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1. 发明授权

US06844606B2 Surface-mount package for an optical sensing device and method of manufacture 有权
标题翻译：用于光学感测装置的表面贴装封装及其制造方法
公开(公告)号：US06844606B2
公开(公告)日：2005-01-18
申请号：US10065446
申请日：2002-10-18
申请人： James H. Logsdon , Abhijeet V. Chavan , Hamid R. Borzabadi
发明人： James H. Logsdon , Abhijeet V. Chavan , Hamid R. Borzabadi
IPC分类号： G01J5/00 , H01L23/02 , H01L23/10 , H01L25/16
CPC分类号： H01L25/167 , H01L23/10 , H01L2224/16 , H01L2924/09701 , H01L2924/10253 , H01L2924/15153 , H01L2924/15165 , H01L2924/15174 , H01L2924/16195 , H01L2924/00
摘要： An optical sensor package capable of being surface mounted, and in a form that enables multiple packages to be fabricated simultaneously and then array tested in a wafer stack prior to singulation. The package comprises a chip carrier, a device chip electrically and mechanically connected to a first surface of the chip carrier with solder connections, and a capping chip secured to the chip carrier to hermetically enclose the device chip. The device chip has an optical sensing element on a surface thereof, while the capping chip has means for enabling radiation to pass therethrough to the device chip. The chip carrier includes conductive vias that are electrically connected to the solder connections of the device chip and extend through the chip carrier to bond pads on a second surface of the chip carrier, enabling the package to be surface mounted with solder connections to a suitable substrate.
摘要翻译：一种能够被表面安装的光学传感器封装，并且能够在分割之前同时制造多个封装，然后在晶片堆叠中进行阵列测试。封装包括芯片载体，器件芯片，电连接和机械连接到具有焊料连接的芯片载体的第一表面，以及封装芯片，固定到芯片载体以气密地封装器件芯片。器件芯片在其表面上具有光学感测元件，而封盖芯片具有用于使辐射能够穿过其中的装置芯片的装置。芯片载体包括导电通孔，其电连接到器件芯片的焊接连接并延伸穿过芯片载体以在芯片载体的第二表面上接合焊盘，使封装能够被表面安装，焊接连接到合适的衬底。

2. 发明授权

US07174773B2 Leak-testing technique for differential pressure sensor array 有权
标题翻译：差压传感器阵列泄漏检测技术
公开(公告)号：US07174773B2
公开(公告)日：2007-02-13
申请号：US11109315
申请日：2005-04-19
申请人： Hamid R. Borzabadi , Dennis M. Koglin
发明人： Hamid R. Borzabadi , Dennis M. Koglin
IPC分类号： G01M3/26 , G01L19/14
CPC分类号： G01M3/186
摘要： A leak-testing technique and apparatus for differential pressure sensor arrays is provided. A reference pressure sensor array is provided, wherein a seal is disposed between the reference pressure sensor array and a target differential pressure sensor array. A probe socket is utilized to communicate with each individual sensor in the reference pressure sensor array. The target pressure sensor array and the reference pressure sensor array are sealed via a pressure plate and plunger assembly. The target pressure sensor array, seal, and reference pressure sensor array are exposed to a first pressure. The target differential pressure sensor array, seal, and reference pressure sensor array are then exposed to a second pressure. The probe socket verifies that all reference pressure sensors continue to output the first pressure. If the probe socket identifies a reference pressure sensor that reads the second pressure, then the corresponding target pressure sensor is identified as being defective because of leakage.
摘要翻译：提供了用于差压传感器阵列的泄漏测试技术和设备。提供了一种参考压力传感器阵列，其中密封件设置在参考压力传感器阵列和目标差压传感器阵列之间。探头插座用于与参考压力传感器阵列中的每个单独的传感器通信。目标压力传感器阵列和参考压力传感器阵列通过压力板和柱塞组件密封。目标压力传感器阵列，密封件和参考压力传感器阵列暴露于第一压力。然后将目标差压传感器阵列，密封件和参考压力传感器阵列暴露于第二压力。探头插座验证所有参考压力传感器是否继续输出第一压力。如果探头插座识别出读取第二压力的参考压力传感器，则相应的目标压力传感器由于泄漏而被识别为有缺陷的。

3. 发明申请

US20110203359A1 SEALED ENGINE CONTROL MODULE WITH INTEGRAL AMBIENT AIR PRESSURE SENSOR 有权
标题翻译：密封发动机控制模块与整体环境空气压力传感器
公开(公告)号：US20110203359A1
公开(公告)日：2011-08-25
申请号：US12709644
申请日：2010-02-22
申请人： HAMID R. BORZABADI , RONALD D. WILCOX , PHILIP D. KUZNIA , TIMOTHY A. VAS , LEWIS H. LITTLE , DAVID G. MILLER
发明人： HAMID R. BORZABADI , RONALD D. WILCOX , PHILIP D. KUZNIA , TIMOTHY A. VAS , LEWIS H. LITTLE , DAVID G. MILLER
IPC分类号： G01M15/04
CPC分类号： G01L19/0654 , G01L19/147
摘要： An engine control module having an environmentally-sealed housing includes a housing-mounted air pressure sensor for providing a reliable measure of atmospheric air pressure to a control circuit mounted within the housing. The sensor is mounted on an inboard face of the housing, and includes a sensor element, a body portion and a riser portion. The sensor element is mounted in the body portion, and the riser portion protrudes through an opening in the housing to couple the sensor element to atmospheric pressure outside the housing. The body portion is sealingly secured to the inboard face of the housing, and a set of conductor pins molded into the body portion extend inward to engage a circuit board enclosed by the housing, and thereby directly couple the sensor element to the ECM's control circuit. The top of the riser portion is capped by a splash-proof lid to prevent water intrusion.
摘要翻译：具有环境密封的壳体的发动机控制模块包括壳体安装的空气压力传感器，用于向安装在壳体内的控制电路提供可靠的大气压力测量值。传感器安装在壳体的内表面上，并且包括传感器元件，主体部分和立管部分。传感器元件安装在主体部分中，并且提升部分突出穿过壳体中的开口，以将传感器元件耦合到壳体外部的大气压力。主体部分密封地固定到壳体的内侧面，并且模制到主体部分中的一组导体销向内延伸以接合由壳体包围的电路板，从而将传感器元件直接耦合到ECM的控制电路。提升管部分的顶部由防溅盖盖住，以防止水侵入。

4. 发明授权

US07983046B1 Electronic control module and enclosed power module 有权
标题翻译：电子控制模块和封闭式电源模块
公开(公告)号：US07983046B1
公开(公告)日：2011-07-19
申请号：US12709659
申请日：2010-02-22
申请人： Hamid R. Borzabadi , Ronald D. Wilcox
发明人： Hamid R. Borzabadi , Ronald D. Wilcox
IPC分类号： H05K7/20
CPC分类号： H05K7/2039 , H01L25/165 , H01L2224/48227 , H05K7/209
摘要： Power electronic devices of an electronic control module are mounted in a power module disposed between the control module circuit board and an interior face of the control module case, with a prescribed separation distance between the circuit board and a housing of the power module. The power electronic devices are mounted on an inboard face of a power module substrate, and a heatsink thermally coupled to the opposite face of the substrate is fastened to an interior surface of the control module case. The substrate and heatsink are mounted in the power module housing, and the power electronic devices are electrically coupled to the circuit board by a set of compliant terminals that protrude from the inboard face of the power module housing. The terminals extend into plated holes in the circuit board, and have shoulders that limit their depth of insertion to establish the prescribed separation distance between the circuit board and the power module housing.
摘要翻译：电子控制模块的电力电子装置安装在控制模块电路板和控制模块壳体的内表面之间的电源模块中，电路板和电源模块的壳体之间具有规定的间隔距离。功率电子器件安装在功率模块基板的内侧面上，并且热耦合到基板的相对面的散热片紧固到控制模块壳体的内表面。基板和散热器安装在功率模块壳体中，并且电力电子设备通过从电源模块壳体的内表面突出的一组柔性端子电耦合到电路板。端子延伸到电路板的电镀孔中，并且具有限制其插入深度的肩部，以在电路板和电源模块外壳之间建立规定的间隔距离。

5. 发明授权

US07331212B2 Sensor module 有权
标题翻译：传感器模块
公开(公告)号：US07331212B2
公开(公告)日：2008-02-19
申请号：US11328032
申请日：2006-01-09
申请人： Gregory J. Manlove , Stephen P. Long , Hamid R. Borzabadi , Timothy A. Vas , Kevin J. Hawes
发明人： Gregory J. Manlove , Stephen P. Long , Hamid R. Borzabadi , Timothy A. Vas , Kevin J. Hawes
IPC分类号： G01N3/30
CPC分类号： G01D11/245 , G01P1/023
摘要： A sensor module is provided having a compact housing containing a sensor. A low temperature co-fired ceramic substrate is located on the housing. The sensor and signal processing circuitry are located on the low temperature co-fired ceramic substrate. The sensor module further includes a metal shield substantially encapsulating the sensor.
摘要翻译：传感器模块设置有具有包含传感器的紧凑壳体。低温共烧陶瓷基板位于外壳上。传感器和信号处理电路位于低温共烧陶瓷基片上。传感器模块还包括基本上封装传感器的金属屏蔽。

6. 发明授权

US06993975B2 Pressure sensor module having stress isolation platform 有权
标题翻译：压力传感器模块具有应力隔离平台
公开(公告)号：US06993975B2
公开(公告)日：2006-02-07
申请号：US10699752
申请日：2003-11-03
申请人： Hamid R. Borzabadi , Dennis M. Koglin , Gregory J. Manlove , Stephen P. Long
发明人： Hamid R. Borzabadi , Dennis M. Koglin , Gregory J. Manlove , Stephen P. Long
IPC分类号： G01L9/00
CPC分类号： G01L19/147 , G01L9/06 , G01L19/148
摘要： A pressure sensor module is provided with an isolation platform which isolates stress. The pressure sensor module includes a base structure and a cantilever member formed in the base structure by an isolation gap. A pressure sensing element is located on the cantilever member such that the cantilever member provides stress isolation to the pressure sensing element.
摘要翻译：压力传感器模块设有隔离压力的隔离平台。压力传感器模块包括基部结构和通过隔离间隙形成在基部结构中的悬臂构件。压力感测元件位于悬臂构件上，使得悬臂构件向压力感测元件提供应力隔离。

7. 发明授权

US08375778B2 Sealed engine control module with integral ambient air pressure sensor 有权
标题翻译：密封发动机控制模块，带有环境空气压力传感器
公开(公告)号：US08375778B2
公开(公告)日：2013-02-19
申请号：US12709644
申请日：2010-02-22
申请人： Hamid R. Borzabadi , Ronald D. Wilcox , Philip D. Kuznia , Timothy A. Vas , Lewis H. Little , David G. Miller
发明人： Hamid R. Borzabadi , Ronald D. Wilcox , Philip D. Kuznia , Timothy A. Vas , Lewis H. Little , David G. Miller
IPC分类号： G01M15/04
CPC分类号： G01L19/0654 , G01L19/147
摘要： An engine control module having an environmentally-sealed housing includes a housing-mounted air pressure sensor for providing a reliable measure of atmospheric air pressure to a control circuit mounted within the housing. The sensor is mounted on an inboard face of the housing, and includes a sensor element, a body portion and a riser portion. The sensor element is mounted in the body portion, and the riser portion protrudes through an opening in the housing to couple the sensor element to atmospheric pressure outside the housing. The body portion is sealingly secured to the inboard face of the housing, and a set of conductor pins molded into the body portion extend inward to engage a circuit board enclosed by the housing, and thereby directly couple the sensor element to the ECM's control circuit. The top of the riser portion is capped by a splash-proof lid to prevent water intrusion.
摘要翻译：具有环境密封的壳体的发动机控制模块包括壳体安装的空气压力传感器，用于向安装在壳体内的控制电路提供可靠的大气压力测量值。传感器安装在壳体的内表面上，并且包括传感器元件，主体部分和立管部分。传感器元件安装在主体部分中，并且提升部分突出穿过壳体中的开口，以将传感器元件耦合到壳体外部的大气压力。主体部分密封地固定到壳体的内侧面，并且模制到主体部分中的一组导体销向内延伸以接合由壳体包围的电路板，从而将传感器元件直接耦合到ECM的控制电路。提升管部分的顶部由防溅盖盖住，以防止水侵入。

8. 发明授权

US06828560B2 Integrated light concentrator 有权
标题翻译：集成光集中器
公开(公告)号：US06828560B2
公开(公告)日：2004-12-07
申请号：US10059401
申请日：2002-01-31
申请人： David K. Lambert , Han-Sheng Lee , Dan W. Chilcott , Hamid R. Borzabadi , Qin Jiang , James H. Logsdon
发明人： David K. Lambert , Han-Sheng Lee , Dan W. Chilcott , Hamid R. Borzabadi , Qin Jiang , James H. Logsdon
IPC分类号： G01J508
CPC分类号： G01J5/0022 , G01J5/0025 , G01J5/02 , G01J5/0225 , G01J5/045 , G01J5/06 , G01J5/08 , G01J5/0809 , G01J5/0815 , G01J5/0853 , G01J5/0875 , G01J5/12
摘要： An infrared sensor including an absorber for absorbing incident infrared power to produce a signal representing the temperature of a target object, a frame supporting a membrane which carries the absorber, the frame including a plurality of reflecting surfaces disposed about the circumference of an opening over which the membrane spans for reflecting incident infrared power toward the absorber. By concentrating incident infrared power through reflection, the temperature difference between the absorber and the surrounding frame is increased, thereby producing an increased electrical output from the sensor.
摘要翻译：一种红外线传感器，包括：吸收器，用于吸收入射的红外光，产生表示目标物体的温度的信号;支撑承载吸收体的膜的框架，所述框架包括围绕开口的圆周设置的多个反射面，膜跨过来将反射入射的红外线朝向吸收体反射。通过反射聚焦入射的红外线功率，吸收器和周围框架之间的温差增加，从而产生从传感器增加的电输出。

9. 发明申请

US20090152653A1 Surface mount multi-axis electronics package for micro-electrical mechanical systems(MEMS) devices 审中-公开
标题翻译：用于微机电系统（MEMS）器件的表面贴装多轴电子封装
公开(公告)号：US20090152653A1
公开(公告)日：2009-06-18
申请号：US12002065
申请日：2007-12-14
申请人： Hamid R. Borzabadi , Ronald D. Wilcox
发明人： Hamid R. Borzabadi , Ronald D. Wilcox
IPC分类号： H01L29/84 , H01L21/50
CPC分类号： B81B7/0074 , B81B2201/0235 , B81B2201/0242 , G01C19/56 , G01P1/023 , G01P15/18
摘要： A surface mount multi-axis cavity package for micro-electrical mechanical systems (MEMS) devices includes a substantially cubical housing having a plurality of sides and at least one internal cavity. A first plurality of solder pads are positioned on at least one side of the housing and a second plurality of solder pads are positioned on a bottom of the housing. A MEMS sensor is then mounted within the at least one internal cavity in any axis for increasing the versatility of the MEMS device.
摘要翻译：用于微电机械系统（MEMS）装置的表面安装多轴腔封装包括具有多个侧面和至少一个内部空腔的基本上立方体的壳体。第一多个焊盘位于壳体的至少一侧，并且第二多个焊盘定位在壳体的底部上。然后将MEMS传感器安装在任何轴上的至少一个内部空腔内，以增加MEMS器件的通用性。

10. 发明授权

US07244895B1 Electrical feedthrough for varied environmental conditions 失效
标题翻译：不同环境条件下的电气馈通
公开(公告)号：US07244895B1
公开(公告)日：2007-07-17
申请号：US11416268
申请日：2006-05-02
申请人： Hamid R. Borzabadi
发明人： Hamid R. Borzabadi
IPC分类号： H02G3/18
CPC分类号： B60R16/0222 , Y10S439/93
摘要： A cost efficient electrical feedthrough is provided for forming a hermetic seal with a container and allowing a desired number of inputs to be connected between varied environmental conditions. The electrical feedthrough can be employed for environmental conditions including high pressures, high temperatures, low temperatures and the presence of corrosive gases. A first wire situated in a first environmental condition and a second wire situated in a second environmental condition are connected via a conducting material. The first environmental condition and the second environmental condition are separated by a divider having an opening for passing therethrough either the first wire or the second wire. A first seal extends from the divider to a material in contact with the conducting material. In an aspect, a second seal forms an enclosed area with the conducting material for surrounding a wire engaging hole and any wire extended therethrough and sealing the first environmental condition from the second environmental condition.
摘要翻译：提供了一种成本有效的电馈通，用于与容器形成气密密封，并允许在各种环境条件之间连接所需数量的输入。电馈通可用于包括高压，高温，低温和腐蚀性气体的环境条件。位于第一环境条件下的第一线和位于第二环境条件下的第二线经由导电材料连接。第一环境条件和第二环境条件由具有用于穿过第一线或第二线的开口的分隔器分开。第一密封件从分隔件延伸到与导电材料接触的材料。在一个方面，第二密封件与导电材料形成封闭区域，用于围绕电线接合孔和延伸穿过其中的任何电线，并将第一环境条件与第二环境条件密封。

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