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1. 发明授权

US07602265B2 Apparatus for accurate and efficient quality and reliability evaluation of micro electromechanical systems 失效
标题翻译：微机电系统的准确高效的质量和可靠性评估装置
公开(公告)号：US07602265B2
公开(公告)日：2009-10-13
申请号：US11163485
申请日：2005-10-20
申请人： Hariklia Deligianni , Robert D. Edwards , Thomas J. Fleischman , Robert A. Groves , Charles J. Montrose , Richard P. Volant , Ping-Chuan Wang
发明人： Hariklia Deligianni , Robert D. Edwards , Thomas J. Fleischman , Robert A. Groves , Charles J. Montrose , Richard P. Volant , Ping-Chuan Wang
IPC分类号： H01H51/22
CPC分类号： H01H59/0009
摘要： The present invention provides multiple test structures for performing reliability and qualification tests on MEMS switch devices. A Test structure for contact and gap characteristic measurements is employed having a serpentine layout simulates rows of upper and lower actuation electrodes. A cascaded switch chain test is used to monitor process defects with large sample sizes. A ring oscillator is used to measure switch speed and switch lifetime. A resistor ladder test structure is configured having each resistor in series with a switch to be tested, and having each switch-resistor pair electrically connected in parallel. Serial/parallel test structures are proposed with MEMS switches working in tandem with switches of established technology. A shift register is used to monitor the open and close state of the MEMS switches. Pull-in voltage, drop-out voltage, activation leakage current, and switch lifetime measurements are performed using the shift register.
摘要翻译：本发明提供用于在MEMS开关装置上执行可靠性和鉴定测试的多个测试结构。采用具有蛇形布局的接触和间隙特性测量的测试结构来模拟上下驱动电极的行。级联交换链测试用于监控大样本量的过程缺陷。环形振荡器用于测量开关速度和开关寿命。电阻梯形测试结构被配置为具有与要测试的开关串联的每个电阻器，并且每个开关电阻器对并联电连接。提出了串联/并联测试结构，其中MEMS开关与成熟技术的开关串联工作。移位寄存器用于监测MEMS开关的开启和关闭状态。使用移位寄存器执行拉入电压，掉电电压，启动漏电流和开关寿命测量。

2. 发明申请

US20110102005A1 On-Chip Accelerated Failure Indicator 失效
标题翻译：片上加速故障指示器
公开(公告)号：US20110102005A1
公开(公告)日：2011-05-05
申请号：US12610683
申请日：2009-11-02
申请人： Kai D. Feng , Thomas J. Fleischman , Ping-Chuan Wang , Xiaojin Wei , Zhijian Yang
发明人： Kai D. Feng , Thomas J. Fleischman , Ping-Chuan Wang , Xiaojin Wei , Zhijian Yang
IPC分类号： G01R31/26 , G01R31/3187
CPC分类号： G01R31/2856 , G01R31/2875
摘要： An accelerated failure indicator embedded on a semiconductor chip includes an insulating region; a circuit located inside the insulating region; a heating element located inside the insulating region, the heating element configured to heat the circuit to a temperature higher than an operating temperature of the semiconductor chip; and a reliability monitor configured to monitor the circuit for degradation, and further configured to trigger an alarm in the event that the degradation of the circuit exceeds a predetermined threshold. A method of operating an accelerated failure indicator embedded on a semiconductor chip includes determining an operating temperature of the semiconductor chip; heating a circuit located inside an insulating region of the accelerated failure indicator to a temperature higher than the determined operating temperature; monitoring the circuit for degradation; and triggering an alarm in the event that the degradation of the circuit exceeds a predetermined threshold.
摘要翻译：嵌入在半导体芯片上的加速故障指示器包括绝缘区域; 位于绝缘区域内的电路; 位于所述绝缘区域内的加热元件，所述加热元件构造成将所述电路加热至高于所述半导体芯片的工作温度的温度; 以及可靠性监视器，其被配置为监视所述电路的劣化，并且还被配置为在所述电路的劣化超过预定阈值的情况下触发警报。一种操作嵌入在半导体芯片上的加速故障指示器的方法包括确定半导体芯片的工作温度; 将位于加速故障指示器的绝缘区域内的电路加热到高于所确定的工作温度的温度; 监控电路退化; 并且在电路的劣化超过预定阈值的情况下触发报警。

3. 发明授权

US08274301B2 On-chip accelerated failure indicator 失效
标题翻译：片上加速故障指示器
公开(公告)号：US08274301B2
公开(公告)日：2012-09-25
申请号：US12610683
申请日：2009-11-02
申请人： Kai D. Feng , Thomas J. Fleischman , Ping-Chuan Wang , Xiaojin Wei , Zhijian Yang
发明人： Kai D. Feng , Thomas J. Fleischman , Ping-Chuan Wang , Xiaojin Wei , Zhijian Yang
IPC分类号： G01R31/00 , G01R31/10
CPC分类号： G01R31/2856 , G01R31/2875
摘要： An accelerated failure indicator embedded on a semiconductor chip includes an insulating region; a circuit located inside the insulating region; a heating element located inside the insulating region, the heating element configured to heat the circuit to a temperature higher than an operating temperature of the semiconductor chip; and a reliability monitor configured to monitor the circuit for degradation, and further configured to trigger an alarm in the event that the degradation of the circuit exceeds a predetermined threshold. A method of operating an accelerated failure indicator embedded on a semiconductor chip includes determining an operating temperature of the semiconductor chip; heating a circuit located inside an insulating region of the accelerated failure indicator to a temperature higher than the determined operating temperature; monitoring the circuit for degradation; and triggering an alarm in the event that the degradation of the circuit exceeds a predetermined threshold.
摘要翻译：嵌入在半导体芯片上的加速故障指示器包括绝缘区域; 位于绝缘区域内的电路; 位于所述绝缘区域内的加热元件，所述加热元件构造成将所述电路加热至高于所述半导体芯片的工作温度的温度; 以及可靠性监视器，其被配置为监视所述电路的劣化，并且还被配置为在所述电路的劣化超过预定阈值的情况下触发警报。一种操作嵌入在半导体芯片上的加速故障指示器的方法包括确定半导体芯片的工作温度; 将位于加速故障指示器的绝缘区域内的电路加热到高于所确定的工作温度的温度; 监控电路退化; 并且在电路的劣化超过预定阈值的情况下触发报警。

4. 发明授权

US08466543B2 Three dimensional stacked package structure 失效
标题翻译：三维堆叠包装结构
公开(公告)号：US08466543B2
公开(公告)日：2013-06-18
申请号：US12789316
申请日：2010-05-27
申请人： Thomas J. Fleischman , Eric D. Perfecto , Sudipta K. Ray
发明人： Thomas J. Fleischman , Eric D. Perfecto , Sudipta K. Ray
IPC分类号： H01L23/02 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L25/0657 , H01L23/49811 , H01L23/49827 , H01L24/04 , H01L24/05 , H01L24/06 , H01L24/14 , H01L24/16 , H01L25/0652 , H01L25/18 , H01L2224/0401 , H01L2224/0557 , H01L2224/06051 , H01L2224/06135 , H01L2224/06136 , H01L2224/06177 , H01L2224/06181 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/14051 , H01L2224/14181 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/81801 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06558 , H01L2225/06572 , H01L2225/06586 , H01L2924/00013 , H01L2924/0002 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/01046 , H01L2924/01028 , H01L2224/13099 , H01L2224/05552 , H01L2924/00
摘要： An apparatus, system, and method are disclosed for connecting integrated circuit devices. A plurality of primary electrically conductive contacts and a plurality of primary electrically conductive pillars are electrically coupled to a primary integrated circuit device. The plurality of primary electrically conductive contacts form a pattern corresponding to secondary electrically conductive contacts disposed on one or more secondary integrated circuit devices. The plurality of primary electrically conductive pillars extends away from the primary integrated circuit device. The plurality of primary electrically conductive pillars forms a pattern that corresponds to substrate electrically conductive contacts that are disposed on a substrate. The plurality of primary electrically conductive pillars and associated connecting material provide a standoff height between the primary integrated circuit device and the substrate that is greater than or equal to a height of the one or more secondary integrated circuit devices.
摘要翻译：公开了用于连接集成电路器件的装置，系统和方法。多个初级导电触点和多个初级导电柱电耦合到初级集成电路器件。多个初级导电触点形成对应于设置在一个或多个次级集成电路器件上的次级导电触点的图案。多个主导电支柱远离主集成电路装置延伸。多个主导电柱形成对应于设置在基板上的基板导电触点的图案。多个初级导电柱和相关联的连接材料提供主集成电路器件和衬底之间的间隔高度，其大于或等于一个或多个次级集成电路器件的高度。

5. 发明申请

US20080106640A1 METHOD OF MULTIPLE STREAM FORMATTING IN A MULTIMEDIA SYSTEM 审中-公开
标题翻译：多媒体系统中多条流形成的方法
公开(公告)号：US20080106640A1
公开(公告)日：2008-05-08
申请号：US11556794
申请日：2006-11-06
申请人： Thomas J. Fleischman
发明人： Thomas J. Fleischman
IPC分类号： H04N7/01
CPC分类号： H04N21/440218 , H04N21/4334 , H04N21/4621
摘要： A method of multiple stream formatting in a multimedia system. An input media signal is simultaneously converted to a plurality of different media formats selected from a menu, and the different media formats are stored on a storage device. The method then includes retrieving one or more desired different formats of the media signal and transferring the selected format of the media signal to a media device compatible with the selected format. When a media device is connected to the storage device, the method includes identifying a media format used by the media device, and using the identification of the media format used by the media device to select the same media format from the storage device for retrieval and transfer of the selected format of the media signal to the media device.
摘要翻译：一种多媒体系统中多流格式化的方法。输入媒体信号被同时转换为从菜单中选择的多种不同的媒体格式，并且不同的媒体格式被存储在存储设备上。该方法然后包括检索一个或多个所需的不同格式的媒体信号，并将所选择的媒体信号的格式传送到与所选格式兼容的媒体设备。当媒体设备连接到存储设备时，该方法包括识别由媒体设备使用的媒体格式，并且使用由媒体设备使用的媒体格式的标识来从存储设备中选择相同的媒体格式进行检索和将所选格式的媒体信号传送到媒体设备。

6. 发明申请

US20070269928A1 TEMPORARY CHIP ATTACH USING INJECTION MOLDED SOLDER 失效
标题翻译：使用注射成型焊机的临时芯片
公开(公告)号：US20070269928A1
公开(公告)日：2007-11-22
申请号：US11419069
申请日：2006-05-18
申请人： Mukta Ghate Farooq , Thomas J. Fleischman
发明人： Mukta Ghate Farooq , Thomas J. Fleischman
IPC分类号： H01L21/00
CPC分类号： B23K3/0623 , B23K2101/40 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/98 , H01L2224/16 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2224/81907 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/15787 , H05K3/3436 , H05K3/3457 , H05K3/3463 , H05K2201/10992 , H05K2203/0113 , Y02P70/613 , H01L2924/00
摘要： An improved method for performing an improved Temporary Chip Attach utilizing an Injection Molded Solder (IMS) process to allow efficient testing of die for creating a Known Good Die Bank. The IMS is applied to the testing substrate to form a column on the substrate. The die to be tested can then be attached to the IMS column with C4 solder. A slight reflow is then applied to the die, allowing some of the C4 to melt, and form an electrical connection with the corresponding IMS column. After testing, the die can be removed along with the C4 from the IMS column or permanently attached the substrate by performing a full reflow of the C4.
摘要翻译：一种用于使用注射成型焊料（IMS）工艺执行改进的临时芯片连接的改进方法，以允许有效测试模具以创建已知的良好模具库。将IMS应用于测试基板以在基板上形成柱。待测试的模具然后可以用C4焊料连接到IMS柱。然后将稍微的回流施加到管芯上，使C4中的一些熔化，并与相应的IMS柱形成电连接。经过测试，模具可以与来自IMS柱的C4一起被去除，也可以通过C4的完全回流来永久地附着基板。

7. 发明授权

US07088153B2 Data storage latch structure with micro-electromechanical switch 有权
公开(公告)号：US07088153B2
公开(公告)日：2006-08-08
申请号：US10912610
申请日：2004-08-05
申请人： Mark R. Bilak , Thomas J. Fleischman
发明人： Mark R. Bilak , Thomas J. Fleischman
IPC分类号： H03K3/037 , H03K3/12 , H03K3/356
CPC分类号： G11C23/00
摘要： Micro-electromechanical switches (MEMS) are configured to form a data storage latch to reduce power consumption, to reduce the space used in an integrated circuit, and to improve performance of the integrated circuit. MEMS are implemented at the wiring layer connected to an integrated circuit and coupled to form a storage latch.

8. 发明申请

US20110291261A1 THREE DIMENSIONAL STACKED PACKAGE STRUCTURE 失效
标题翻译：三维堆叠包装结构
公开(公告)号：US20110291261A1
公开(公告)日：2011-12-01
申请号：US12789316
申请日：2010-05-27
申请人： Thomas J. Fleischman , Eric D. Perfecto , Sudipta K. Ray
发明人： Thomas J. Fleischman , Eric D. Perfecto , Sudipta K. Ray
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L25/0657 , H01L23/49811 , H01L23/49827 , H01L24/04 , H01L24/05 , H01L24/06 , H01L24/14 , H01L24/16 , H01L25/0652 , H01L25/18 , H01L2224/0401 , H01L2224/0557 , H01L2224/06051 , H01L2224/06135 , H01L2224/06136 , H01L2224/06177 , H01L2224/06181 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/14051 , H01L2224/14181 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/81801 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06558 , H01L2225/06572 , H01L2225/06586 , H01L2924/00013 , H01L2924/0002 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/01046 , H01L2924/01028 , H01L2224/13099 , H01L2224/05552 , H01L2924/00
摘要： An apparatus, system, and method are disclosed for connecting integrated circuit devices. A plurality of primary electrically conductive contacts and a plurality of primary electrically conductive pillars are electrically coupled to a primary integrated circuit device. The plurality of primary electrically conductive contacts form a pattern corresponding to secondary electrically conductive contacts disposed on one or more secondary integrated circuit devices. The plurality of primary electrically conductive pillars extends away from the primary integrated circuit device. The plurality of primary electrically conductive pillars forms a pattern that corresponds to substrate electrically conductive contacts that are disposed on a substrate. The plurality of primary electrically conductive pillars and associated connecting material provide a standoff height between the primary integrated circuit device and the substrate that is greater than or equal to a height of the one or more secondary integrated circuit devices.
摘要翻译：公开了用于连接集成电路器件的装置，系统和方法。多个初级导电触点和多个初级导电柱电耦合到初级集成电路器件。多个初级导电触点形成对应于设置在一个或多个次级集成电路器件上的次级导电触点的图案。多个主导电支柱远离主集成电路装置延伸。多个主导电柱形成对应于设置在基板上的基板导电触点的图案。多个初级导电柱和相关联的连接材料提供主集成电路器件和衬底之间的间隔高度，其大于或等于一个或多个次级集成电路器件的高度。

9. 发明申请

US20090059057A1 Method and Apparatus for Providing a Video Image Having Multiple Focal Lengths 失效
标题翻译：提供具有多个焦距的视频图像的方法和装置
公开(公告)号：US20090059057A1
公开(公告)日：2009-03-05
申请号：US11850185
申请日：2007-09-05
申请人： David Clifford Long , Thomas J. Fleischman
发明人： David Clifford Long , Thomas J. Fleischman
IPC分类号： G02B27/10
CPC分类号： G02B15/02 , H04N5/23212 , H04N5/23229 , H04N5/23232 , H04N5/2356
摘要： A method and apparatus for providing a video image having multiple focal lengths includes a multi-focal lens system and a drive mechanism capable of moving the multi-focal lens system through a cyclic path. A plurality of optical images are formed as the multi-focal lens system moves through the cyclic path. An image pickup device is capable of converting each of the plurality of optical images into a corresponding image signal. An image processor is operative to preferably form a composite image signal wherein individual elements of the optical images are selected to provide preferred focus characteristics.
摘要翻译：用于提供具有多个焦距的视频图像的方法和装置包括多焦点透镜系统和能够通过循环路径移动多焦点透镜系统的驱动机构。当多焦点透镜系统移动通过循环路径时，形成多个光学图像。图像拾取装置能够将多个光学图像中的每一个转换成对应的图像信号。图像处理器可操作以优选地形成复合图像信号，其中选择光学图像的各个元件以提供优选的聚焦特性。

10. 发明授权

US07755206B2 Pad structure to provide improved stress relief 有权
标题翻译：垫结构提供改善的应力消除
公开(公告)号：US07755206B2
公开(公告)日：2010-07-13
申请号：US11947184
申请日：2007-11-29
申请人： Mukta G. Farooq , John A. Fitzsimmons , Thomas J. Fleischman
发明人： Mukta G. Farooq , John A. Fitzsimmons , Thomas J. Fleischman
IPC分类号： H01L23/48
CPC分类号： B81B3/0072 , B81B2207/07 , H01L24/72 , H01L2924/14 , H01L2924/1461 , H01L2924/15787 , H01L2924/00
摘要： A semiconductor interconnection comprises a semiconductor device, a substrate adjacent the semiconductor device, and a plurality of spring contacts on the semiconductor device or the substrate. A plurality of solder connections are on the opposite semiconductor device or substrate. Each spring contact comprises a contact surface and a conductive material on the contact surface. Upon assembly of the semiconductor device and the substrate, the conductive material on the plurality of spring contacts makes contact with each of the plurality of solder connections. The conductive material is in a liquid state at manufacturing or operating temperatures of the semiconductor device. Thus, the conductive material could be a solid at room temperature and transition to a liquid state at the semiconductor's manufacturing or operating temperatures.
摘要翻译：半导体互连包括半导体器件，与半导体器件相邻的衬底，以及半导体器件或衬底上的多个弹簧触点。多个焊接连接在相对的半导体器件或衬底上。每个弹簧触点包括在接触表面上的接触表面和导电材料。在组装半导体器件和衬底时，多个弹簧触头上的导电材料与多个焊料连接中的每一个接触。导电材料在半导体器件的制造或工作温度下处于液态。因此，导电材料在室温下可以是固体，并且在半导体的制造或操作温度下转变为液态。

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