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1. 发明授权

US3659821A Structure for plastic encapsulation of semiconductor devices 失效
标题翻译：用于塑料封装半导体器件的结构
公开(公告)号：US3659821A
公开(公告)日：1972-05-02
申请号：US3659821D
申请日：1969-07-10
申请人： HITACHI LTD
发明人： SAKAMOTO YUZABURO , OTSUKI KEIZO
IPC分类号： B29C45/14 , H01L21/56 , B29F1/06
CPC分类号： H01L21/565 , B29C45/14655 , H01L2924/0002 , H01L2924/00
摘要： An improvement in a plastic encapsulating process for semiconductor devices, wherein parts of a sheet-like thin insert are embedded in plastic material injected into cavities in a two-part mold, said insert being loaded or positioned on the cavity part of said mold, characterized in that at least either a projected or recesses portion, and correspondingly either a recessed or projected portion, have been in advance constructed respectively on each side edge of said insert and on said cavity part of the mold near the injection gate therein contacting each other so as to prevent an outflow of plastic material from said injection gate along a peripheral gap created between said side edge of the insert and the cavity part of the mold any further than their contacting point which acts as a stopper in said gap, producing an undesirable channel for plastic material to flow.
摘要翻译：对于半导体器件的塑料封装方法的改进，其中片状薄插入件的部分嵌入注入到两部分模具中的空腔中的塑料材料中，所述插入件被加载或定位在所述模具的空腔部分其特征在于，预先分别在所述插入件的每个侧边缘上以及在注射门附近的模具的所述空腔部分上分别构造了突出部分或凹部部分以及相应地凹入或突出部分中的至少一个，另一个，以便防止塑料材料从所述注射门沿着在所述插入件的所述侧边缘和所述模具的空腔部分之间产生的周边间隙进一步流出，所述外围间隙比其作为所述间隙中的塞子的接触点更远，塑料材料流通的不良通道。

2. 发明专利

HK53183A A LEAD FRAME AND A SEMICONDUCTOR DEVICE MADE BY USE OF THE LEAD FRAME 未知
公开(公告)号：HK53183A
公开(公告)日：1983-11-18
申请号：HK53183
申请日：1983-11-10
申请人： HITACHI LTD
发明人： OTSUKI KEIZO , MOCHIZUKI HIDETOSHI , SUZUKI AKIRA , ADACHI YOSHIO , KOSAKA HIDEKI , MURAKAMI GEN
IPC分类号： H01L23/50 , H01L23/31 , H01L23/495 , H01L23/48
摘要： This invention relates to a lead frame which is applied to a resin-molded semiconductor device. According to the lead frame of this invention, a quadrangular tab for supporting a semiconductor pellet is supported by four tab leads which extend along diagonal lines of the tab.

3. 发明专利

DE2653833A1 未知
公开(公告)号：DE2653833A1
公开(公告)日：1977-06-08
申请号：DE2653833
申请日：1976-11-26
申请人： HITACHI LTD
发明人： YOSHIMURA MASAYOSHI , OTSUKI KEIZO , SHOJI SENJI , YAMADA TOMIO , SHIMIZU ICHIO , ARAI YUJI
IPC分类号： H01L23/28 , H01L23/495 , H01L23/36
摘要： PURPOSE:To reduce the height of radiation fin, by adjusting the location of the radiation fin, so that one end of the fin laps over the fin adapter plate and the rest of the fin laps over the resin body, and by connecting one end of the fin to the adapter plate.

4. 发明专利

DE2931449A1 未知
公开(公告)号：DE2931449A1
公开(公告)日：1980-02-21
申请号：DE2931449
申请日：1979-08-02
申请人： HITACHI LTD
发明人： OTSUKI KEIZO
IPC分类号： H01L23/50 , H01L23/31 , H01L23/495 , H01L23/48
摘要： This invention relates to a lead frame which is applied to a resin-molded semiconductor device. According to the lead frame of this invention, a quadrangular tab for supporting a semiconductor pellet is supported by four tab leads which extend along diagonal lines of the tab.

5. 发明专利

DE2730182A1 未知
公开(公告)号：DE2730182A1
公开(公告)日：1978-01-19
申请号：DE2730182
申请日：1977-07-04
申请人： HITACHI LTD
发明人： SAEKI JUN-ICHI , KANEDA AIZO , OTSUKI KEIZO
IPC分类号： H01L21/56 , B29C33/00 , B29C41/00 , B29C43/00 , B29C45/00 , B29C45/02 , B29C45/26 , B29C45/27 , B29C45/38 , B29C45/40 , B29C45/77 , B29C1/00
摘要： A mold die including two or more cavities shaped to profile the configuration of mold products, a pot serving as a lead-in portion for resin of a tablet-form, or a sprue serving as a lead-in portion for molten resin, a runner leading to the pot or sprue, and gates branching from the runner and leading to respective cavities, the aforesaid gates having given convergent slopes at their exits to the cavities. The cross-sectional area of the runner is progressively decreased in the direction away from the pot or sprue, and the convergent slopes of the gates are progressively increased in the direction away from the pot or sprue, in a manner that the sum of a pressure drop in a runner portion and a pressure drop in a gate portion may be made equal for each of the cavities, thereby minimizing a difference in timing of resin to arrive respective cavities, and rendering the velocity of resin flowing into respective cavities equal to one another.

6. 发明专利

JPS61258496A MOUNTING OF ELECTRONIC COMPONENT 失效
公开(公告)号：JPS61258496A
公开(公告)日：1986-11-15
申请号：JP11725686
申请日：1986-05-23
申请人： HITACHI LTD
发明人： OTSUKI KEIZO , SHIMIZU KAZUO , INOUE FUMIHITO , OKIKAWA SUSUMU
IPC分类号： H05K1/18 , H05K3/34

7. 发明专利

JPS61258461A ELECTRONIC PART 失效
公开(公告)号：JPS61258461A
公开(公告)日：1986-11-15
申请号：JP11725486
申请日：1986-05-23
申请人： HITACHI LTD
发明人： OTSUKI KEIZO , SHIMIZU KAZUO , INOUE FUMIHITO , OKIKAWA SUSUMU
IPC分类号： H01L23/50 , H01L23/28 , H01L23/495 , H05K3/34
摘要： PURPOSE:To reduce the cost of a wiring board and improve a mounting density by a method wherein a tab, a circuit element and parts of leads are sealed with sealing resin and the free ends of the leads exposed from the sealing resin are plated. CONSTITUTION:An electronic part 7 is composed of a cuboid sealing part 8 and a plurality of leads 9 which are extended from the sides of the sealing part 8 and bent downward at their intermediate portions. The tips of the leads 9 extended downward touch the upper surface of a wiring board 10 and those touching parts are fixed with solder 11, welding material, to fix the electronic part 7 to the wiring board 10. Therefore, it is not necessary to drill fitting holes in the wiring board 10. By reducing the length H of the lead 9, possibility of catching the leads during the handling of the electronic parts can be reduced so that the creation of bent leads can be suppressed. With this constitution, the cost of the wiring board can be reduced and the mounting density can be improved.

8. 发明专利

JPS63296258A MOUNTING STRUCTURE OF ELECTRONIC COMPONENT 失效
公开(公告)号：JPS63296258A
公开(公告)日：1988-12-02
申请号：JP1066888
申请日：1988-01-22
申请人： HITACHI LTD
发明人： INOUE FUMIHITO , SHIMIZU KAZUO , OKIKAWA SUSUMU , OTSUKI KEIZO , YANAGIDA TAKEHIKO
IPC分类号： H01L23/50 , H05K1/02 , H05K3/34
摘要： PURPOSE:To obtain structure good in a heat-dissipation effect, by providing both facing sides of tabs with a plurality of tab link leads respectively and next by drawing the tab link leads partially outside from a resin sealed matter and connecting them to a conductor layer of a wiring substrate. CONSTITUTION:Both facing sides 11a, 11b of a tab 11 of a lead frame made of a copper plate are provided connectedly with a plurality of tab leads 12, 13 so that heat transfer (heat-dissipation) effect can be upgraded. A circuit element 10 is fixed on the tab 11, and electrodes of the element are connected 15 to their corresponding leads 12, and resin 16 is used to seal the element. The leads 13 are detached to be separated from an outer frame. Since this composition allow a plurality of tab lead 12' s end parts to be exposed outside to the sealed matter 16, a heat-dissipation effect is improved. Accordingly heat generated from the circuit element can be radiated from a plurality of the tab link leads on both its sides.

9. 发明专利

JPS62282455A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS62282455A
公开(公告)日：1987-12-08
申请号：JP8091387
申请日：1987-04-03
申请人： HITACHI LTD
发明人： MOCHIZUKI HIDETOSHI , OTSUKI KEIZO , SUZUKI AKIRA , ADACHI YOSHIO , KOSAKA HIDEKI , MURAKAMI HAJIME
IPC分类号： H01L23/50 , H01L23/495
摘要： PURPOSE:To prevent the stress concentrated on the corner parts of dam pieces of a rectangular frame due to the difference in the thermal expansion coefficient between a resin and the lead frame from deforming the frame part of lead frame by method wherein a lead frame provided with isolating slits is arranged between the corner parts of dam pieces and the frame part to resin-mold a semiconductor element using the lead frame. CONSTITUTION:Within a resin mold type semiconductor device using a lead from, rectangular framed dam pieces 20 are provided on the peripheral part of rectangular tabs 12 to provide a frame part 10 with guide holes 21 on the dam pieces 20 along the periphery of dam pieces 20. A lead frame provided with isolating slits 24 is arranged between the corner parts of dam pieces 20 and the frame part 10 to resinmold a semiconductor element using the lead frame. In such a constitution, even if the resin and the lead frame during the resin molding process are subjected to stress and hardening or contraction of resin, etc., due to the difference in thermal contraction of resin and lead frame, the corner parts of dam pieces 20 whereon said stress, etc., are concentrated can be easily deformed in the direction along the surface of lead frame so that the frame part 10 of lead frame may be subjected to no deformation.

10. 发明专利

JPS61258460A LEAD FRAME FOR ELECTRONIC PART 失效
公开(公告)号：JPS61258460A
公开(公告)日：1986-11-15
申请号：JP11725386
申请日：1986-05-23
申请人： HITACHI LTD
发明人： OTSUKI KEIZO , SHIMIZU KAZUO , INOUE FUMIHITO , OKIKAWA SUSUMU
IPC分类号： H01L23/50 , H01L23/495 , H05K3/34
摘要： PURPOSE:To reduce the cost of a wiring board and improve a mounting density by a method wherein a rectangular tab fixing a circuit element and a plurality of leads arranged along the sides of the tabs are provided and tips of the leads are made to be free. CONSTITUTION:An electronic part 7 is composed of a rectangular parallelepiped sealing part 8 and a plurality of leads 9 which are extended from the sides of the sealing part 8 and bent downward at their intermediate portions. The tips of the leads 9 extended downward touch the upper surface of a wiring board 10 and those touching parts are fixed with solder 11 to fix the electronic part 7 to the wiring board 10. Therefore, it is not necessary to drill fitting holes in the wiring board 10. By reducing the distance (l) from the outside end of the sealing part 8 to the bent part of the lead 9 as much as possible, a mounting area can be further reduced. With this constitution, the cost of the wiring board can be reduced and the mounting density can be improved.

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