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1. 发明授权

US06577970B2 Method of determining a crystallographic quality of a material located on a substrate 有权
公开(公告)号：US06577970B2
公开(公告)日：2003-06-10
申请号：US09801455
申请日：2001-03-08
申请人： Erik C. Houge , John M. McIntosh , Larry E. Plew , Fred A. Stevie , Catherine Vartuli
发明人： Erik C. Houge , John M. McIntosh , Larry E. Plew , Fred A. Stevie , Catherine Vartuli
IPC分类号： G01N3700
CPC分类号： G01N23/225
摘要： The present invention provides a method of determining a crystallographic quality of a material located on a substrate. The method includes determining a set of crystallographic solutions for an unknown crystallographic orientation, and subsequently comparing the set of crystallographic solutions to adjacent known crystallographic orientations to determine the unknown crystallographic orientation. In a preferred embodiment, the set of crystallographic solutions may be a rank of crystallographic solutions which may represent the most probable crystallographic orientations. The rank of crystallographic solutions, in an alternative embodiment, may be represented by a vote, a fit and a confidence index.

2. 发明授权

US06627885B1 Method of focused ion beam pattern transfer using a smart dynamic template 有权
标题翻译：使用智能动态模板的聚焦离子束图案转移方法
公开(公告)号：US06627885B1
公开(公告)日：2003-09-30
申请号：US09631545
申请日：2000-08-03
申请人： John M. McIntosh , Erik C. Houge , Fred A. Stevie , Catherine Vartuli , Scott Jessen
发明人： John M. McIntosh , Erik C. Houge , Fred A. Stevie , Catherine Vartuli , Scott Jessen
IPC分类号： H01J3726
CPC分类号： G03F1/74 , G03F1/84 , H01J37/28 , H01J2237/2817
摘要： The present invention provides a method of forming a dynamic template with a focused beam. The method includes forming a desired template that represents a desired image, forming an actual template that represents an actual image, such as a photolithographic mask or a semiconductor device feature, and comparing the desired template to the actual template to yield a deviation template. In one embodiment the deviation template is formed by subtracting the actual template from the desired template.
摘要翻译：本发明提供了一种用聚焦光束形成动态模板的方法。该方法包括形成表示期望图像的所需模板，形成表示实际图像的实际模板，例如光刻掩模或半导体器件特征，并将所需模板与实际模板进行比较以产生偏差模板。在一个实施例中，通过从期望的模板中减去实际模板来形成偏差模板。

3. 发明授权

US06265235B1 Method of sectioning of photoresist for shape evaluation 失效
标题翻译：用于形状评估的光刻胶的切片方法
公开(公告)号：US06265235B1
公开(公告)日：2001-07-24
申请号：US09383154
申请日：1999-08-25
申请人： John M. McIntosh , Erik C. Houge , Brittin C. Kane , Simon J. Molloy , Catherine Vartuli
发明人： John M. McIntosh , Erik C. Houge , Brittin C. Kane , Simon J. Molloy , Catherine Vartuli
IPC分类号： H01L2166
CPC分类号： H01L22/12 , Y10S977/855
摘要： A non-destructive method for evaluating a topographical feature 16 of an integrated circuit 42, such as a photoresist runner, includes core sectioning the feature to remove a small section 22, without damage to the remainder of the wafer 36 on which the integrated circuit is formed. A tool having fine adjustment, such as a micromanipulator with a rod-shaped probe 24 in the form of a glass needle, is used to remove the section for examination and metrology. The section is separated from the underlying substrate surface 14 and can be examined from all sides. Variations in a critical dimension, such as line width W, along the length L of the section, as well as average measurements of the dimension, can be obtained.
摘要翻译：用于评估集成电路42（例如光致抗蚀剂流道）的地形特征16的非破坏性方法包括将该特征切除以去除小部分22的芯，而不损坏其上集成电路的晶片36的其余部分形成。使用具有精细调节的工具，例如具有玻璃针形式的棒状探针24的显微操纵器，用于去除用于检查和计量的部分。该部分与下面的基底表面14分离，并且可以从所有侧面进行检查。可以获得沿截面长度L的临界尺寸（例如线宽W）的变化以及尺寸的平均测量值。

4. 发明授权

US06534851B1 Modular semiconductor substrates 有权
标题翻译：模块化半导体衬底
公开(公告)号：US06534851B1
公开(公告)日：2003-03-18
申请号：US09642376
申请日：2000-08-21
申请人： Michael Antonell , Erik Cho Houge , Nitin Patel , Larry E. Plew , Catherine Vartuli
发明人： Michael Antonell , Erik Cho Houge , Nitin Patel , Larry E. Plew , Catherine Vartuli
IPC分类号： H01L2306
CPC分类号： H01L21/67346 , H01L22/20 , H01L22/34
摘要： A modular substrate-based processing scheme for producing semiconductor devices provides multiple modular processing units which may be arranged together to form any of various cohesive processing units or they may be individually or sequentially processed through standard semiconductor processing equipment. The cohesive processing units are processed unitarily providing for multiple modular processing units to be processed simultaneously. The modular processing units may be formed of a thick semiconductor substrate or a semiconductor substrate mounted on a further substrate such as a ceramic material. The modular processing units may each contain ribs, grooves, posts or other features to aid in handling and placement of the individual units.
摘要翻译：用于制造半导体器件的基于模块化基板的处理方案提供多个模块化处理单元，其可以被布置在一起以形成各种内聚处理单元中的任何一个，或者可以通过标准半导体处理设备单独或顺序地处理。整体处理单元被一体处理，提供要同时处理的多个模块化处理单元。模块化处理单元可以由安装在诸如陶瓷材料的另外的基板上的厚半导体衬底或半导体衬底形成。模块化处理单元可以各自包含肋，槽，柱或其他特征以帮助处理和放置各个单元。

5. 发明授权

US06713409B2 Semiconductor manufacturing using modular substrates 有权
标题翻译：使用模块化基板的半导体制造
公开(公告)号：US06713409B2
公开(公告)日：2004-03-30
申请号：US10303280
申请日：2002-11-25
申请人： Michael Antonell , Erik Cho Houge , Nitin Patel , Larry E. Plew , Catherine Vartuli
发明人： Michael Antonell , Erik Cho Houge , Nitin Patel , Larry E. Plew , Catherine Vartuli
IPC分类号： H01L2100
CPC分类号： H01L21/67346 , H01L22/20 , H01L22/34
摘要： A manufacturing method using a modular substrate-based processing scheme for producing semiconductor devices, provides multiple modular processing units which may be arranged together to form any of various cohesive processing units or individually or sequentially processed through standard semiconductor processing equipment. The cohesive processing units are processed unitarily providing for multiple modular processing units to be processed simultaneously. The modular processing units may be formed of a thick semiconductor substrate or a semiconductor substrate mounted on a further substrate such as a ceramic material. The modular processing units may each contain ribs, grooves, posts or other features to aid in handling and placement of the individual units.
摘要翻译：使用基于模块化的基于基板的处理方法来制造半导体器件的制造方法提供了多个模块化处理单元，其可以被布置在一起以形成任何各种内聚处理单元，或者通过标准半导体处理设备单独地或顺序地处理。整体处理单元被一体处理，提供要同时处理的多个模块化处理单元。模块化处理单元可以由安装在诸如陶瓷材料的另外的基板上的厚半导体衬底或半导体衬底形成。模块化处理单元可以各自包含肋，槽，柱或其他特征以帮助处理和放置各个单元。

6. 发明授权

US06870950B2 Method for detecting defects in a material and a system for accomplishing the same 有权
标题翻译：用于检测材料中的缺陷的方法和用于实现其的系统
公开(公告)号：US06870950B2
公开(公告)日：2005-03-22
申请号：US09809379
申请日：2001-03-15
申请人： Erik C. Houge , Catherine Vartuli , Mike Antonell , Pam Cavanagh , Hui Ma
发明人： Erik C. Houge , Catherine Vartuli , Mike Antonell , Pam Cavanagh , Hui Ma
IPC分类号： G01N21/95 , G06K9/00
CPC分类号： G01N21/95
摘要： The present invention provides a method for detecting defects in a material and a system for accomplishing the same. The method includes obtaining an image of at least a portion of a material's surface and converting the image into an intensity profile. The method further includes determining a defect in the material's surface from the intensity profile. In one exemplary embodiment, the image is an electron image obtained using a scanning electron microscope. The method may further be used to determine a defect density in the material's surface.
摘要翻译：本发明提供了一种用于检测材料中的缺陷的方法和用于实现该缺陷的系统。该方法包括获得材料表面的至少一部分的图像并将图像转换成强度分布。该方法还包括根据强度分布来确定材料表面的缺陷。在一个示例性实施例中，图像是使用扫描电子显微镜获得的电子图像。该方法还可用于确定材料表面中的缺陷密度。

7. 发明授权

US06695572B2 Method and apparatus for minimizing semiconductor wafer contamination 有权
标题翻译：用于最小化半导体晶片污染的方法和设备
公开(公告)号：US06695572B2
公开(公告)日：2004-02-24
申请号：US09966156
申请日：2001-09-28
申请人： Michael Antonell , Erik Cho Houge , Larry E. Plew , Catherine Vartuli , Jennifer Juszczak
发明人： Michael Antonell , Erik Cho Houge , Larry E. Plew , Catherine Vartuli , Jennifer Juszczak
IPC分类号： B65G4907
CPC分类号： H01L21/6732
摘要： A method and apparatus for minimizing the surface contamination of semiconductor wafers (11) during the semiconductor device manufacturing process. Semiconductor wafers (11) are stored in a storage cassette (12) with their face sides (17) facing downward and their back sides (16) facing upward. Particulate contamination present on the back sides of the wafers is thereby secured to the wafers by the force of gravity, and the faces of the wafers are shielded from falling debris. An automated wafer handling device (19) is provided with a rotary joint (22) to accomplish the wafer flipping motion before inserting a wafer into a cassette and after removing the wafer from the cassette.
摘要翻译：一种在半导体器件制造过程中最小化半导体晶片（11）的表面污染的方法和装置。半导体晶片（11）被储存在存储盒（12）中，其表面（17）面向下并且它们的背面（16）面向上。因此，通过重力将晶片的背面存在的颗粒污染物固定在晶片上，并且晶片的表面被遮蔽而不会掉落。自动晶片处理装置（19）设置有旋转接头（22），以在将晶片插入盒内并在从盒中取出晶片之后实现晶片翻转运动。

8. 发明授权

US06606371B2 X-ray system 有权
标题翻译： X光系统
公开(公告)号：US06606371B2
公开(公告)日：2003-08-12
申请号：US09745236
申请日：2000-12-19
申请人： Michael Antonell , Erik Cho Houge , John Martin McIntosh , Larry E. Plew , Catherine Vartuli
发明人： Michael Antonell , Erik Cho Houge , John Martin McIntosh , Larry E. Plew , Catherine Vartuli
IPC分类号： G21K106
CPC分类号： G21K1/06 , G21K2201/062 , G21K2201/064 , G21K2201/067
摘要： A reflective lens with at least one curved surface formed of polycrystalline material. In one embodiment, a lens structure includes a substrate having a surface of predetermined curvature and a film formed along a surface of the substrate with multiple individual members each having at least one similar orientation relative to the portion of the substrate surface adjacent the member such that collectively the members provide predictable angles for diffraction of x-rays generated from a common source. A system is also provided for performing an operation with x-rays. In one embodiment, a system includes a source for generating the x-rays, a polycrystalline surface region having crystal spacing suitable for reflecting a plurality of x-rays at the same Bragg angle along the region, and transmitting the reflected x-rays to a reference position. An associated method includes providing x-rays to polycrystalline surface region having crystal spacings suitable for reflecting a plurality of x-rays at the same Bragg angle along the region, transmitting the reflected x-rays to a reference position and positioning a sample between the surface region and the reference position so that the x-rays are transmitted through the sample.
摘要翻译：具有由多晶材料形成的至少一个曲面的反射透镜。在一个实施例中，透镜结构包括具有预定曲率的表面的基底和沿着基底的表面形成的膜，多个单独的构件各自具有相对于邻近构件的基底表面的部分的至少一个相似的取向，使得共同地，这些构件为从公共源产生的x射线的衍射提供可预测的角度。还提供了一种用于使用X射线进行操作的系统。在一个实施例中，系统包括用于产生x射线的源，具有适合于沿着该区域以相同的布拉格角反射多个x射线的晶体间距的多晶表面区域，以及将反射的x射线透射到参考位置。相关联的方法包括向具有晶体间距的多晶表面区域提供x射线，该晶体间距适于沿着该区域以相同的布拉格角反射多个x射线，将反射的x射线透射到参考位置，并将样品定位在表面区域和参考位置，使得x射线透射通过样品。

9. 发明授权

US06225639B1 Method of monitoring a patterned transfer process using line width metrology 有权
标题翻译：使用线宽度量法监测图案转移过程的方法
公开(公告)号：US06225639B1
公开(公告)日：2001-05-01
申请号：US09384459
申请日：1999-08-27
申请人： Thomas E. Adams , Thomas S. Frederick , Scott Jessen , John M. McIntosh , Catherine Vartuli
发明人： Thomas E. Adams , Thomas S. Frederick , Scott Jessen , John M. McIntosh , Catherine Vartuli
IPC分类号： G01N2186
CPC分类号： H01L22/20 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： A patterned transfer process in the manufacture of a semiconductor device is monitored. Patterned features formed on a semiconductor layer to be etched are scanned for generating a first amplitude modulated waveform intensity signal. The first amplitude modulated waveform intensity signal is sampled to extract a first measurement population of critical dimension measurements. The patterned features are etched and then scanned for generating a second amplitude modulated waveform intensity signal. The second amplitude modulated waveform intensity signal is then sampled to extract a second measurement population of critical dimension measurements, which are then cross-correlated to obtain correlation values of the etching process.
摘要翻译：监视半导体器件制造中的图案转印工艺。扫描形成在要蚀刻的半导体层上的图形特征，以产生第一幅度调制波形强度信号。对第一幅度调制波形强度信号进行采样，以提取关键尺寸测量的第一测量群。蚀刻图案特征，然后扫描以产生第二幅度调制波形强度信号。然后对第二幅度调制波形强度信号进行采样，以提取关键尺寸测量的第二测量群，然后交叉相关，以获得蚀刻过程的相关值。

10. 发明授权

US06750447B2 Calibration standard for high resolution electron microscopy 失效
标题翻译：高分辨率电子显微镜的校准标准
公开(公告)号：US06750447B2
公开(公告)日：2004-06-15
申请号：US10122645
申请日：2002-04-12
申请人： Erik Cho Houge , Catherine Vartuli , John Martin McIntosh , Fred Anthony Stevie
发明人： Erik Cho Houge , Catherine Vartuli , John Martin McIntosh , Fred Anthony Stevie
IPC分类号： G12B1300
CPC分类号： G01N23/04 , G01N2001/2893 , H01J37/265 , H01J2237/2826
摘要： A method and apparatus used to calibrate high-resolution electron microscopes where a single standard provides multiple samples, each having a different atomic structure, permits rapid accurate calibration of the entire range of magnifications. The different atomic structure dimensions possess known reference measurement data. The S/TEM is adjusted to focus onto the crystal lattice structure of each sample in a selected sequence. Measurements of these lattice spacings are compared to known dimensions. If S/TEM measurements do not agree with the lattice spacing dimensions, the S/TEM magnification is adjusted to reflect known dimensions. Typical standard exchange and associated processing steps are eliminated by the use of the single standard comprising of a plurality of samples.
摘要翻译：用于校准高分辨率电子显微镜的方法和装置，其中单个标准提供多个样品，每个样品具有不同的原子结构，允许快速精确校准整个放大倍数。不同的原子结构尺寸具有已知的参考测量数据。调整S / TEM以选择的顺序聚焦到每个样品的晶格结构上。将这些晶格间距的测量与已知尺寸进行比较。如果S / TEM测量与晶格间距尺寸不一致，则调整S / TEM放大倍率以反映已知尺寸。通过使用包含多个样品的单一标准来消除典型的标准交换和相关处理步骤。

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