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    • 7. 发明授权
    • Method of fabricating micro-electromechanical switches on CMOS compatible substrates
    • 在CMOS兼容基板上制造微机电开关的方法
    • US06798029B2
    • 2004-09-28
    • US10434999
    • 2003-05-09
    • Richard P. VolantJohn C. BissonDonna R. CoteTimothy J. DaltonRobert A. GrovesKevin S. PetrarcaKenneth J. SteinSeshadri Subbanna
    • Richard P. VolantJohn C. BissonDonna R. CoteTimothy J. DaltonRobert A. GrovesKevin S. PetrarcaKenneth J. SteinSeshadri Subbanna
    • H01L2982
    • H01H59/0009H01H2059/0018H01H2059/0072
    • A method of fabricating micro-electromechanical switches (MEMS) integrated with conventional semiconductor interconnect levels, using compatible processes and materials is described. The method is based upon fabricating a capacitive switch that is easily modified to produce various configurations for contact switching and any number of metal-dielectric-metal switches. The process starts with a copper damascene interconnect layer, made of metal conductors inlaid in a dielectric. All or portions of the copper interconnects are recessed to a degree sufficient to provide a capacitive air gap when the switch is in the closed state, as well as provide space for a protective layer of, e.g., Ta/TaN. The metal structures defined within the area specified for the switch act as actuator electrodes to pull down the movable beam and provide one or more paths for the switched signal to traverse. The advantage of an air gap is that air is not subject to charge storage or trapping that can cause reliability and voltage drift problems. Instead of recessing the electrodes to provide a gap, one may just add dielectric on or around the electrode. The next layer is another dielectric layer which is deposited to the desired thickness of the gap formed between the lower electrodes and the moveable beam that forms the switching device. Vias are fabricated through this dielectric to provide connections between the metal interconnect layer and the next metal layer which will also contain the switchable beam. The via layer is then patterned and etched to provide a cavity area which contains the lower activation electrodes as well as the signal paths. The cavity is then back-filled with a sacrificial release material. This release material is then planarized with the top of the dielectric, thereby providing a planar surface upon which the beam layer is constructed.
    • 描述了使用兼容工艺和材料制造与常规半导体互连级别集成的微机电开关(MEMS)的方法。 该方法基于制造容易修改以产生用于接触切换和任何数量的金属 - 介电金属开关的各种配置的电容开关。 该过程开始于铜镶嵌互连层,由金属导体嵌入电介质中。 铜互连的全部或部分凹陷到足以在开关处于闭合状态时提供电容气隙的程度,并为例如Ta / TaN的保护层提供空间。 在为开关指定的区域内限定的金属结构用作致动器电极以下拉可移动光束并且提供一个或多个路径用于开关信号横越。 气隙的优点是空气不会受到可能导致可靠性和电压漂移问题的电荷储存或捕集。 代替使电极凹陷以提供间隙,可以仅在电极上或周围添加电介质。 下一层是另一介质层,其被沉积到形成在下电极和形成开关器件的可移动梁之间的间隙的期望厚度上。 通过该电介质制造通孔以提供金属互连层和还包含可切换光束的下一个金属层之间的连接。 然后对通孔层进行图案化和蚀刻以提供包含下部激活电极以及信号路径的空腔区域。 然后用牺牲脱模材料填充空腔。 然后将该释放材料与电介质的顶部平坦化,由此提供构造波束层的平坦表面。
    • 10. 发明授权
    • Micro-electromechanical inductive switch
    • 微机电感应开关
    • US06831542B2
    • 2004-12-14
    • US10248876
    • 2003-02-26
    • Richard P. VolantJohn E. FlorkeyRobert A. Groves
    • Richard P. VolantJohn E. FlorkeyRobert A. Groves
    • H01F2104
    • H03K17/965H01F7/066H01F7/14H01F2007/068H01H59/0009
    • A micro-electro mechanical (MEM) switch capable of inductively coupling and decoupling electrical signals is described. The inductive MEM switch consists of a first plurality of coils on a movable platform and a second plurality of coils on a stationary platform or substrate, the coils on the movable platform being above or below those in the stationary substrate. Coupling and decoupling occurs by rotating or by laterally displacing the coils of the movable platform with respect to the coils on the stationary substrate. Diverse arrangements of coils respectively on the movable and stationary substrates allow for a multi-pole and multi-position switching configurations. The MEM switches described eliminate problems of stiction, arcing and welding of the switch contacts. The MEMS switches of the invention can be fabricated using standard CMOS techniques.
    • 描述了能够感应耦合和去耦电信号的微机电(MEM)开关。 电感式MEM开关由可移动平台上的第一组多个线圈和固定平台或基板上的第二组线圈构成,可移动平台上的线圈高于或低于固定基板中的线圈。 通过旋转或相对于固定基板上的线圈横向移动可移动平台的线圈而发生耦合和解耦。 分别在可移动和固定基板上的线圈的不同配置允许多极和多位置的切换配置。 所描述的MEM开关消除了开关触点的静电,电弧和焊接的问题。 本发明的MEMS开关可以使用标准CMOS技术制造。