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1. 发明专利

JPS5929717B2 JPS5929717B2 - 失效
公开(公告)号：JPS5929717B2
公开(公告)日：1984-07-23
申请号：JP13237879
申请日：1979-10-16
申请人： Akira Tsutsumi
发明人： TSUTSUMI AKIRA
IPC分类号： D06P5/00

2. 外观设计

USD570975S1 Gas water heater 有权
公开(公告)号：USD570975S1
公开(公告)日：2008-06-10
申请号：US29272522
申请日：2007-02-09
申请人： Teizo Nanbu , Tomofumi Kinugasa , Akira Tsutsumi , Satoshi Kawaguchi
设计人： Teizo Nanbu , Tomofumi Kinugasa , Akira Tsutsumi , Satoshi Kawaguchi

3. 发明授权

US4677252A Circuit board 失效
标题翻译：电路板
公开(公告)号：US4677252A
公开(公告)日：1987-06-30
申请号：US933369
申请日：1986-11-18
申请人： Satoshi Takahashi , Akira Tsutsumi , Junji Suzuki , Hiroshi Kumakura , Takao Ito , Kenji Ohsawa , Yuji Ikegami , Muneyuki Haruki , Nobuyuki Yasuda , Masayuki Ohta
发明人： Satoshi Takahashi , Akira Tsutsumi , Junji Suzuki , Hiroshi Kumakura , Takao Ito , Kenji Ohsawa , Yuji Ikegami , Muneyuki Haruki , Nobuyuki Yasuda , Masayuki Ohta
IPC分类号： H05K1/02 , H05K1/00 , H05K1/05 , H05K1/18 , H05K7/20
CPC分类号： H05K1/056 , H05K1/0284 , H05K1/189 , H05K2203/302
摘要： A circuit board comprises a rigid metal substrate, a conductive metal layer formed into a predetermined circuit pattern, and a resinous layer interposed between the metal substrate and the metal layer for electrically insulating and bonding the metal substrate and the metal layer, the conductive metal layer having an elongation at break of not less than 15%, and the resinous layer comprising a first resinous layer having a volume resistivity of not less than 10.sup.10 .OMEGA.. cm, and a second resinous layer having an elongation at break of not less than 100%. The circuit board has a desired dielectric strength between the metal substrate and the conductive metal layer and can be bent without resulting disconnection in the metal layer or the like.
摘要翻译：电路板包括刚性金属基板，形成为预定电路图案的导电金属层和介于金属基板和金属层之间的用于电绝缘和接合金属基板和金属层的树脂层，导电金属层具有不小于15％的断裂伸长率，并且所述树脂层包含体积电阻率不小于1010ΩEGA的第一树脂层。 cm，断裂伸长率为100％以上的第二树脂层。电路板在金属基板和导电金属层之间具有期望的介电强度，并且可以在金属层等中弯曲而不会导致断开。

4. 发明授权

US4406940A Laser processing machine 失效
标题翻译：激光加工机
公开(公告)号：US4406940A
公开(公告)日：1983-09-27
申请号：US313811
申请日：1981-10-22
申请人： Akira Tsutsumi
发明人： Akira Tsutsumi
IPC分类号： B23K26/02 , B23K27/00
CPC分类号： B23K26/037
摘要： The present invention relates to a laser machine having a head assembly for processing a workpiece. A lens is disposed in the head assembly for condensing a laser beam and a nozzle is arranged beneath the lens for applying the laser beam to the workpiece. A device is connected in the head assembly for vertically moving the lens and the nozzle together in fixed relation to each other. The device includes an adjustable motor. Also, the nozzle is detachably mounted onto a lower end of the head assembly. Furthermore, the laser machine comprises an arrangement for counterbalancing the weight of the nozzle as well as shock absorbers for handling vibrations caused by vertical movement of the lens and the nozzle.
摘要翻译：本发明涉及具有用于加工工件的头组件的激光机。透镜设置在头部组件中用于聚集激光束，并且喷嘴布置在透镜下方以将激光束施加到工件。一种装置连接在头部组件中，用于使透镜和喷嘴彼此固定地相互垂直移动。该装置包括可调马达。此外，喷嘴可拆卸地安装在头组件的下端。此外，激光机包括用于平衡喷嘴的重量的装置以及用于处理由透镜和喷嘴的垂直运动引起的振动的减震器。

5. 发明申请

US20080061160A1 Heating Apparatus 失效
标题翻译：加热装置
公开(公告)号：US20080061160A1
公开(公告)日：2008-03-13
申请号：US10593350
申请日：2005-03-23
申请人： Ichiro Ootomo , Hiroshi Asakura , Toshihiro Hori , Nobuhiro Takeda , Kazuhiro Kimura , Akira Tsutsumi , Takayasu Fujita , Masakuni Morikawa
发明人： Ichiro Ootomo , Hiroshi Asakura , Toshihiro Hori , Nobuhiro Takeda , Kazuhiro Kimura , Akira Tsutsumi , Takayasu Fujita , Masakuni Morikawa
IPC分类号： F24D12/02
CPC分类号： F28D7/00 , F24H1/40 , F24H1/46 , F24H8/00 , F24H9/14 , F24H9/148 , Y02B30/102
摘要： A heating apparatus 1 includes a shell 2, a primary heat exchanger (sensible heat exchanger)3, a burner (combustion means) 5, and a fan 6. A secondary heat exchanger (latent heat exchanger) 7 has a plurality of heat receiving tubes 18 arranged in parallel between a pair of headers 16 and 17, the heat receiving tubes 18 being fixed to tube plates 20. The heat receiving tubes 18 are bare tubes without fins and are arranged across flow of combustion gas. The number of the tubes 18 arranged vertically is less than the number of the tubes 18 arranged horizontally.
摘要翻译：加热装置1包括外壳2，主热交换器（显热交换器）3，燃烧器（燃烧装置）5和风扇6.二次热交换器（潜热交换器）7具有多个热接收管 18，平行布置在一对集管16和17之间，热接收管18固定到管板20上。受热管18是不带翅片的裸管，并且布置在燃烧气体的两端。竖直布置的管18的数量小于水平布置的管18的数量。

6. 发明授权

US06930390B2 Flexible printed wiring boards 失效
标题翻译：柔性印刷线路板
公开(公告)号：US06930390B2
公开(公告)日：2005-08-16
申请号：US09909827
申请日：2001-07-23
申请人： Yutaka Kaneda , Akira Tsutsumi , Hiroyuki Hishinuma
发明人： Yutaka Kaneda , Akira Tsutsumi , Hiroyuki Hishinuma
IPC分类号： H05K1/00 , H05K3/00 , H05K3/40 , H05K3/42 , H05K3/46 , H01L23/48
CPC分类号： H05K3/4007 , H05K1/0393 , H05K3/002 , H05K3/423 , H05K3/4614 , H05K3/4617 , H05K3/4635 , H05K3/4647 , H05K2201/0154 , H05K2201/0347 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2201/09563 , H05K2203/0278
摘要： An object of the present invention is to provide a simple process for manufacturing a flexible printed wiring board having fine metal bumps.A resin coating 21 and a resist film 24 are formed in this order on the surface of a metal film 11 and on the surface of each metal bump 16 formed on the metal film 11, and a pressure is applied on the surface to depress the resist film 24 on the metal bump 16, followed by etching. As the surface of the resin coating 21 is partially exposed at the depressed portion of the resist film 24, etching of the resin coating 21 proceeds from that portion to bulge the surface of the metal bump 16 from the resin coating 21. If the resist film 24 is formed after a flexible resin coating 22 is formed on the rigid resin coating 21, the flexible resin coating 22 can serve as an adhesive layer.
摘要翻译：本发明的目的是提供一种用于制造具有细金属凸块的柔性印刷线路板的简单方法。在金属膜11的表面和形成在金属膜11上的各金属凸块16的表面上依次形成树脂涂层21和抗蚀剂膜24，并且在表面上施加压力以压下抗蚀剂金属凸块16上的薄膜24，然后蚀刻。当树脂涂层21的表面部分地露出在抗蚀剂膜24的凹陷部分时，树脂涂层21的蚀刻从该部分进行，以从树脂涂层21凸出金属凸块16的表面。如果在刚性树脂涂层21上形成柔性树脂涂层22之后形成抗蚀剂膜24，则柔性树脂涂层22可以用作粘合剂层。

7. 发明授权

US06344308B1 Method of manufacturing a flexible circuit board 有权
标题翻译：制造柔性电路板的方法
公开(公告)号：US06344308B1
公开(公告)日：2002-02-05
申请号：US09440167
申请日：1999-11-15
申请人： Hideyuki Kurita , Satoshi Takahashi , Akira Tsutsumi
发明人： Hideyuki Kurita , Satoshi Takahashi , Akira Tsutsumi
IPC分类号： G03C500
CPC分类号： H05K3/28 , H05K3/0011 , H05K3/002 , H05K2201/0154 , H05K2201/0355 , H05K2201/0394 , H05K2203/1105
摘要： A flexible circuit board comprises a polyimide insulating layer 5 with land access holes 3 and a conductor circuit layer 4 provided thereon, and is produced by coating one surface of a conductor circuit metal foil 1 side with a polyimide precursor varnish, which is dried to give a polyimide precursor layer 2, where the polyimide precursor layer 2 is provided with land access holes 3 by a photolithography process; the conductor circuit metal foil 1 is patterned by the subtractive process to form conductor circuit layer 4; and the polyimide precursor layer 4 is then imidated to form polyimide insulating layer 5.
摘要翻译：柔性电路板包括具有接地孔3和设置在其上的导体电路层4的聚酰亚胺绝缘层5，并且通过用导体电路金属箔1侧的一个表面涂覆聚酰亚胺前体清漆来制造，其被干燥以得到聚酰亚胺前体层2，其中聚酰亚胺前体层2通过光刻工艺设置有焊盘进入孔3; 通过减法处理将导体电路金属箔1图案化，形成导体电路层4; 然后将聚酰亚胺前体层4酰亚胺化以形成聚酰亚胺绝缘层5。

8. 发明授权

US4417125A Laser processing machine 失效
标题翻译：激光加工机
公开(公告)号：US4417125A
公开(公告)日：1983-11-22
申请号：US350416
申请日：1982-02-19
申请人： Akira Tsutsumi
发明人： Akira Tsutsumi
IPC分类号： B23K26/10 , B23K7/10 , B23K26/02 , B23K26/08 , B23K26/14 , B23K26/42 , B23K27/00
CPC分类号： B23K26/0853 , B23K26/02 , B23K26/064 , B23K26/1462 , B23K26/1476 , B23K26/702 , B23K7/10
摘要： The present invention relates to a laser processing machine. A table supports a workpiece to be processed at a work area. A processing head assembly is arranged above the table. A nozzle is connected at a lower end of the processing head assembly and applies a laser beam to the workpiece together with an assisting gas at the work area. A device is provided at the work area for supplying air to keep the workpiece to be processed afloat while the laser beam is being applied to the workpiece together with the assisting gas. A similar device is provided at the lower end of the processing head assembly for supplying air to keep the workpiece to be processed from going up into contact with the processing head assembly while the laser beam is being applied to the workpiece together with the assisting gas. These devices for supplying air include a plurality of air chambers.
摘要翻译：激光加工机技术领域本发明涉及一种激光加工机。工作台支撑要在工作区域处理的工件。处理头组件布置在桌子上方。喷嘴连接在处理头组件的下端，并在工作区域与辅助气体一起施加激光束到工件。在工作区域设置有用于供给空气的装置，以将激光束与辅助气体一起施加到工件上来保持待处理的工件的浮动。在加工头组件的下端设置有类似的装置，用于供应空气以保持被处理工件在与辅助气体一起被施加到工件上时与加工头组件接触。用于供应空气的这些装置包括多个空气室。

9. 发明授权

US07647897B2 Heating apparatus 失效
标题翻译：加热装置
公开(公告)号：US07647897B2
公开(公告)日：2010-01-19
申请号：US10593350
申请日：2005-03-23
申请人： Ichiro Ootomo , Hiroshi Asakura , Toshihiro Hori , Nobuhiro Takeda , Kazuhiro Kimura , Akira Tsutsumi , Takayasu Fujita , Masakuni Morikawa
发明人： Ichiro Ootomo , Hiroshi Asakura , Toshihiro Hori , Nobuhiro Takeda , Kazuhiro Kimura , Akira Tsutsumi , Takayasu Fujita , Masakuni Morikawa
IPC分类号： F22B1/02
CPC分类号： F28D7/00 , F24H1/40 , F24H1/46 , F24H8/00 , F24H9/14 , F24H9/148 , Y02B30/102
摘要： A heating apparatus 1 includes a shell 2, a primary heat exchanger (sensible heat exchanger) 3, a burner (combustion means) 5, and a fan 6. A secondary heat exchanger (latent heat exchanger) 7 has a plurality of heat receiving tubes 18 arranged in parallel between a pair of headers 16 and 17, the heat receiving tubes 18 being fixed to tube plates 20. The heat receiving tubes 18 are bare tubes without fins and are arranged across flow of combustion gas. The number of the tubes 18 arranged vertically is less than the number of the tubes 18 arranged horizontally.
摘要翻译：加热装置1包括外壳2，主热交换器（显热交换器）3，燃烧器（燃烧装置）5和风扇6.二次热交换器（潜热交换器）7具有多个热接收管 18，平行布置在一对集管16和17之间，热接收管18固定到管板20上。受热管18是不带翅片的裸管，并且布置在燃烧气体的两端。竖直布置的管18的数量小于水平布置的管18的数量。

10. 外观设计

USD570976S1 Gas water heater 有权
公开(公告)号：USD570976S1
公开(公告)日：2008-06-10
申请号：US29272523
申请日：2007-02-09
申请人： Teizo Nanbu , Tomofumi Kinugasa , Akira Tsutsumi , Satoshi Kawaguchi
设计人： Teizo Nanbu , Tomofumi Kinugasa , Akira Tsutsumi , Satoshi Kawaguchi

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