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1. 发明专利

DE2653833A1 未知
公开(公告)号：DE2653833A1
公开(公告)日：1977-06-08
申请号：DE2653833
申请日：1976-11-26
申请人： HITACHI LTD
发明人： YOSHIMURA MASAYOSHI , OTSUKI KEIZO , SHOJI SENJI , YAMADA TOMIO , SHIMIZU ICHIO , ARAI YUJI
IPC分类号： H01L23/28 , H01L23/495 , H01L23/36
摘要： PURPOSE:To reduce the height of radiation fin, by adjusting the location of the radiation fin, so that one end of the fin laps over the fin adapter plate and the rest of the fin laps over the resin body, and by connecting one end of the fin to the adapter plate.

2. 发明专利

JPS61168947A MANUFACTURE OF SEMICONDUCTOR DEVICE AND LEADFRAME USED IN SAID DEVICE 失效
公开(公告)号：JPS61168947A
公开(公告)日：1986-07-30
申请号：JP901085
申请日：1985-01-23
申请人： HITACHI LTD
发明人： YAMADA TOMIO , SHOJI SENJI , HOSHI AKIRO , OWAKI SEISHIRO
IPC分类号： H01L23/50 , H01L23/495
摘要： PURPOSE:To prevent deformation of the inner end parts of leads, by performing patterning of parts other than the inner end regions of the leads and a chip arranging area at first, and performing the patterning of the inner end regions of the leads and the chip arranging region immediately before chip bonding. CONSTITUTION:The unit lead pattern of a leadframe 1 becomes a conveying pattern 2 by the first lead-pattern forming process. A bonding pattern 3 is obtained by the second lead-pattern forming process. A tab 4 and leads 5 are linked to the conveying pattern 2. The central part of the leadframe 1 is hard to be deformed in handling such as conveying. In the second lead-pattern forming process, precision press molding of the central part of the leadframe is carried out and the tab 4 and the inner end parts of the leads 5 are molded. Thus, the bonding pattern 3 is formed.

3. 发明专利

JPS61152030A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPS61152030A
公开(公告)日：1986-07-10
申请号：JP27283184
申请日：1984-12-26
申请人： HITACHI LTD
发明人： SHOJI SENJI
IPC分类号： H01L21/60
摘要： PURPOSE:To improve bonding property and moisture resistance by a method wherein the surface of metallic wire is coated with a metallic oxide film in a resin sealed semiconductor device. CONSTITUTION:A copper ball 6 is produced by means of heating a metallic wire e.g. copper wire 5 with high purity within reducing atmosphere. Moreover, the copper ball 6 is safely connected to the basic layer below an aluminium electrode 2 without breaking down the electrode 2 by means of bonding the ball 6 keeping the softness thereof without oxidizing within inert or reducing atmosphere. Later the surface is formed into non-conductive part by means of coating the surface of copper wire with a copper oxide 9 as insulator. This non-conductive part with excellent adhesive property to resin is hardly permeated by water etc. Moreover, the semiconductor device may be provided with remarkable moisture resistance since no local cell may be produced between the non-conductive part and aluminium electrode 2 even in case of water permeation.

4. 发明专利

JPS61218149A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS61218149A
公开(公告)日：1986-09-27
申请号：JP5833185
申请日：1985-03-25
申请人： HITACHI LTD
发明人： HATORI KAZUO , ARAKI ISAO , ENOMOTO USUKE , SHOJI SENJI
IPC分类号： H01L21/52 , H01L21/48 , H01L21/58 , H01L23/50
摘要： PURPOSE:To preferably bond without gold or silver plating by removing an oxide film and a working distortion layer formed on the surface of copper or copper alloy used for a lead terminal and forming a surface roughness suitably. CONSTITUTION:A semiconductor chip is formed on a tab 2 at the center of a frame 1 used for a semiconductor integrated circuit, the tab of the chip and the ends of inner leads are connected by Au wirings, and a dam 3 is cut. It is molded with ceramics or resin after the bonding step is completed, but outer leads 5 are projected from the periphery of the package 4, and bent. In the frame 1, an oxide film is removed by electrolytic polishing method, and a working distortion layer is then removed. Further, the surface roughness of copper or copper alloy is suitably provided to further improve the bondability.

5. 发明专利

JPS61168948A LEADFRAME FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE USING SAME 失效
公开(公告)号：JPS61168948A
公开(公告)日：1986-07-30
申请号：JP903985
申请日：1985-01-23
申请人： HITACHI LTD
发明人： SHOJI SENJI , HOSHI AKIRO , OKIKAWA SUSUMU
IPC分类号： H01L23/50 , H01L23/495
摘要： PURPOSE:To make the moisture resistance of a semiconductor device excellent, by forming aluminum layers on a tab, on which a semiconductor chip is mounted, tab suspending leads which hold the tab, and outer connecting terminals. CONSTITUTION:Aluminum plated layers 53 and 54 are provided on a tab 51 of a leadframe, tab suspending leads 52a and 52b are the tip parts of inner leads 1-44. Adhesive property between aluminum and a resin material used for a package is very good. Therefore, infiltrated moisture is hard to intrude furthermore at the forming positions of the aluminum layers. Thus moisture resistance is improved.

6. 发明专利

JPS5942455B2 JPS5942455B2 - 失效
公开(公告)号：JPS5942455B2
公开(公告)日：1984-10-15
申请号：JP10059976
申请日：1976-08-25
申请人： Hitachi Ltd
发明人： SHOJI SENJI
IPC分类号： H05K5/00 , B29C43/00 , B29C45/00 , B29C45/02 , B29C45/14 , B29C45/26 , H01L21/48 , H01L21/56 , H05K5/06

7. 发明专利

JPS61194751A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS61194751A
公开(公告)日：1986-08-29
申请号：JP3434785
申请日：1985-02-25
申请人： HITACHI LTD
发明人： SHOJI SENJI , HOSHI AKIRO , YAMADA TOMIO , OWAKI SEISHIRO , MIYAHARA KIRIO
IPC分类号： H01L23/12 , H01L23/10 , H01L23/50
摘要： PURPOSE:To simplify the structure of a cap, and to facilitate assembly by a method wherein the inner end section of a lead member is bent in a stepped manner along a recessed section in a case member, and fixed to the base of the recessed section in the case member through a glass material together with a pellet, and a cap member is shaped to a flat tabular form, and sealed to the upper surface of the case member through the glass material. CONSTITUTION:The inner end side 3a of a lead member is welded to the base of a recessed section if a case member at a temperature of approximately 450 deg. through glass 7, and the lead member is welded to the upper surface of the case member through glass 8 at the central section of the lead. A semiconductor pellet 5 to which an EPROM element is shaped is fastened to the base of the recessed section in the case through glass 7 at the same low position as the inner lead 3a. The pellet 5 and the inner leads 3a are wire-bonded by small-gage wires 10 consisting of gold or aluminum under the state. A flat tabular cap member 11 composed of high-purity alumina ceramics, through which ultraviolet rays can be transmitted, or transparent glass is sealed to the upper surface of the ceramic case through glass 8 so as to hold the lead. A frame section in a lead frame is cut off after glass sealing.

8. 发明专利

JPS61125159A Cutting method of lead frame 失效
标题翻译：引线框架切割方法
公开(公告)号：JPS61125159A
公开(公告)日：1986-06-12
申请号：JP24602284
申请日：1984-11-22
申请人： Hitachi Ltd
发明人： KIYOZUKA KOICHI , SHIMIZU KAZUO , SHOJI SENJI
IPC分类号： H01L23/50 , H01L23/48 , H01L23/495
CPC分类号： H01L23/49541 , H01L2924/0002 , H01L2924/00
摘要： PURPOSE:To protect outer leads from external force, and to prevent the bending of the outer leads by obliquely cutting a frame section positioned at a section where the outer less mutually penetrate so that the noses of the outer leads are not projected. CONSTITUTION:Frame 1 sections corresponding to sections where outer leads 5 for lead frames in adjacent units mutually penetrate are cut in the directions oblique to the longitudinal directions of the frame 1 sections. Consequently, frames 11 for protection protecting the leads 5 from external force are formed outside the leads 5. Accordingly, the leads 5 are protected from external force, and the bending of the leads 5 is prevented.
摘要翻译：目的：为了保护外部引线免受外力的影响，并且通过倾斜地切割位于外部较少相互穿透的部分的框架部分，防止外部引线的弯曲，从而外部引线的鼻部不会突出。构成：对应于相邻单元中的引线框架的外引线5相互穿透的部分的框架1部分沿与框架1部分的纵向倾斜的方向被切割。因此，用于保护引线5免受外力的保护的框架11形成在引线5的外部。因此，引线5被保护免受外力，并且防止引线5的弯曲。

9. 发明专利

JPS6157319A Resin molding method of electronic parts 失效
标题翻译：电子部件树脂成型方法
公开(公告)号：JPS6157319A
公开(公告)日：1986-03-24
申请号：JP17414085
申请日：1985-08-09
申请人： Hitachi Ltd
发明人： SHOJI SENJI
IPC分类号： B29C39/10 , B29C39/26 , B29L31/34 , H01G9/08 , H01L21/56
摘要： PURPOSE: To prevent generation of burrs on a lead part, by so constituting a lead frame that the other cavity is provided on a position corresponding to a lead part of the outside of the lead frame and resin is poured within a cavity provided corresponding to a principal part.
CONSTITUTION: A surface side and a back side of a lead frame 13 are provided respectively with a top force 11 and a bottom force 12 and the dimensions of a cavity 21 in a widthward and heightward directions are made smaller than those of cavities 14 positioned on both sides of the cavity 21. A tab part 20 of the lead frame 13 is provided with a semiconductor pellet and electric connection is applied to a space between an electrode provided on the semiconductor pellet and lead part of the outside by a wire. Contact bonding of the top force 11 and bottom force 12 is performed respectively from the surface side and th back side of the lead frame 13 under such condition, which is made to concentrate by pouring molding resin within the cavity 14 from a runner 16 and generation of burrs is prevented.
COPYRIGHT: (C)1986,JPO&Japio
摘要翻译：目的：为了防止在引线部分产生毛刺，通过构成引线框架，使另一个腔体设置在与引线框架的外部的引线部分相对应的位置处，树脂被倒入相应于引线框架主体。构成：引线框架13的表面侧和后侧分别设置有顶部力11和底部力12，并且使空腔21在宽度方向和高度方向上的尺寸小于位于其上的空腔14的尺寸引线框架13的突片部分20设置有半导体芯片，并且通过导线将电连接施加到设置在半导体芯片上的电极和外部引线部分之间的空间。在引导框架13的表面侧和后侧分别进行顶部力11和底部力12的接触接合，在这样的状态下，通过从浇道16将浇注树脂注入到模腔14内并使其产生的毛刺被阻止。

10. 发明专利

JPS51102553A 失效
公开(公告)号：JPS51102553A
公开(公告)日：1976-09-10
申请号：JP2709175
申请日：1975-03-07
申请人： HITACHI LTD
发明人： SHOJI SENJI , FUKUYAMA MASATAKA , YAMANAKA KOJI
IPC分类号： H01L21/22 , H01L21/31

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