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    • 1. 发明授权
    • Radical etching apparatus and method
    • 激光刻蚀装置及方法
    • US09216609B2
    • 2015-12-22
    • US13981277
    • 2012-02-01
    • Hiroaki InoueYasushi HiguchiMichio Ishikawa
    • Hiroaki InoueYasushi HiguchiMichio Ishikawa
    • B44C1/22H01J37/32H01L21/311
    • B44C1/227H01J37/32192H01L21/31116
    • A radical etching apparatus comprising a vacuum chamber for a substrate to be treated; a pipe pathway, connected to the vacuum chamber, a zone for generating plasma and a gas introduction device through which N2 and at least one of H2 and NH3 can be introduced; a microwave applying microwaves to the interior of the pipe pathway; a gas introducer as a source of supply for F, between the vacuum chamber and the zone; and a shower plate. A method comprises introducing N2 and at least one of H2 and NH3 into a pipe pathway and applying microwaves. The gas mixture is decomposed by the plasma forming decomposition products as active species which react with F during transportation to the vacuum chamber to make radicals. An SiO2 layer on the substrate etched in the vacuum chamber, by irradiating the substrate with the radicals through the shower plate.
    • 一种激进蚀刻装置,包括用于待处理基板的真空室; 连接到真空室的管道,用于产生等离子体的区域和气体引入装置,通过该导入装置可以引入N 2和至少一个H 2和NH 3; 将微波应用到管道通道的内部; 作为F的供气源的气体导入器,位于真空室和区域之间; 和淋浴板。 一种方法包括将N2和H2和NH3中的至少一种引入管道并施加微波。 气体混合物被等离子体形成分解产物分解为活性物质,在与真空室运输过程中与F反应形成自由基。 在真空室中蚀刻的衬底上的SiO 2层,通过淋浴板将自由基照射到衬底上。
    • 2. 发明申请
    • RADICAL ETCHING APPARATUS AND METHOD
    • 放射性蚀刻装置和方法
    • US20130306599A1
    • 2013-11-21
    • US13981277
    • 2012-02-01
    • Hiroaki InoueYasushi HiguchiMichio Ishikawa
    • Hiroaki InoueYasushi HiguchiMichio Ishikawa
    • B44C1/22
    • B44C1/227H01J37/32192H01L21/31116
    • A radical etching apparatus comprising a vacuum chamber for a substrate to be treated; a pipe pathway, connected to the vacuum chamber, a zone for generating plasma and with a gas introduction device through which N2 and at least one of H2 and NH3 can be introduced; a microwave applying microwaves to the interior of the pipe pathway; a gas introducer as a source of supply for F, between the vacuum chamber and the zone; and a shower plate. A method comprises introducing N2 and at least one of H2 gas and NH3 into a pipe pathway and applying microwaves. The gas mixture is decomposed by the plasma forming decomposition products as active species which react with F during transportation to a the vacuum chamber to make radicals. An SiO2 layer on a the substrate etched in the vacuum chamber, by irradiating the substrate with the radicals through a the shower plate.
    • 一种激进蚀刻装置,包括用于待处理基板的真空室; 连接到真空室的管道,用于产生等离子体的区域和具有气体引入装置的管道,N2和H2和NH3中的至少一个可以通过该导入装置引入; 将微波应用到管道通道的内部; 作为F的供气源的气体导入器,位于真空室和区域之间; 和淋浴板。 一种方法包括将N 2和至少一种H 2气和​​NH 3引入管道并施加微波。 气体混合物被等离子体形成分解产物分解为活性物质,它们在与真空室运输过程中与F反应形成自由基。 在真空室中蚀刻的基板上的SiO 2层,通过喷淋板照射基板。