专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06714422B2 High frequency module device and method for its preparation 失效
标题翻译：高频模块装置及其制备方法
公开(公告)号：US06714422B2
公开(公告)日：2004-03-30
申请号：US09951148
申请日：2001-09-13
申请人： Akihiko Okubora , Tsuyoshi Ogawa , Hirokazu Nakayama , Yoichi Oya
发明人： Akihiko Okubora , Tsuyoshi Ogawa , Hirokazu Nakayama , Yoichi Oya
IPC分类号： H05K111
CPC分类号： H05K1/16 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01087 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , H03H3/00 , Y10T29/4913 , Y10T29/49155 , H01L2924/00012 , H01L2224/0401 , H01L2924/01033
摘要： A high frequency module device of a thin type, high precision and high functions in which the size and the cost of the package may be diminished. The module device includes a base substrate (2) and a high frequency device layer (4). The base substrate (2) is formed by forming a patterned wiring layer (9) on a first major surface (5a) of a core substrate (5) molded of an organic material exhibiting thermal resistance and high frequency characteristics. The uppermost layer of the base substrate (2) is planarized to form a high frequency device layer forming surface (3). The high frequency device layer portion (4) is formed on the high frequency device layer forming surface (3) by a thin film or thick film forming technique and includes intra-layer passive elements, made up of a resistor (27) and a capacitor (26). The passive elements are supplied with power or signals from the side base substrate.
摘要翻译：一种薄型，高精度和高功能的高频模块装置，其中包装的尺寸和成本可能减小。模块装置包括基底（2）和高频器件层（4）。通过在由耐热性和高频特性的有机材料成型的芯基板（5）的第一主表面（5a）上形成图案化的布线层（9）来形成基底基板（2）。将基底（2）的最上层平坦化，形成高频器件层形成面（3）。高频器件层部分（4）通过薄膜或厚膜形成技术形成在高频器件层形成表面（3）上，并且包括由电阻器（27）和电容器（26）。无源元件由侧基板提供电源或信号。

2. 发明授权

US06797890B2 High frequency module device and method for its preparation 失效
公开(公告)号：US06797890B2
公开(公告)日：2004-09-28
申请号：US10225800
申请日：2002-08-22
申请人： Akihiko Okubora , Tsuyoshi Ogawa , Hirokazu Nakayama , Yoichi Oya
发明人： Akihiko Okubora , Tsuyoshi Ogawa , Hirokazu Nakayama , Yoichi Oya
IPC分类号： H05K116
CPC分类号： H05K1/16 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01087 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , H03H3/00 , Y10T29/4913 , Y10T29/49155 , H01L2924/00012 , H01L2224/0401 , H01L2924/01033
摘要： A high frequency module device of a thin type, high precision and high functions in which the size and the cost of the package may be diminished. The module device includes a base substrate (2) and a high frequency device layer (4). The base substrate (2) is formed by forming a patterned wiring layer (9) on a first major surface (5a) of a core substrate (5) molded of an organic material exhibiting thermal resistance and high frequency characteristics. The uppermost layer of the base substrate (2) is planarized to form a high frequency device layer forming surface (3). The high frequency device layer portion (4) is formed on the high frequency device layer forming surface (3) by a thin film or thick film forming technique and includes intra-layer passive elements, made up of a resistor (27) and a capacitor (26). The passive elements are supplied with power or signals from the side base substrate.

3. 发明授权

US06831357B2 Circuit substrate device, method for producing the same, semiconductor device and method for producing the same 有权
公开(公告)号：US06831357B2
公开(公告)日：2004-12-14
申请号：US10397608
申请日：2003-03-26
申请人： Yuji Nishitani , Tsuyoshi Ogawa , Hiroshi Asami , Akihiko Okubora
发明人： Yuji Nishitani , Tsuyoshi Ogawa , Hiroshi Asami , Akihiko Okubora
IPC分类号： H01L2348
CPC分类号： H01L21/6835 , H01L21/4857 , H01L23/49833 , H01L2221/68345 , H01L2221/68359 , H01L2224/16 , H01L2924/01078 , H01L2924/01087 , H01L2924/09701 , H01L2924/19041 , H05K3/0052 , H05K3/20 , H05K3/4602 , H05K3/4614 , H05K3/467 , H05K3/4682 , H05K3/4694 , H05K2201/0352 , H05K2201/09536 , H05K2203/061
摘要： A circuit substrate device composed of a circuit unit 2 and a multi-layer wiring substrate 3 in which a pattern conductor of the circuit unit 2 may be prevented from being warped or inundated. The circuit substrate device includes a circuit unit 2 having a pattern conductor formed by a thin film technique, and an insulating layer, and a multi-layer wiring substrate 3 having a connecting terminal portion 14 exposed from its major surface. The circuit unit is formed on a dummy substrate. The circuit unit is connected to the multi-layer wiring substrate 3 so that the pattern conductor is connected to the connecting terminal portion 14. The dummy substrate is then removed to give a structure comprised of the circuit unit 2 formed on the multi-layer wiring substrate 3. The pattern conductor of the circuit unit 2 is freed of warping or inundations along the direction of thickness of the circuit unit 2.

4. 发明授权

US06803324B2 Semiconductor device and its manufacturing method 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US06803324B2
公开(公告)日：2004-10-12
申请号：US10240330
申请日：2003-03-06
申请人： Tsuyoshi Ogawa , Yuji Nishitani , Akihiko Okubora
发明人： Tsuyoshi Ogawa , Yuji Nishitani , Akihiko Okubora
IPC分类号： H01L21469
CPC分类号： H05K3/4682 , H01L21/4846 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81005 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/1531 , H01L2924/18161 , H01L2924/19105 , H01L2924/19106 , H01L2924/3025 , H05K1/0237 , H05K1/0306 , H05K1/0313 , H05K1/095 , H05K1/16 , H05K1/162 , H05K1/165 , H05K1/167 , H05K1/183 , H05K3/0052 , H05K3/20 , H05K3/205 , H05K3/4605 , H05K3/4614 , H05K3/4644 , H05K3/467 , H05K3/4688 , H05K2201/09509 , H05K2201/09763 , H05K2203/016 , H05K2203/061 , H05K2203/1189 , H01L2924/00
摘要： A wiring circuit block is produced by forming a release layer on one of planarized principal surfaces of a mother substrate, forming an insulating layer on the release layer, patterning the insulating layer and forming a wiring layer on the patterned insulating layer, and separating the insulating layer and wiring layer from the release layer on the mother substrate. The circuit block has components, and deposited on the wiring layer, and is mounted on a base circuit board to provide a wiring device. Also, semiconductor chips are mounted on the circuit block, and the circuit block is mounted on a base circuit board to provide a semiconductor device.
摘要翻译：通过在母基板的平坦化主面之一上形成剥离层，在剥离层上形成绝缘层，对绝缘层进行图案化，在图案化绝缘层上形成布线层，分离绝缘层而制造布线电路块层和布线层从母基板上的释放层。电路块具有部件并且沉积在布线层上，并且安装在基板电路板上以提供布线装置。此外，半导体芯片安装在电路块上，并且电路块安装在基极电路板上以提供半导体器件。

5. 发明授权

US07163598B2 Optical waveguide and method for producing same 失效
公开(公告)号：US07163598B2
公开(公告)日：2007-01-16
申请号：US10301008
申请日：2002-11-21
申请人： Akihiko Okubora , Tsuyoshi Ogawa
发明人： Akihiko Okubora , Tsuyoshi Ogawa
IPC分类号： B29C65/14 , B29C65/48 , G02B6/24 , B29C65/44 , B44C3/00
CPC分类号： G02B6/13 , Y10T428/24868 , Y10T428/2804
摘要： An optical waveguide having a optical waveguide path capable of securing a high light propagation characteristic regardless of the type of a supporting base, provided with a multilayer circuit board, an optical waveguide path arranged on the multilayer circuit board, a light receiving element, IC chips, and a light emitting element, the optical waveguide path formed on a transparent substrate excellent in flatness and transferred to the multilayer circuit board. The light propagation loss becomes small, and a signal to be transmitted at a high speed being transmitted as a light signal and a signal which can be transmitted at a relatively low speed being transmitted as an electrical signal, whereby the signal propagation delay which becomes the problem when a signal is transmitted by only electrical wiring is overcome, and the influence of electromagnetic noise becomes small.

6. 发明授权

US07138294B2 Circuit substrate device, method for producing the same, semiconductor device and method for producing the same 有权
标题翻译：电路基板装置及其制造方法，半导体装置及其制造方法
公开(公告)号：US07138294B2
公开(公告)日：2006-11-21
申请号：US10792447
申请日：2004-03-03
申请人： Yuji Nishitani , Tsuyoshi Ogawa , Hiroshi Asami , Akihiko Okubora
发明人： Yuji Nishitani , Tsuyoshi Ogawa , Hiroshi Asami , Akihiko Okubora
IPC分类号： H01L21/44
CPC分类号： H01L21/6835 , H01L21/4857 , H01L23/49833 , H01L2221/68345 , H01L2221/68359 , H01L2224/16 , H01L2924/01078 , H01L2924/01087 , H01L2924/09701 , H01L2924/19041 , H05K3/0052 , H05K3/20 , H05K3/4602 , H05K3/4614 , H05K3/467 , H05K3/4682 , H05K3/4694 , H05K2201/0352 , H05K2201/09536 , H05K2203/061
摘要： A circuit substrate device composed of a circuit unit 2 and a multi-layer wiring substrate 3 in which a pattern conductor of the circuit unit 2 may be prevented from being warped or inundated. The circuit substrate device includes a circuit unit 2 having a pattern conductor formed by a thin film technique, and an insulating layer, and a multi-layer wiring substrate 3 having a connecting terminal portion 14 exposed from its major surface. The circuit unit is formed on a dummy substrate. The circuit unit is connected to the multi-layer wiring substrate 3 so that the pattern conductor is connected to the connecting terminal portion 14. The dummy substrate is then removed to give a structure comprised of the circuit unit 2 formed on the multi-layer wiring substrate 3. The pattern conductor of the circuit unit 2 is freed of warping or inundations along the direction of thickness of the circuit unit 2.
摘要翻译：由电路单元2和多层布线基板3构成的电路基板装置，其中可以防止电路单元2的图形导体翘曲或被淹没。电路基板装置包括具有通过薄膜技术形成的图案导体的电路单元2和绝缘层，以及具有从其主表面露出的连接端子部分14的多层布线基板3。电路单元形成在虚设基板上。电路单元连接到多层布线基板3，使得图案导体连接到连接端子部分14。然后去除虚设基板，得到由多层布线基板3上形成的电路单元2构成的结构。电路单元2的图形导体沿着电路单元2的厚度方向不会发生翘曲或淹没。

7. 发明申请

US20070155060A1 Method for manufacturing high-frequency module device 失效
公开(公告)号：US20070155060A1
公开(公告)日：2007-07-05
申请号：US11710785
申请日：2007-02-26
申请人： Tsuyoshi Ogawa , Takahiko Kosemura , Akira Muto , Akihiko Okubora
发明人： Tsuyoshi Ogawa , Takahiko Kosemura , Akira Muto , Akihiko Okubora
IPC分类号： H01L21/58
CPC分类号： H01L23/5389 , H01L23/49833 , H01L23/642 , H01L23/645 , H01L24/48 , H01L2221/68345 , H01L2221/68363 , H01L2224/16235 , H01L2224/16237 , H01L2224/16238 , H01L2224/48091 , H01L2224/73253 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： This invention is a method for manufacturing a high-frequency module device. A high-frequency circuit unit (2) in which first to third unit wiring layers (5) to (7), each having a capacitor (12) or the like at a part, are stacked and formed on flattened one surface of a dummy board (30) so that a third pattern wiring is exposed from a connection surface (2a) of an uppermost layer is mounted on a mounting surface (3a) of a base board (3) where an input/output terminal part (18) is exposed, in such a manner that the third pattern wiring and the input/output terminal part are connected with each other, and after that, the dummy board is removed. A high-frequency module device is thus manufactured.

8. 发明申请

US20050037535A1 Method for fabricating high frequency module 有权
标题翻译：制造高频模块的方法
公开(公告)号：US20050037535A1
公开(公告)日：2005-02-17
申请号：US10496878
申请日：2003-09-03
申请人： Tsuyoshi Ogawa , Takahiko Kosemura , Akira Muto , Akihiko Okubora
发明人： Tsuyoshi Ogawa , Takahiko Kosemura , Akira Muto , Akihiko Okubora
IPC分类号： H01L23/12 , H01L23/498 , H01L23/538 , H01L23/64 , H01L21/44
CPC分类号： H01L23/5389 , H01L23/49833 , H01L23/642 , H01L23/645 , H01L24/48 , H01L2221/68345 , H01L2221/68363 , H01L2224/16235 , H01L2224/16237 , H01L2224/16238 , H01L2224/48091 , H01L2224/73253 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： This invention is a method for manufacturing a high-frequency module device. A high-frequency circuit unit (2) in which first to third unit wiring layers (5) to (7), each having a capacitor (12) or the like at a part, are stacked and formed on flattened one surface of a dummy board (30) so that a third pattern wiring is exposed from a connection surface (2a) of an uppermost layer is mounted on a mounting surface (3a) of a base board (3) where an input/output terminal part (18) is exposed, in such a manner that the third pattern wiring and the input/output terminal part are connected with each other, and after that, the dummy board is removed. A high-frequency module device is thus manufactured.
摘要翻译：本发明是制造高频模块装置的方法。一个高频电路单元（2），其中在一部分上分别具有电容器（12）等的第一至第三单元布线层（5）至（7）堆叠并形成在虚拟的平坦的一个表面上（30），使得从最上层的连接表面（2a）露出的第三图案布线安装在基板（3）的安装表面（3a）上，其中输入/输出端子部分（18）为以使得第三图案布线和输入/输出端子部分彼此连接的方式曝光，然后去除该虚拟板。由此制造高频模块装置。

9. 发明授权

US07741162B2 Method for manufacturing high-frequency module device 失效
标题翻译：制造高频模块装置的方法
公开(公告)号：US07741162B2
公开(公告)日：2010-06-22
申请号：US11710785
申请日：2007-02-26
申请人： Tsuyoshi Ogawa , Takahiko Kosemura , Akira Muto , Akihiko Okubora
发明人： Tsuyoshi Ogawa , Takahiko Kosemura , Akira Muto , Akihiko Okubora
IPC分类号： H01L21/00
CPC分类号： H01L23/5389 , H01L23/49833 , H01L23/642 , H01L23/645 , H01L24/48 , H01L2221/68345 , H01L2221/68363 , H01L2224/16235 , H01L2224/16237 , H01L2224/16238 , H01L2224/48091 , H01L2224/73253 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： This invention is a method for manufacturing a high-frequency module device. A high-frequency circuit unit (2) in which first to third unit wiring layers (5) to (7), each having a capacitor (12) or the like at a part, are stacked and formed on flattened one surface of a dummy board (30) so that a third pattern wiring is exposed from a connection surface (2a) of an uppermost layer is mounted on a mounting surface (3a) of a base board (3) where an input/output terminal part (18) is exposed, in such a manner that the third pattern wiring and the input/output terminal part are connected with each other, and after that, the dummy board is removed. A high-frequency module device is thus manufactured.
摘要翻译：本发明是制造高频模块装置的方法。一个高频电路单元（2），其中在一部分上分别具有电容器（12）等的第一至第三单元布线层（5）至（7）堆叠并形成在虚拟的平坦的一个表面上（30），使得从最上层的连接表面（2a）露出的第三图案布线安装在基板（3）的安装表面（3a）上，其中输入/输出端子部分（18）为以使得第三图案布线和输入/输出端子部分彼此连接的方式曝光，然后去除该虚拟板。由此制造高频模块装置。

10. 发明授权

US07306689B2 Optical waveguide and method for producing same 失效
标题翻译：光波导及其制造方法
公开(公告)号：US07306689B2
公开(公告)日：2007-12-11
申请号：US10994146
申请日：2004-11-19
申请人： Akihiko Okubora , Tsuyoshi Ogawa
发明人： Akihiko Okubora , Tsuyoshi Ogawa
IPC分类号： B44C1/18 , G02B6/122 , G02B6/036 , B44C1/24 , G02B6/136
CPC分类号： G02B6/13 , Y10T428/24868 , Y10T428/2804
摘要： An optical waveguide having a optical waveguide path capable of securing a high light propagation characteristic regardless of the type of a supporting base, provided with a multilayer circuit board, an optical waveguide path arranged on the multilayer circuit board, a light receiving element, IC chips, and a light emitting element, the optical waveguide path formed on a transparent substrate excellent in flatness and transferred to the multilayer circuit board. The light propagation loss becomes small, and a signal to be transmitted at a high speed being transmitted as a light signal and a signal which can be transmitted at a relatively low speed being transmitted as an electrical signal, whereby the signal propagation delay which becomes the problem when a signal is transmitted by only electrical wiring is overcome, and the influence of electromagnetic noise becomes small.
摘要翻译：具有能够确保高的光传播特性的光波导路径的光波导，不管支撑基座的种类如何，设有多层电路板，布置在多层电路板上的光波导路径，光接收元件，IC芯片和发光元件，该光波导路径形成在平坦度优异并转移到多层电路板的透明基板上。光传播损耗变小，作为光信号发送的高速发送信号和能够以较低速度发送的信号作为电信号发送，由此信号传播延迟成为克服了仅通过电线传输信号的问题，并且电磁噪声的影响变小。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式