mounted in the part mounting openings such that input/output portion forming surfaces are substantially flush with a first main surface of the silicon substrate, a sealing layer that is formed of a sealing material filled into the part mounting openings and covers the mounted parts, with the input/output portion forming surfaces exposed from the first main surface of the silicon substrate, to fix the mounted parts in the part mounting openings, and a wiring layer that is formed on the first main surface of the silicon substrate, and has a wiring pattern connected to input/output portions that are provided on the input/output portion forming surfaces of the mounted parts exposed from the first main surface.
摘要翻译：混合模块包括具有形成在其中的多个部件安装开口的硅衬底，多个部件安装开口由通孔组成，多个安装部件安装在部件安装开口中，使得输入/输出部分形成表面为基本上与硅衬底的第一主表面齐平;密封层，其由填充到部件安装开口中的密封材料形成，并且覆盖安装部分，其中输入/输出部分形成表面从第一主表面露出硅基板，将安装部件固定在部件安装开口中;以及布线层，其形成在硅基板的第一主表面上，并且具有连接到设置在输入/输出端上的输入/输出部分的布线图案从第一主表面露出的安装部分的形成表面的部分。

5. 发明申请

US20100244560A1 VEHICLE POWER SUPPLY SYSTEM 审中-公开
标题翻译：车辆电源系统
公开(公告)号：US20100244560A1
公开(公告)日：2010-09-30
申请号：US12713994
申请日：2010-02-26
申请人： Yoshihiro Sato , Kenichi Kessoku , Hirohito Miyazaki
发明人： Yoshihiro Sato , Kenichi Kessoku , Hirohito Miyazaki
IPC分类号： B60L1/00
CPC分类号： B60R16/03
摘要： A vehicle power supply system has a power supply unit for supplying power to each unit of a vehicle, a plurality of actuation units actuated by the power from the power supply unit, an operation unit arranged for each of the plurality of actuation units, and operated when actuating the corresponding actuation unit, and a control unit for performing a control of starting supply of power from the power supply unit to each of the plurality of actuation units according to the operation of the corresponding operation unit when an actuation condition of the actuation unit corresponding to the operation unit is satisfied.
摘要翻译：车辆电源系统具有用于向车辆的每个单元供电的电源单元，由来自电源单元的电力驱动的多个致动单元，为多个致动单元中的每一个而设置的操作单元，并且被操作当致动相应的致动单元时，以及控制单元，用于当致动单元的致动状态时根据相应的操作单元的操作进行控制，以从电源单元开始向多个致动单元中的每个致动单元对应于操作单元满足。

6. 发明授权

US10953795B2 Vehicle control device and vehicle control method 有权
公开(公告)号：US10953795B2
公开(公告)日：2021-03-23
申请号：US16816536
申请日：2020-03-12
申请人： Takashi Aragai , Hirohito Miyazaki
发明人： Takashi Aragai , Hirohito Miyazaki
IPC分类号： B60Q1/22 , B60Q9/00 , B60W40/12 , B60W40/08
摘要： A vehicle control device is configured to determine whether or not a living body is left behind in a vehicle. The vehicle control device includes an operation information acquisition unit that acquires first operation information indicating whether a first type of opening/closing unit related to getting-on/off of an occupant is operated and second operation information indicating whether a second type of opening/closing unit other than the first opening/closing unit is operated; a leaving determination unit that determines whether the living body is left behind with reference to the first operation information, and determines execution of a leaving alarm in a case where it is determined that the living body is left behind; and an execution holding unit which holds the execution of the leaving alarm in a case where the second operation information indicates that the second type of opening/closing unit is operated.

7. 发明申请

US20180252017A1 VEHICLE DOOR OPENING AND CLOSING CONTROL DEVICE 审中-公开
公开(公告)号：US20180252017A1
公开(公告)日：2018-09-06
申请号：US15885607
申请日：2018-01-31
申请人： Yoshie Hayashi , Hirohito Miyazaki , Kenshin Oh
发明人： Yoshie Hayashi , Hirohito Miyazaki , Kenshin Oh
IPC分类号： E05F15/73 , B60J5/10
CPC分类号： E05F15/73 , B60J5/10 , E05Y2400/858 , E05Y2900/546
摘要： A vehicle door opening and closing control device includes a sensor, a determining unit, and a controller. When after an output value of the sensor reaches a threshold, a period in which the output value of the sensor exceeds the threshold continues for not less than a fixed time, and then the output value of the sensor falls below the threshold, the determining unit compares a first output value of the sensor before the output value of the sensor exceeds the threshold and a second output value of the sensor after the output value of the sensor falls below the threshold. When both the first output value and the second output value satisfy a predetermined condition, the determining unit determines that a predetermined motion to be detected by the sensor is performed.

8. 发明申请

US20180163454A1 VEHICLE DOOR OPENING AND CLOSING CONTROL DEVICE 审中-公开
公开(公告)号：US20180163454A1
公开(公告)日：2018-06-14
申请号：US15842549
申请日：2017-12-14
申请人： Masayuki Motoki , Hirohito Miyazaki , Kenshin Oh
发明人： Masayuki Motoki , Hirohito Miyazaki , Kenshin Oh
IPC分类号： E05F15/655 , E05F15/73 , E05B83/36 , B60R25/01
CPC分类号： B60R25/01 , B60R25/2054 , E05B83/36 , E05F15/655 , E05F15/73 , E05F2015/765 , E05Y2400/858
摘要： A vehicle door opening and closing control device opens or closes a door of a vehicle according to a kicking motion of a leg detected by a kick sensor. A threshold is set for output from the kick sensor. Motion duration time until the output from the sensor falls below the threshold after the output from the sensor exceeds the threshold in a kicking motion is measured. Motion completion estimated time until the kicking motion is completed is calculated according to the motion duration time, for example, by assuming that motion completion estimated time=motion duration time/2. When the elapsed time after the output from the sensor falls below the threshold reaches the motion completion estimated time, opening operation or closing operation of the door starts.

9. 发明授权

US10065600B2 Vehicle door opening and closing control device 有权
公开(公告)号：US10065600B2
公开(公告)日：2018-09-04
申请号：US15842549
申请日：2017-12-14
申请人： Masayuki Motoki , Hirohito Miyazaki , Kenshin Oh
发明人： Masayuki Motoki , Hirohito Miyazaki , Kenshin Oh
IPC分类号： B60R25/00 , B60R25/01 , E05F15/655 , E05F15/73 , E05B83/36 , B60R25/20
CPC分类号： B60R25/01 , B60R25/2054 , E05B83/36 , E05F15/655 , E05F15/73 , E05F2015/765 , E05Y2400/858 , E05Y2900/548
摘要： A vehicle door opening and closing control device opens or closes a door of a vehicle according to a kicking motion of a leg detected by a kick sensor. A threshold is set for output from the kick sensor. Motion duration time until the output from the sensor falls below the threshold after the output from the sensor exceeds the threshold in a kicking motion is measured. Motion completion estimated time until the kicking motion is completed is calculated according to the motion duration time, for example, by assuming that motion completion estimated time=motion duration time/2. When the elapsed time after the output from the sensor falls below the threshold reaches the motion completion estimated time, opening operation or closing operation of the door starts.

10. 发明授权

US09308820B2 Power-supply control device 有权
标题翻译：电源控制装置
公开(公告)号：US09308820B2
公开(公告)日：2016-04-12
申请号：US13771903
申请日：2013-02-20
申请人： Takashi Aragai , Yusuke Ukai , Hirohito Miyazaki
发明人： Takashi Aragai , Yusuke Ukai , Hirohito Miyazaki
IPC分类号： B60L1/00 , B60L3/00 , H02G3/00 , B60R16/03
CPC分类号： B60L1/00 , B60R16/03
摘要： An electric power is surely supplied to a load even if an abnormality is generated in a switching control circuit, which controls a switching part that switches electric connection between a power supply and the load of a vehicle. The switching control circuit controls a state of a contact of a keep relay that switches the electric connection between the power supply and the load. A monitor circuit monitors existence or non-existence of the abnormality of the switching control circuit. When detecting the abnormality of the switching control circuit, the monitor circuit transmits a reset signal in order to reset a state of the switching control circuit. When receiving the reset signal from the monitor circuit, an abnormal-time connection circuit transmits a connection signal to a coil of the keep relay to bring a movable contact into contact with a contact. For example, the present invention can be applied to a power-supply control device for the vehicle.
摘要翻译：即使在切换控制电路中产生异常的电力被确实地供给负载，开关控制电路控制切换部件，其切换电源与车辆的负载之间的电连接。切换控制电路控制切换电源和负载之间的电连接的保持继电器的接触状态。监视器电路监视开关控制电路的异常的存在或不存在。当检测到开关控制电路的异常时，监视电路发送复位信号以复位开关控制电路的状态。当从监视电路接收到复位信号时，异常时间连接电路将连接信号发送到保持继电器的线圈，使可动触头与触点接触。例如，本发明可以应用于车辆的电源控制装置。

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