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1. 发明申请

US20050017175A1 INFRARED SENSOR PACKAGE 有权
标题翻译：红外传感器包装
公开(公告)号：US20050017175A1
公开(公告)日：2005-01-27
申请号：US10710260
申请日：2004-06-29
申请人： Han-Sheng Lee , Dan Chilcott , James Logsdon
发明人： Han-Sheng Lee , Dan Chilcott , James Logsdon
IPC分类号： B81B7/00 , G01J5/10 , G01J5/00
CPC分类号： B81B7/0067 , B81C2203/0118 , G01J5/08 , G01J5/0853 , G01J5/10
摘要： An optical sensor package with a substrate that supports a membrane carrying an optical sensor and through which radiation passes to impinge the sensor. The substrate has a first surface in which a cavity is defined, a second surface opposite the first surface, and a wall between the cavity and the second surface. The optical sensor is supported on the membrane, which is bonded to the substrate and spans the cavity in the substrate. A window is defined at the second surface of the substrate for enabling infrared radiation to pass through the wall of the substrate to the optical sensor.
摘要翻译：一种光学传感器封装，其具有支撑携带光学传感器并且辐射通过该膜以撞击传感器的膜的基板。衬底具有其中限定空腔的第一表面，与第一表面相对的第二表面以及腔和第二表面之间的壁。光学传感器被支撑在膜上，该膜结合到基底并跨越基底中的空腔。窗口被限定在基板的第二表面上，以使得红外辐射能够通过基板的壁到达光学传感器。

2. 发明申请

US20050098729A1 Integrated light concentrator 审中-公开
标题翻译：集成光集中器
公开(公告)号：US20050098729A1
公开(公告)日：2005-05-12
申请号：US11003191
申请日：2004-12-03
申请人： David Lambert , Han-Sheng Lee , Dan Chilcott , Hamid Borzabadi , Qin Jiang , James Logsdon
发明人： David Lambert , Han-Sheng Lee , Dan Chilcott , Hamid Borzabadi , Qin Jiang , James Logsdon
IPC分类号： G01J5/08 , G01J5/12 , G01J5/02
CPC分类号： G01J5/0022 , G01J5/0025 , G01J5/02 , G01J5/0225 , G01J5/045 , G01J5/06 , G01J5/08 , G01J5/0809 , G01J5/0815 , G01J5/0853 , G01J5/0875 , G01J5/12
摘要： An infrared sensor including an absorber for absorbing incident infrared power to produce a signal representing the temperature of a target object, a frame supporting a membrane which carries the absorber, the frame including a plurality of reflecting surfaces disposed about the circumference of an opening over which the membrane spans for reflecting incident infrared power toward the absorber. By concentrating incident infrared power through reflection, the temperature difference between the absorber and the surrounding frame is increased, thereby producing an increased electrical output from the sensor.
摘要翻译：一种红外线传感器，包括：吸收器，用于吸收入射的红外光，产生表示目标物体的温度的信号;支撑承载吸收体的膜的框架，所述框架包括围绕开口的圆周设置的多个反射面，膜跨过来将反射入射的红外线朝向吸收体反射。通过反射聚焦入射的红外线功率，吸收器和周围框架之间的温差增加，从而产生从传感器增加的电输出。

3. 发明授权

US5369057A Method of making and sealing a semiconductor device having an air path therethrough 失效
标题翻译：制造和密封具有穿过其中的空气通道的半导体器件的方法
公开(公告)号：US5369057A
公开(公告)日：1994-11-29
申请号：US169118
申请日：1993-12-21
申请人： Han-Sheng Lee , Steven E. Staller , James H. Logsdon , Dan W. Chilcott
发明人： Han-Sheng Lee , Steven E. Staller , James H. Logsdon , Dan W. Chilcott
IPC分类号： G01P1/02 , G01P15/08 , H01L21/50 , H01L23/13 , H01L21/60
CPC分类号： G01P1/023 , G01P15/0802 , H01L21/50 , H01L23/13 , H01L2924/0002 , Y10T29/49103
摘要： This invention generally relates to the provision of a vent path during the bonding of silicon wafers and the subsequent encapsulation of the individual devices. A double-sided polished silicon wafer is used for the device wafer. The device wafer includes circuitry, thin membranes and metal interconnections. When bonding a bottom wafer to the device wafer, a vented path exists between the wafers. The venting path includes serpentine shape channel formed by interdigitated fingers and cavities. The cavity and the interdigitated patterns can be etched either together or separately into either wafer. A top wafer has a cavity formed therein. When the top device and bottom wafers are bonded together, the venting path is sealed by dipping the device in a sealing liquid. The serpentine path prevents the sealing liquid from reaching the cavity.
摘要翻译：本发明一般涉及在硅晶片的接合期间提供通气路径以及随后的各个装置的封装。用于器件晶圆的双面抛光硅晶片。器件晶片包括电路，薄膜和金属互连。当将底部晶片接合到器件晶片时，在晶片之间存在通气路径。通气路径包括由叉指和空腔形成的蛇形形状通道。空腔和叉指图案可以一起蚀刻或分别蚀刻到任一晶片中。顶部晶片具有形成在其中的空腔。当顶部装置和底部晶片结合在一起时，通过将装置浸入密封液中来密封通气路径。蛇形路径防止密封液到达腔体。

4. 发明授权

US4862232A Transistor structure for high temperature logic circuits with insulation around source and drain regions 失效
标题翻译：用于高温逻辑电路的晶体管结构，在源极和漏极区域周围具有绝缘
公开(公告)号：US4862232A
公开(公告)日：1989-08-29
申请号：US909565
申请日：1986-09-22
申请人： Han-Sheng Lee
发明人： Han-Sheng Lee
IPC分类号： H01L29/06
CPC分类号： H01L29/0653
摘要： A high temperature logic field effect transistor. By surrounding the source and drain pn junctions with electrically insulative material, except where a channel runs between the source and drain, a logic field effect transistor whose on/off current ratio can still have a high value at high temperatures. The transistor can be of any standard MOS technology, such as pMOS, nMOS, or CMOS.
摘要翻译：高温逻辑场效应晶体管。通过围绕具有电绝缘材料的源极和漏极pn结，除了沟道在源极和漏极之间延伸之外，其导通/截止电流比在高温下仍然可以具有高值的逻辑场效应晶体管。晶体管可以是任何标准MOS技术，例如pMOS，nMOS或CMOS。

5. 发明授权

US07180064B2 Infrared sensor package 有权
标题翻译：红外传感器封装
公开(公告)号：US07180064B2
公开(公告)日：2007-02-20
申请号：US10710260
申请日：2004-06-29
申请人： Han-Sheng Lee , Dan W. Chilcott , James H. Logsdon
发明人： Han-Sheng Lee , Dan W. Chilcott , James H. Logsdon
IPC分类号： G01J5/00
CPC分类号： B81B7/0067 , B81C2203/0118 , G01J5/08 , G01J5/0853 , G01J5/10
摘要： An optical sensor package with a substrate that supports a membrane carrying an optical sensor and through which radiation passes to impinge the sensor. The substrate has a first surface in which a cavity is defined, a second surface opposite the first surface, and a wall between the cavity and the second surface. The optical sensor is supported on the membrane, which is bonded to the substrate and spans the cavity in the substrate. A window is defined at the second surface of the substrate for enabling infrared radiation to pass through the wall of the substrate to the optical sensor.
摘要翻译：一种光学传感器封装，其具有支撑携带光学传感器并且辐射通过该膜以撞击传感器的膜的基板。衬底具有其中限定空腔的第一表面，与第一表面相对的第二表面以及腔和第二表面之间的壁。光学传感器被支撑在膜上，该膜结合到基底并跨越基底中的空腔。窗口被限定在基板的第二表面上，以使得红外辐射能够通过基板的壁到达光学传感器。

6. 发明授权

US06712503B2 Method to calculate fuel DI number from a measured curve 失效
标题翻译：从测量曲线计算燃料DI数的方法
公开(公告)号：US06712503B2
公开(公告)日：2004-03-30
申请号：US10117833
申请日：2002-04-08
申请人： Yingjie Lin , Han-Sheng Lee , Su-Chee Simon Wang
发明人： Yingjie Lin , Han-Sheng Lee , Su-Chee Simon Wang
IPC分类号： G01N2500
CPC分类号： G01N33/2829 , F02D19/0628 , F02D19/0634 , F02D19/0649 , F02D19/0665 , F02D41/0025 , F02D2200/0611 , Y02T10/36
摘要： A method to calculate a fuel driveability index (DI) value is provided from a sample of fuel in a container as tested by the industry standard ASTM D86 test providing particular temperature data at various percentages of evaporation as the container is heated. The particular temperature data provides a DI value. The same sample of fuel is tested on a sensor capable of retaining a predetermined volume of fuel. Temperature data is monitored at the same percentages of evaporation as the sensor is being heated. Correlation equations are mathematically calculated between the temperature data from the sensor relative to the particular temperature data from the ASTM D86 test and stored in the engine controller of a vehicle. The fuel from the fuel tank is tested by heating a similar on-board sensor having the predetermined volume of fuel and measuring the temperature data as a function of the remaining fuel in the sensor. The stored correlation equations are applied to the measured temperatures to provide the required temperature data to calculate the DI value for the fuel in the fuel tank.
摘要翻译：根据行业标准ASTM D86测试，通过容器加热时以各种蒸发百分比提供特定温度数据，从容器中的燃料样品中提供计算燃料驱动性指数（DI）值的方法。特定的温度数据提供DI值。在能够保持预定体积的燃料的传感器上测试相同的燃料样本。以与传感器加热相同的蒸发百分比来监测温度数据。在相对于来自ASTM D86测试的特定温度数据和存储在车辆的发动机控制器中的传感器的温度数据之间，数学上计算相关方程。来自燃料箱的燃料通过加热具有预定体积燃料的类似的车载传感器并根据传感器中剩余燃料的函数来测量温度数据来测试。将存储的相关方程应用于测量的温度以提供所需的温度数据以计算燃料箱中的燃料的DI值。

7. 发明授权

US06828560B2 Integrated light concentrator 有权
标题翻译：集成光集中器
公开(公告)号：US06828560B2
公开(公告)日：2004-12-07
申请号：US10059401
申请日：2002-01-31
申请人： David K. Lambert , Han-Sheng Lee , Dan W. Chilcott , Hamid R. Borzabadi , Qin Jiang , James H. Logsdon
发明人： David K. Lambert , Han-Sheng Lee , Dan W. Chilcott , Hamid R. Borzabadi , Qin Jiang , James H. Logsdon
IPC分类号： G01J508
CPC分类号： G01J5/0022 , G01J5/0025 , G01J5/02 , G01J5/0225 , G01J5/045 , G01J5/06 , G01J5/08 , G01J5/0809 , G01J5/0815 , G01J5/0853 , G01J5/0875 , G01J5/12
摘要： An infrared sensor including an absorber for absorbing incident infrared power to produce a signal representing the temperature of a target object, a frame supporting a membrane which carries the absorber, the frame including a plurality of reflecting surfaces disposed about the circumference of an opening over which the membrane spans for reflecting incident infrared power toward the absorber. By concentrating incident infrared power through reflection, the temperature difference between the absorber and the surrounding frame is increased, thereby producing an increased electrical output from the sensor.
摘要翻译：一种红外线传感器，包括：吸收器，用于吸收入射的红外光，产生表示目标物体的温度的信号;支撑承载吸收体的膜的框架，所述框架包括围绕开口的圆周设置的多个反射面，膜跨过来将反射入射的红外线朝向吸收体反射。通过反射聚焦入射的红外线功率，吸收器和周围框架之间的温差增加，从而产生从传感器增加的电输出。

8. 发明授权

US06679226B2 Fuel sensor system 失效
标题翻译：燃油传感器系统
公开(公告)号：US06679226B2
公开(公告)日：2004-01-20
申请号：US09997371
申请日：2001-11-30
申请人： David H. Burke , Michael J. Niemiec , Charles R. Harrington , David K. Lambert , Han-Sheng Lee , Su-Chee S. Wang
发明人： David H. Burke , Michael J. Niemiec , Charles R. Harrington , David K. Lambert , Han-Sheng Lee , Su-Chee S. Wang
IPC分类号： F02M3704
CPC分类号： G01N33/2829 , G01N1/14
摘要： A fuel sensor system for a vehicle includes a fuel pump adapted to be disposed in a fuel tank to pump fuel from the fuel tank to an engine of the vehicle. The fuel sensor system also includes a fuel sensor adapted to be disposed in the fuel tank to measure a property index of the fuel. The fuel sensor system further includes a jet pump connected to the fuel pump to fill the fuel sensor with a fuel sample of the fuel.
摘要翻译：一种用于车辆的燃料传感器系统包括：燃料泵，其适于设置在燃料箱中以将来自燃料箱的燃料泵送到车辆的发动机。燃料传感器系统还包括适于设置在燃料箱中以测量燃料的特性指数的燃料传感器。燃料传感器系统还包括连接到燃料泵的喷射泵，以用燃料的燃料样本填充燃料传感器。

9. 发明授权

US06588253B2 Fuel volatitlity sensor and method based on capacitance measurement 失效
标题翻译：燃料挥发性传感器和基于电容测量的方法
公开(公告)号：US06588253B2
公开(公告)日：2003-07-08
申请号：US09932333
申请日：2001-08-17
申请人： David K. Lambert , Charles Robert Harrington , Han-Sheng Lee , Da Yu Wang
发明人： David K. Lambert , Charles Robert Harrington , Han-Sheng Lee , Da Yu Wang
IPC分类号： F02D4500
CPC分类号： G01N33/2829 , F02D41/021 , F02D41/28 , F02D2200/0606 , F02D2200/0611 , G01N27/221 , Y10T137/6606
摘要： A method and apparatus for determining a volatility of a fuel sample. A fuel sample is collected in a container and heated for a time period using a heater device. Periodically during the heating, the capacitance of the fuel sample and the temperature of the heater device are determined. After a time period passes, the volatility of the fuel sample is determined using the capacitance decrease and the temperature increase. Specifically, a voltage across the heater device is used, along with the current through the heater device to determine the resistance of the heater device, which gives the temperature of the heater device and the sample. The capacitance and temperature are compared to values derived from experimentation for fuels of varying DI. The first measurement of capacitance with a known sample volume can be used to determine the MTBE or ethanol content in gasoline fuels.
摘要翻译：一种用于确定燃料样品的挥发性的方法和装置。将燃料样品收集在容器中并使用加热器装置加热一段时间。在加热期间，确定燃料样品的电容和加热器装置的温度。经过一段时间后，使用电容降低和温度升高确定燃料样品的挥发性。具体地，使用加热器装置两端的电压以及通过加热器装置的电流来确定加热器装置的电阻，其给出加热器装置和样品的温度。将电容和温度与来自不同DI的燃料的实验值进行比较。用已知样品体积的电容的第一次测量可用于确定汽油燃料中的MTBE或乙醇含量。

10. 发明授权

US5413955A Method of bonding silicon wafers at temperatures below 500 degrees centigrade for sensor applications 失效
标题翻译：在低于500摄氏度的温度下将硅晶片粘合用于传感器应用的方法
公开(公告)号：US5413955A
公开(公告)日：1995-05-09
申请号：US169117
申请日：1993-12-21
申请人： Han-Sheng Lee , Steven E. Staller , Dan W. Chilcott
发明人： Han-Sheng Lee , Steven E. Staller , Dan W. Chilcott
IPC分类号： G01P15/08 , H01L21/20
CPC分类号： G01P15/0802 , Y10S148/135
摘要： A process for silicon wafer-to-wafer bonding at temperatures lower than 500.degree. C. has been developed. It consists of (1) treating the cleaned surfaces to make them smooth and hydrophilic, (2) initiating the bond by making intimate contact between wafers and (3) enhancing the bond strength at elevated temperatures. This bonding process can be applied to sensor packaging.
摘要翻译：已经开发了在低于500℃的温度下进行硅晶片到晶片接合的工艺。它包括（1）处理清洁的表面以使其光滑和亲水，（2）通过使晶片之间的紧密接触和（3）在升高的温度下增强粘结强度来引发粘合。这种粘合工艺可以应用于传感器包装。

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