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    • 2. 发明授权
    • High-gain photodetector with separated PN junction and rare earth doped region and a method of forming the same
    • 具有分离的PN结和稀土掺杂区的高增益光电探测器及其形成方法
    • US06943390B2
    • 2005-09-13
    • US10142264
    • 2002-05-08
    • Salvatore CoffaSebania LibertinoFerruccio Frisina
    • Salvatore CoffaSebania LibertinoFerruccio Frisina
    • H01L31/0288H01L31/107H01L27/148
    • H01L31/107H01L31/0288Y02B10/10Y02E10/50
    • The high-gain photodetector is formed in a semiconductor-material body which houses a PN junction and a sensitive region that is doped with rare earths, for example erbium. The PN junction forms an acceleration and gain region separate from the sensitive region. The PN junction is reverse-biased and generates an extensive depletion region accommodating the sensitive region. Thereby, the incident photon having a frequency equal to the absorption frequency of the used rare earth crosses the PN junction, which is transparent to light, can be captured by an erbium ion in the sensitive region, so as to generate a primary electron, which is accelerated towards the PN junction by the electric field present, and can, in turn, generate secondary electrons by impact, according to an avalanche process. Thereby, a single photon can give rise to a cascade of electrons, thus considerably increasing detection efficiency.
    • 高增益光电检测器形成在容纳PN结的半导体材料体和掺杂有稀土(例如铒)的敏感区域中。 PN结形成与敏感区域分离的加速度和增益区域。 PN结被反向偏置并且产生容纳敏感区域的广泛的耗尽区域。 因此,具有等于所使用的稀土的吸收频率的频率的入射光子穿过对光透明的PN结,可以在敏感区域中被铒离子捕获,以便产生一次电子,其中 通过存在的电场而朝向PN结加速,并且根据雪崩过程又可以通过冲击产生二次电子。 因此,单个光子可以产生级联的电子,从而显着提高检测效率。
    • 7. 发明授权
    • Integrated device with Schottky diode and MOS transistor and related manufacturing process
    • 集成器件采用肖特基二极管和MOS晶体管及相关制造工艺
    • US07071062B2
    • 2006-07-04
    • US11023957
    • 2004-12-28
    • Mario SaggioFerruccio Frisina
    • Mario SaggioFerruccio Frisina
    • H01L21/336
    • H01L29/66712H01L29/0634H01L29/1095H01L29/42376H01L29/4238H01L29/7806
    • An integrated device comprising a MOS transistor and a Schottky diode which are formed on a semiconductor substrate of a first conductivity type is shown. The device comprises a plurality of body region stripes of a second conductivity type which are adjacent and parallel to each other, a first metal layer placed over said substrate and a second metal layer placed under said substrate. The device comprises a plurality of elementary structures parallel to each other each one of which comprises first zones provided with a silicon oxide layer placed over a portion of the substrate which is comprised between two adjacent body region stripes, a polysilicon layer superimposed to the silicon oxide layer, a dielectric layer placed over and around the polysilicon layer. Some body region stripes comprise source regions of the first conductivity type which are placed adjacent to the first zones of the elementary structures to form elementary cells of said MOS transistor. The elementary structures and the body regions stripes extend longitudinally in a transversal way to the formation of the channel in the elementary cells of the MOS transistor and the first metal layer contacts the source regions. At least one elementary structure comprises at least a second zone adapted to allow the direct contact between the first metal layer and the underlying substrate portion arranged between two adjacent body regions stripes to perform the Schottky diode.
    • 示出了包括形成在第一导电类型的半导体衬底上的MOS晶体管和肖特基二极管的集成器件。 该装置包括彼此相邻并平行的第二导电类型的多个体区条纹,放置在所述基底上的第一金属层和置于所述基底下的第二金属层。 该器件包括彼此平行的多个基本结构,每个基本结构包括第一区域,该第一区域设置有位于两个相邻体区条纹之间的衬底的一部分上的氧化硅层,叠加到氧化硅上的多晶硅层 层,放置在多晶硅层上方和周围的介电层。 一些体区条纹包括与基本结构的第一区相邻放置的第一导电类型的源区,以形成所述MOS晶体管的元件。 基本结构和体区条纹以横向方式纵向延伸,以在MOS晶体管的基本单元中形成沟道,并且第一金属层接触源极区。 至少一个基本结构包括至少第二区域,适于允许第一金属层与布置在两个相邻体区条纹之间的下面的基底部分之间的直接接触以执行肖特基二极管。
    • 8. 发明授权
    • MOS technology power device
    • MOS技术电源设备
    • US06404010B2
    • 2002-06-11
    • US09860809
    • 2001-05-17
    • Mario SaggioFerruccio FrisinaAngelo Magri'
    • Mario SaggioFerruccio FrisinaAngelo Magri'
    • H01L2976
    • H01L29/7802H01L29/0615H01L29/0619H01L29/0634
    • A MOS technology power device is described which comprises a plurality of elementary active units and a part of said power device which is placed between zones where the elementary active units are formed. The part of the power device comprises at least two heavily doped body regions of a first conductivity type which are formed in a semiconductor layer of a second conductivity type, a first lightly doped semiconductor region of the first conductivity type which is placed laterally between the two body regions. The first semiconductor region is placed under a succession of a thick silicon oxide layer, a polysilicon layer and a metal layer. A plurality of second lightly doped semiconductor regions of the first conductivity type are placed under said at least two heavily doped body regions and under said first lightly doped semiconductor region of the first conductivity type, each region of said plurality of second lightly doped semiconductor regions of the first conductivity type being separated from the other by portions of said semiconductor layer of the second conductivity type.
    • 描述了MOS技术功率器件,其包括多个基本有源单元和放置在形成基本有源单元的区域之间的所述功率器件的一部分。 功率器件的一部分包括形成在第二导电类型的半导体层中的第一导电类型的至少两个重掺杂体区域,第一导电类型的第一轻掺杂半导体区域横向放置在两者之间 身体区域。 第一半导体区域被放置在一连串厚的氧化硅层,多晶硅层和金属层之下。 第一导电类型的多个第二轻掺杂半导体区域被放置在所述至少两个重掺杂体区域的下方,并且在所述第一导电类型的所述第一轻掺杂半导体区域的下方,所述多个第二轻掺杂半导体区域的每个区域 所述第一导电类型通过所述第二导电类型的所述半导体层的一部分与另一个分离。
    • 9. 发明申请
    • Integrated device with Schottky diode and MOS transistor and related manufacturing process
    • 集成器件采用肖特基二极管和MOS晶体管及相关制造工艺
    • US20050118766A1
    • 2005-06-02
    • US11023957
    • 2004-12-28
    • Mario SaggioFerruccio Frisina
    • Mario SaggioFerruccio Frisina
    • H01L21/336H01L29/06H01L29/78
    • H01L29/66712H01L29/0634H01L29/1095H01L29/42376H01L29/4238H01L29/7806
    • An integrated device comprising a MOS transistor and a Schottky diode which are formed on a semiconductor substrate of a first conductivity type is shown. The device comprises a plurality of body region stripes of a second conductivity type which are adjacent and parallel to each other, a first metal layer placed over said substrate and a second metal layer placed under said substrate. The device comprises a plurality of elementary structures parallel to each other each one of which comprises first zones provided with a silicon oxide layer placed over a portion of the substrate which is comprised between two adjacent body region stripes, a polysilicon layer superimposed to the silicon oxide layer, a dielectric layer placed over and around the polysilicon layer. Some body region stripes comprise source regions of the first conductivity type which are placed adjacent to the first zones of the elementary structures to form elementary cells of said MOS transistor. The elementary structures and the body regions stripes extend longitudinally in a transversal way to the formation of the channel in the elementary cells of the MOS transistor and the first metal layer contacts the source regions. At least one elementary structure comprises at least a second zone adapted to allow the direct contact between the first metal layer and the underlying substrate portion arranged between two adjacent body regions stripes to perform the Schottky diode.
    • 示出了包括形成在第一导电类型的半导体衬底上的MOS晶体管和肖特基二极管的集成器件。 该装置包括彼此相邻并平行的第二导电类型的多个体区条纹,放置在所述基底上的第一金属层和置于所述基底下的第二金属层。 该器件包括彼此平行的多个基本结构,每个基本结构包括第一区域,该第一区域设置有位于两个相邻体区条纹之间的衬底的一部分上的氧化硅层,叠加到氧化硅上的多晶硅层 层,放置在多晶硅层上方和周围的介电层。 一些体区条纹包括与基本结构的第一区相邻放置的第一导电类型的源区,以形成所述MOS晶体管的元件。 基本结构和体区条纹以横向方式纵向延伸,以在MOS晶体管的基本单元中形成沟道,并且第一金属层接触源极区。 至少一个基本结构包括至少第二区域,其适于允许第一金属层与布置在两个相邻体区条纹之间的下面的衬底部分之间的直接接触以执行肖特基二极管。