会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明授权
    • Semiconductor device with surge protective component and method of manufacturing the semiconductor device
    • 具有浪涌保护元件的半导体器件和半导体器件的制造方法
    • US06806510B2
    • 2004-10-19
    • US10014407
    • 2001-12-14
    • Minoru SuzukiSusumu Yoshida
    • Minoru SuzukiSusumu Yoshida
    • H01L2974
    • H01L29/66121H01L29/87
    • In order to provide a reliable surge protective component with a straightforward manufacturing process, first and second buried layers are diffused over the entire inside surfaces of a semiconductor substrate, and first and second base layers are then diffused over the entire inside surfaces of the first and second buried layers. First and second emitter layers are then partially diffused at the inside of the first and second base layers. The peripheries of the first and second emitter layers are then surrounded by first and second moats, the bottoms of which reach the first and second buried layers. A PN junction formed between the first and second base layers and first and second buried layers is then simply a planar junction.
    • 为了提供具有直接制造工艺的可靠的浪涌保护部件,第一和第二掩埋层在半导体衬底的整个内表面上扩散,然后第一和第二基底层在第一和第二衬底的整个内表面上扩散 第二埋层。 然后,第一和第二发射极层在第一和第二基极层的内部部分地扩散。 然后,第一和第二发射极层的周边被第一和第二护城河围绕,第一和第二护城河的底部到达第一和第二掩埋层。 形成在第一和第二基底层与第一和第二掩埋层之间的PN结就是简单的平面结。
    • 8. 发明授权
    • ESD protective transistor
    • ESD保护晶体管
    • US06680493B1
    • 2004-01-20
    • US09889336
    • 2001-10-20
    • Heinrich WolfWolfgang WilkeningStephan Mettler
    • Heinrich WolfWolfgang WilkeningStephan Mettler
    • H01L2974
    • H01L27/0259
    • An ESD protective transistor comprises a heavily doped p-type base region which is arranged in a lightly doped p-well and which is provided with a first terminal. Furthermore, a heavily doped n-type emitter region is arranged in the lightly doped p-well. A heavily doped n-type collector region is separated from the lightly doped p-well through a lightly doped n-type region and is provided with a second terminal. The heavily doped n-type emitter region is not short-circuited with the heavily doped base region viy a common electrode and is of floating design. The doping types of the respective regions may be reversed.
    • ESD保护晶体管包括重掺杂的p型基区,其布置在轻掺杂的p阱中并且设置有第一端。 此外,重掺杂的n型发射极区域布置在轻掺杂的p阱中。 通过轻掺杂的n型区域将重掺杂的n型集电极区域与轻掺杂的p阱分离,并且设置有第二端子。 重掺杂的n型发射极区域不会与重掺杂的基极区域短路,并且具有浮动设计。 各个区域的掺杂类型可以相反。
    • 10. 发明授权
    • Memory device
    • 内存设备
    • US06653665B2
    • 2003-11-25
    • US10073338
    • 2002-02-13
    • Takeshi Kajiyama
    • Takeshi Kajiyama
    • H01L2974
    • H01L21/84H01L27/11H01L27/1203H01L29/7436
    • A semiconductor device according to an aspect of the present invention includes a substrate having a semiconductor substrate and a semiconductor layer provided on the semiconductor substrate, said semiconductor layer being insulated by an insulating film; a thyristor with a gate, its pnpn structure being laterally formed in said semiconductor layer of said substrate; and a transistor formed in said semiconductor layer of said substrate; said transistor being connected to one terminal of said thyristor. A method of manufacturing a semiconductor device according to other aspect of the present invention includes defining an element forming region isolated by an element isolation insulation film in a semiconductor layer of a first conductivity type provided on a semiconductor substrate, said semiconductor layer being insulated by an insulation film provided on the semiconductor substrate; forming a second base region of a first conductivity type in said element forming region; forming a first gate electrode of the thyristor and a second gate of the transistor above said second base region, said first and second gate electrodes being arranged in parallel; implanting ions to form a source and drain diffused regions of the second conductivity at both sides of said second gate electrode, and to form, at the same time, a second emitter region of the second conductivity type and a first base region, one of said source and drain diffused regions and said second emitter region being common region; providing a hole penetrating said first base region and said insulating film under said base region; and filling said hole with material of the first conductivity type to obtain a plug member as a first emitter region which contacts said semiconductor substrate.
    • 根据本发明的一个方面的半导体器件包括具有半导体衬底和设置在半导体衬底上的半导体层的衬底,所述半导体层被绝缘膜绝缘; 具有栅极的晶闸管,其pnpn结构横向形成在所述衬底的所述半导体层中; 以及形成在所述衬底的所述半导体层中的晶体管; 所述晶体管连接到所述晶闸管的一个端子。 根据本发明的另一方面的制造半导体器件的方法包括限定由设置在半导体衬底上的第一导电类型的半导体层中的元件隔离绝缘膜隔离的元件形成区域,所述半导体层由 设置在半导体基板上的绝缘膜; 在所述元件形成区域中形成第一导电类型的第二基区; 形成所述晶闸管的第一栅电极和位于所述第二基极区之上的所述晶体管的第二栅极,所述第一和第二栅极平行布置; 注入离子以在所述第二栅电极的两侧形成源极和漏极扩散区域,并且同时形成第二导电类型的第二发射极区域和第一基极区域,所述第一基极区域中的一个 源极和漏极扩散区域和所述第二发射极区域是公共区域; 在所述基底区域提供穿透所述第一基底区域和所述绝缘膜的孔; 以及用所述第一导电类型的材料填充所述孔,以获得作为与所述半导体衬底接触的第一发射极区的插塞构件。