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    • 3. 发明授权
    • Low temperature adhesion bonding method for composite substrates
    • 复合基板的低温粘接方法
    • US6093577A
    • 2000-07-25
    • US902993
    • 1997-07-30
    • Sonja van der GroenKris Baert
    • Sonja van der GroenKris Baert
    • G02F1/1362H01L21/20H01L21/00H01L21/30H01L21/44H01L21/48
    • G02F1/13454H01L21/2007H01L2221/68359H01L2221/68363
    • A method of bonding a first substrate (10) to a second substrate (30) is described, comprising the steps of: coating an adhesive (28) onto a first major surface of said first substrate (10); aligning said first and second substrates (10, 30) so that said coated first major surface of said first substrate (10) is facing said second substrate (30) and is separated therefrom by a gap (47); deflecting at least one of said first and second substrates (10, 30) by exerting a pressure between said first and second substrates (10, 30) substantially at the center thereof so that the adhesive coating (28) substantially at the center of said first substrate (10) comes into contact with said second substrate (30); and allowing the remaining parts of said adhesive coated first major surface of said first substrate (10) to come into contact with said second substrate (30). Use of the method to produce composites, in particular transmissive liquid crystal display panels is also described.
    • 描述了将第一衬底(10)接合到第二衬底(30)的方法,包括以下步骤:将粘合剂(28)涂覆到所述第一衬底(10)的第一主表面上; 对准所述第一和第二基板(10,30),使得所述第一基板(10)的所述涂覆的第一主表面面向所述第二基板(30)并且通过间隙(47)与其分离; 通过在所述第一和第二基板(10,30)之间的中心施加压力来使所述第一和第二基板(10,30)中的至少一个基板偏转,使得所述粘合剂涂层(28)基本上位于所述第一和第二基板 衬底(10)与所述第二衬底(30)接触; 并且允许所述第一衬底(10)的所述粘合剂涂覆的第一主表面的其余部分与所述第二衬底(30)接触。 还描述了使用该方法来生产复合材料,特别是透射型液晶显示面板。