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    • 1. 发明授权
    • Fuse for projected ordnance
    • 保险丝用于预计的弹药
    • US07216589B2
    • 2007-05-15
    • US10766449
    • 2004-01-27
    • David John BishopHerbert R. SheaDonald P. Weiss
    • David John BishopHerbert R. SheaDonald P. Weiss
    • F42C19/00
    • F42C15/18F42B3/113
    • An ordnance fuse apparatus is described that uses electrical and mechanical, and optical devices. The ordnance fuse apparatus includes a controller to control an optical switch and a laser to detonate an explosive charge of the ordnance. Other embodiments include an accelerometer and/or spin detector for detecting that the ordnance has been fired and an optical detector for detecting the proper operation of the laser and a position sensor for detecting correct positioning of the optical switch. Another embodiment includes a microlens to focus the laser optical signal onto the ignitor. In yet other embodiments, the explosive charge is detonated either by ignition of an ignitor or by a shock wave from the ignitor. The resulting ordnance fuse apparatus has significantly reduced size and improved performance and safety.
    • 描述了使用电和机械和光学装置的军火熔断器装置。 军火保险丝装置包括控制器,用于控制光学开关和激光以引爆弹药的炸药。 其他实施例包括用于检测军火已经被点火的加速度计和/或自旋检测器以及用于检测激光器的正常操作的光学检测器和用于检测光学开关的正确定位的位置传感器。 另一个实施例包括将激光光信号聚焦到点火器上的微透镜。 在另外的其它实施例中,通过点火器的点火或来自点火器的冲击波来引爆炸药。 所得到的军火保险丝装置具有显着减小的尺寸和改进的性能和安全性。
    • 3. 发明授权
    • Hermatic firewall for MEMS packaging in flip-chip bonded geometry
    • Hermatic防火墙用于MEMS封装中的倒装芯片焊接几何
    • US06400009B1
    • 2002-06-04
    • US09419488
    • 1999-10-15
    • David John BishopJohn VanAtta Gates, IIJungsang Kim
    • David John BishopJohn VanAtta Gates, IIJungsang Kim
    • H01L2312
    • B81B7/0041B81C2203/019H01L23/04H01L23/057H01L23/10H01L2924/0002H01L2924/01079H01L2924/00
    • A package for hermetically sealing a micro-electromechanical systems (MEMS) device in a hybrid circuit comprise a firewall formed on a substrate for the MEMS device and which has a height defining a cavity of the package in which the MEMS device will be sealed. A second substrate spaced from the first substrate hermetically seals the cavity when the second substrate is flip-chip bonded to the first substrate and soldered to the first substrate with a thin film metal material placed on at least a top portion of the firewall. The resulting firewall MEMS device package can be further packaged using conventional CMOS packaging techniques. By hermetically sealing the cavity, the enclosed MEMS device is protected from deleterious conditions found in the environment of conventional CMOS packaging techniques which is often detrimental to MEMS device function.
    • 用于气密地密封混合电路中的微机电系统(MEMS)装置的封装包括形成在用于MEMS器件的衬底上的防火墙,其具有限定封装的空腔的高度,其中MEMS器件将被密封。 与第一基板间隔开的第二基板在第二基板被倒装芯片接合到第一基板时气密地密封空腔,并且将金属材料焊接到第一基板上,薄膜金属材料放置在防火墙的至少顶部上。 所得到的防火墙MEMS器件封装可以使用传统的CMOS封装技术进一步封装。 通过密封空腔,封装的MEMS器件得到保护,防止在常规CMOS封装技术的环境中发现有害条件,这常常对MEMS器件功能有害。
    • 4. 发明授权
    • Method and arrangement for a combined modulator/photodetector
    • 组合调制器/光电探测器的方法和装置
    • US5767997A
    • 1998-06-16
    • US675980
    • 1996-07-05
    • David John BishopKeith Wayne GoossenJames A. Walker
    • David John BishopKeith Wayne GoossenJames A. Walker
    • H04B10/24H04B10/00
    • H04B10/40
    • Apparatus and methods for a combined optical modulator/photodetector are disclosed. A modulator chip is attached to a photodetector chip using a non-conductive epoxy or solder. The combined modulator/photodetector can be configured in at least two ways. In one configuration, the modulator is located on the upper surface of a chip that is attached, at its lower surface, to a photodetector containing chip. In another configuration, the modulator is located on the lower surface of the modulator chip, which is again attached at its lower surface to the pbotodetector chip. By combining the modulator and photodetector in the manner described above, they can be placed in a single package, resulting in reduced packaging costs versus a separately packaged modulator and a separately packaged photodetector. Moreover, feedback from the photodetector can used to optimize the operation of micromechanical optical modulators.
    • 公开了用于组合光调制器/光电检测器的装置和方法。 使用非导电环氧树脂或焊料将调制器芯片附接到光电检测器芯片。 组合的调制器/光电检测器可以至少两种方式配置。 在一种配置中,调制器位于芯片的上表面上,芯片的下表面附接到包含光电检测器的芯片。 在另一种配置中,调制器位于调制器芯片的下表面上,该调制器芯片的下表面再次连接到波导检测器芯片。 通过以上述方式组合调制器和光电检测器,它们可以放置在单个封装中,从而与单独封装的调制器和单独封装的光电检测器相比降低了封装成本。 此外,来自光电检测器的反馈可用于优化微机械光学调制器的操作。
    • 9. 发明授权
    • Surface-micromachined out-of-plane tunable optical filters
    • 表面微机械加工的平面外可调滤光片
    • US06351577B1
    • 2002-02-26
    • US09211185
    • 1998-12-14
    • Vladimir Anatolyevich AksyukDavid John BishopAnat Sneh
    • Vladimir Anatolyevich AksyukDavid John BishopAnat Sneh
    • G02B612
    • G02B6/29358G02B6/122G02B6/29395G02B26/001G02B2006/12104
    • The invention provides tunable optical filters which incorporate a surface-micromachined out-of-plane plate having a moveable membrane with a high reflective (HR) coated mirror. The mirror defines one side of a Fabry-Perot (FP) filter cavity and is movable in a direction along an axis of the filter cavity. The other side of the filter cavity is defined by a second HR-coated mirror. In one illustrative embodiment, a first plate is formed on a substrate, and then subsequently released from the substrate and secured in a plane orthogonal to the substrate. The first HR-coated mirror is formed as part of a movable membrane supported in an opening through the first plate. The second mirror is formed on a second plate secured in another plane orthogonal to the plane of the substrate, such that the filter cavity is defined horizontally between the first and second mirrors. In another embodiment, the second mirror is formed on an endface of an external fiber, such that light from the fiber can pass from the second mirror through an opening in the second plate to the first mirror. In another possible embodiment, the second plate is eliminated and the second mirror is formed on the substrate. The first plate is then arranged over the second mirror, in a plane parallel to the substrate, and separated from the substrate by spacers, such that the filter cavity is defined vertically.
    • 本发明提供了可调谐光学滤波器,其结合了具有高反射(HR)涂覆反射镜的可移动膜的表面微加工的平面外板。 反射镜定义了法布里 - 珀罗(FP)过滤器腔的一侧,并且可沿着过滤腔的轴线的方向移动。 过滤腔的另一侧由第二HR涂层镜定义。 在一个说明性实施例中,第一板形成在衬底上,然后随后从衬底释放并固定在与衬底正交的平面中。 第一HR涂覆镜形成为支撑在通过第一板的开口中的可移动膜的一部分。 第二反射镜形成在固定在与基板的平面正交的另一平面中的第二板上,使得过滤腔在水平地限定在第一和第二反射镜之间。 在另一个实施例中,第二反射镜形成在外部光纤的端面上,使得来自光纤的光可以从第二反射镜通过第二板中的开口传递到第一反射镜。 在另一个可能的实施例中,第二板被去除并且第二反射镜形成在基板上。 然后将第一板布置在平行于基板的平面中的第二反射镜上,并且通过间隔件与基板分离,使得过滤腔垂直地限定。