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    • 1. 发明授权
    • Radical etching apparatus and method
    • 激光刻蚀装置及方法
    • US09216609B2
    • 2015-12-22
    • US13981277
    • 2012-02-01
    • Hiroaki InoueYasushi HiguchiMichio Ishikawa
    • Hiroaki InoueYasushi HiguchiMichio Ishikawa
    • B44C1/22H01J37/32H01L21/311
    • B44C1/227H01J37/32192H01L21/31116
    • A radical etching apparatus comprising a vacuum chamber for a substrate to be treated; a pipe pathway, connected to the vacuum chamber, a zone for generating plasma and a gas introduction device through which N2 and at least one of H2 and NH3 can be introduced; a microwave applying microwaves to the interior of the pipe pathway; a gas introducer as a source of supply for F, between the vacuum chamber and the zone; and a shower plate. A method comprises introducing N2 and at least one of H2 and NH3 into a pipe pathway and applying microwaves. The gas mixture is decomposed by the plasma forming decomposition products as active species which react with F during transportation to the vacuum chamber to make radicals. An SiO2 layer on the substrate etched in the vacuum chamber, by irradiating the substrate with the radicals through the shower plate.
    • 一种激进蚀刻装置,包括用于待处理基板的真空室; 连接到真空室的管道,用于产生等离子体的区域和气体引入装置,通过该导入装置可以引入N 2和至少一个H 2和NH 3; 将微波应用到管道通道的内部; 作为F的供气源的气体导入器,位于真空室和区域之间; 和淋浴板。 一种方法包括将N2和H2和NH3中的至少一种引入管道并施加微波。 气体混合物被等离子体形成分解产物分解为活性物质,在与真空室运输过程中与F反应形成自由基。 在真空室中蚀刻的衬底上的SiO 2层,通过淋浴板将自由基照射到衬底上。
    • 2. 发明申请
    • RADICAL ETCHING APPARATUS AND METHOD
    • 放射性蚀刻装置和方法
    • US20130306599A1
    • 2013-11-21
    • US13981277
    • 2012-02-01
    • Hiroaki InoueYasushi HiguchiMichio Ishikawa
    • Hiroaki InoueYasushi HiguchiMichio Ishikawa
    • B44C1/22
    • B44C1/227H01J37/32192H01L21/31116
    • A radical etching apparatus comprising a vacuum chamber for a substrate to be treated; a pipe pathway, connected to the vacuum chamber, a zone for generating plasma and with a gas introduction device through which N2 and at least one of H2 and NH3 can be introduced; a microwave applying microwaves to the interior of the pipe pathway; a gas introducer as a source of supply for F, between the vacuum chamber and the zone; and a shower plate. A method comprises introducing N2 and at least one of H2 gas and NH3 into a pipe pathway and applying microwaves. The gas mixture is decomposed by the plasma forming decomposition products as active species which react with F during transportation to a the vacuum chamber to make radicals. An SiO2 layer on a the substrate etched in the vacuum chamber, by irradiating the substrate with the radicals through a the shower plate.
    • 一种激进蚀刻装置,包括用于待处理基板的真空室; 连接到真空室的管道,用于产生等离子体的区域和具有气体引入装置的管道,N2和H2和NH3中的至少一个可以通过该导入装置引入; 将微波应用到管道通道的内部; 作为F的供气源的气体导入器,位于真空室和区域之间; 和淋浴板。 一种方法包括将N 2和至少一种H 2气和​​NH 3引入管道并施加微波。 气体混合物被等离子体形成分解产物分解为活性物质,它们在与真空室运输过程中与F反应形成自由基。 在真空室中蚀刻的基板上的SiO 2层,通过喷淋板照射基板。
    • 5. 发明授权
    • 2-alkylcysteinamide or salt thereof, process for producing these, and use of these
    • 2-烷基半胱氨酰胺或其盐,其制备方法及其用途
    • US07208631B2
    • 2007-04-24
    • US10552634
    • 2004-04-07
    • Yasushi HiguchiAkinori TanakaRyuji Hasemi
    • Yasushi HiguchiAkinori TanakaRyuji Hasemi
    • C07C233/05C07C231/10
    • C07C323/60C07B2200/07C07C319/02C07C319/06C12P13/12C12P41/006Y10S435/863Y10S435/91
    • A process for producing a 2-alkylcysteinamide, which comprises hydrolysis of a 4-alkylthiazolidine-4-carboxamide represented by the general formula (2) or a salt thereof: wherein R represents a lower alkyl group having 1–4 carbon atoms; and each of R1 and R2 independently represents hydrogen or a lower alkyl group having 1–4 carbon atoms, or R1 and R2 are linked together to form an alicyclic, structure having 4–7 carbon atoms, excluding the case where both R1 and R2 are hydrogen, to give a 2-alkylcysteinamide represented by the general formula (1) or a salt thereof wherein R represents a lower alkyl group having 1–4 carbon atoms. Cells of a microorganism or treated products thereof having activity of stereoselective hydrolysis of a 2-alkyl-L-cysteinamide are allowed to act on the compound represented by the general formula (1) to yield a 2-alkyl-L-cysteine.
    • 一种制备2-烷基半胱氨酰胺的方法,其包括由通式(2)表示的4-烷基噻唑烷-4-甲酰胺或其盐的水解:其中R表示具有1-4个碳原子的低级烷基; 并且R 1和R 2各自独立地表示氢或具有1-4个碳原子的低级烷基,或R 1和R 2独立地表示氢, SUB 2连接在一起形成具有4-7个碳原子的脂环族结构,不包括R 1和R 2都是氢的情况, 得到由通式(1)表示的2-烷基半胱胺酰胺或其盐,其中R表示具有1-4个碳原子的低级烷基。 允许具有2-烷基-L-半胱胺酰胺立体选择性水解活性的微生物或其处理产物的细胞作用于由通式(1)表示的化合物,得到2-烷基-L-半胱氨酸。
    • 8. 发明授权
    • Method of manufacturing a complementary MIS transistor
    • 制造互补MIS晶体管的方法
    • US5342802A
    • 1994-08-30
    • US47543
    • 1993-02-24
    • Ryoichi KubokoyaHiroyuki YamaneYasushi Higuchi
    • Ryoichi KubokoyaHiroyuki YamaneYasushi Higuchi
    • H01L21/336H01L21/8238H01L27/092H01L29/78H01L21/70
    • H01L29/66659H01L21/823814H01L27/0928H01L29/7835Y10S148/082
    • A high withstanding voltage MIS transistor, including an offset region and a double offset region in a region of a semiconductor substrate. The region of the semiconductor substrate has a first conductivity type. The offset region connects to a drain region, and has a second conductivity type. An impurity concentration of the offset region is lower than that of the drain region. The double offset region has the first conductivity type. At least a portion of the double offset region overlaps with the offset region. An impurity concentration of the double offset region is higher than that of the region of the semiconductor substrate. The disclosed structure has an improved current gain of the MIS transistor is improved.A method of manufacturing a CMOS having such a MIS transistor decreases the number of the manufacturing steps because the double offset region of a first conductivity type channel MIS transistor and the offset region of a second conductivity type channel MIS transistor are simultaneously formed.
    • 高耐压MIS晶体管,包括半导体衬底的区域中的偏移区域和双偏移区域。 半导体衬底的区域具有第一导电类型。 偏移区域连接到漏极区域,并且具有第二导电类型。 偏移区域的杂质浓度低于漏极区域的杂质浓度。 双偏移区具有第一导电类型。 双偏移区域的至少一部分与偏移区域重叠。 双偏移区域的杂质浓度高于半导体衬底区域的杂质浓度。 所公开的结构具有改善的MIS晶体管的电流增益。 制造具有这种MIS晶体管的CMOS的方法由于第一导电型沟道MIS晶体管的双偏移区域和第二导电型沟道MIS晶体管的偏移区域同时形成,所以减少了制造步骤的数量。
    • 9. 发明授权
    • MIS transistor device
    • MIS晶体管器件
    • US4924277A
    • 1990-05-08
    • US342608
    • 1989-04-20
    • Hiroyuki YamaneYasushi HiguchiTetsuo Fujii
    • Hiroyuki YamaneYasushi HiguchiTetsuo Fujii
    • H01L27/088H01L21/8234H01L27/092H01L29/10H01L29/78
    • H01L27/0928H01L29/1045H01L29/1083H01L29/7836Y10S257/90
    • In a MIS transistor device, a gate electrode is formed on a first conductivity-type well region formed in a semiconductor substrate. By implanting impurities with the gate electrode and an element-isolating region made up of a field insulating film as a mask, an N-type diffusion layer having a higher impurity concentration than the first conductivity-type well region is formed on the sides of the gate electrode. A second conductivity-type diffusion layer of a first impurity concentration higher than the N-type diffusion layer is formed with a smaller width than the N-type diffusion layer in the N-type diffusion layer formed on one side of the gate electrode. A second conductivity-type diffusion layer of a second high concentration is formed with a smaller width than the N-type diffusion layer in the N-type diffusion layer formed on the other side of the gate electrode.
    • 在MIS晶体管器件中,栅电极形成在形成于半导体衬底中的第一导电型阱区上。 通过将栅电极和由场绝缘膜构成的元件隔离区注入杂质作为掩模,在第二导电类型阱区的侧面上形成杂质浓度高于第一导电型阱区的N型扩散层 栅电极。 形成比N型扩散层高的第一杂质浓度的第二导电型扩散层的宽度小于形成在栅电极一侧的N型扩散层中的N型扩散层的宽度。 形成第二高浓度的第二导电型扩散层,其宽度小于形成在栅电极另一侧的N型扩散层中的N型扩散层的宽度。