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    • 5. 发明授权
    • High-gain photodetector with separated PN junction and rare earth doped region and a method of forming the same
    • 具有分离的PN结和稀土掺杂区的高增益光电探测器及其形成方法
    • US06943390B2
    • 2005-09-13
    • US10142264
    • 2002-05-08
    • Salvatore CoffaSebania LibertinoFerruccio Frisina
    • Salvatore CoffaSebania LibertinoFerruccio Frisina
    • H01L31/0288H01L31/107H01L27/148
    • H01L31/107H01L31/0288Y02B10/10Y02E10/50
    • The high-gain photodetector is formed in a semiconductor-material body which houses a PN junction and a sensitive region that is doped with rare earths, for example erbium. The PN junction forms an acceleration and gain region separate from the sensitive region. The PN junction is reverse-biased and generates an extensive depletion region accommodating the sensitive region. Thereby, the incident photon having a frequency equal to the absorption frequency of the used rare earth crosses the PN junction, which is transparent to light, can be captured by an erbium ion in the sensitive region, so as to generate a primary electron, which is accelerated towards the PN junction by the electric field present, and can, in turn, generate secondary electrons by impact, according to an avalanche process. Thereby, a single photon can give rise to a cascade of electrons, thus considerably increasing detection efficiency.
    • 高增益光电检测器形成在容纳PN结的半导体材料体和掺杂有稀土(例如铒)的敏感区域中。 PN结形成与敏感区域分离的加速度和增益区域。 PN结被反向偏置并且产生容纳敏感区域的广泛的耗尽区域。 因此,具有等于所使用的稀土的吸收频率的频率的入射光子穿过对光透明的PN结,可以在敏感区域中被铒离子捕获,以便产生一次电子,其中 通过存在的电场而朝向PN结加速,并且根据雪崩过程又可以通过冲击产生二次电子。 因此,单个光子可以产生级联的电子,从而显着提高检测效率。
    • 10. 发明授权
    • Method of manufacturing an integrated edge structure for high voltage semiconductor devices, and related integrated edge structure
    • 制造用于高压半导体器件的集成边缘结构的方法以及相关的集成边缘结构
    • US06809383B2
    • 2004-10-26
    • US09925080
    • 2001-08-08
    • Ferruccio Frisina
    • Ferruccio Frisina
    • H01L2974
    • H01L29/7811H01L29/0619H01L29/0623H01L29/0634H01L29/66712H01L29/7802H01L2924/0002H01L2924/00
    • Method of manufacturing an edge structure for a high voltage semiconductor device, including a first step of forming a first semiconductor layer of a first conductivity type, a second step of forming a first mask over the top surface of the first semiconductor layer, a third step of removing portions of the first mask in order to form at least one opening in it, a fourth step of introducing dopant of a second conductivity type in the first semiconductor layer through the at least one opening, a fifth step of completely removing the first mask and of forming a second semiconductor layer of the first conductivity type over the first semiconductor layer, a sixth step of diffusing the dopant implanted in the first semiconductor layer in order to form a doped region of the second conductivity type in the first and second semiconductor layers. The second step up to the sixth step are repeated at least one time in order to form a final edge structure including a number of superimposed semiconductor layers of the first conductivity type and at least two columns of doped regions of the second conductivity type, the columns being inserted in the number of superimposed semiconductor layers and formed by superimposition of the doped regions subsequently implanted through the mask openings, the column near the high voltage semiconductor device being deeper than the column farther from the high voltage semiconductor device.
    • 制造高压半导体器件的边缘结构的方法,包括形成第一导电类型的第一半导体层的第一步骤,在第一半导体层的顶表面上形成第一掩模的第二步骤,第三步骤 去除所述第一掩模的部分以在其中形成至少一个开口;第四步骤,通过所述至少一个开口在所述第一半导体层中引入第二导电类型的掺杂剂;第五步骤,完全去除所述第一掩模 以及在第一半导体层上形成第一导电类型的第二半导体层,第六步骤,在第一半导体层和第二半导体层中形成第二导电类型的掺杂区, 。 至少第一步的第二步重复至少一次以便形成最终边缘结构,其包括多个第一导电类型的叠加半导体层和至少两列第二导电类型的掺杂区域,列 以叠加的半导体层的数量插入并且通过随后通过掩模开口注入的掺杂区的叠加而形成,高压半导体器件附近的列比离高压半导体器件更远的列深。