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    • 2. 发明授权
    • Hermatic firewall for MEMS packaging in flip-chip bonded geometry
    • Hermatic防火墙用于MEMS封装中的倒装芯片焊接几何
    • US06400009B1
    • 2002-06-04
    • US09419488
    • 1999-10-15
    • David John BishopJohn VanAtta Gates, IIJungsang Kim
    • David John BishopJohn VanAtta Gates, IIJungsang Kim
    • H01L2312
    • B81B7/0041B81C2203/019H01L23/04H01L23/057H01L23/10H01L2924/0002H01L2924/01079H01L2924/00
    • A package for hermetically sealing a micro-electromechanical systems (MEMS) device in a hybrid circuit comprise a firewall formed on a substrate for the MEMS device and which has a height defining a cavity of the package in which the MEMS device will be sealed. A second substrate spaced from the first substrate hermetically seals the cavity when the second substrate is flip-chip bonded to the first substrate and soldered to the first substrate with a thin film metal material placed on at least a top portion of the firewall. The resulting firewall MEMS device package can be further packaged using conventional CMOS packaging techniques. By hermetically sealing the cavity, the enclosed MEMS device is protected from deleterious conditions found in the environment of conventional CMOS packaging techniques which is often detrimental to MEMS device function.
    • 用于气密地密封混合电路中的微机电系统(MEMS)装置的封装包括形成在用于MEMS器件的衬底上的防火墙,其具有限定封装的空腔的高度,其中MEMS器件将被密封。 与第一基板间隔开的第二基板在第二基板被倒装芯片接合到第一基板时气密地密封空腔,并且将金属材料焊接到第一基板上,薄膜金属材料放置在防火墙的至少顶部上。 所得到的防火墙MEMS器件封装可以使用传统的CMOS封装技术进一步封装。 通过密封空腔,封装的MEMS器件得到保护,防止在常规CMOS封装技术的环境中发现有害条件,这常常对MEMS器件功能有害。
    • 3. 发明授权
    • Method and arrangement for a combined modulator/photodetector
    • 组合调制器/光电探测器的方法和装置
    • US5767997A
    • 1998-06-16
    • US675980
    • 1996-07-05
    • David John BishopKeith Wayne GoossenJames A. Walker
    • David John BishopKeith Wayne GoossenJames A. Walker
    • H04B10/24H04B10/00
    • H04B10/40
    • Apparatus and methods for a combined optical modulator/photodetector are disclosed. A modulator chip is attached to a photodetector chip using a non-conductive epoxy or solder. The combined modulator/photodetector can be configured in at least two ways. In one configuration, the modulator is located on the upper surface of a chip that is attached, at its lower surface, to a photodetector containing chip. In another configuration, the modulator is located on the lower surface of the modulator chip, which is again attached at its lower surface to the pbotodetector chip. By combining the modulator and photodetector in the manner described above, they can be placed in a single package, resulting in reduced packaging costs versus a separately packaged modulator and a separately packaged photodetector. Moreover, feedback from the photodetector can used to optimize the operation of micromechanical optical modulators.
    • 公开了用于组合光调制器/光电检测器的装置和方法。 使用非导电环氧树脂或焊料将调制器芯片附接到光电检测器芯片。 组合的调制器/光电检测器可以至少两种方式配置。 在一种配置中,调制器位于芯片的上表面上,芯片的下表面附接到包含光电检测器的芯片。 在另一种配置中,调制器位于调制器芯片的下表面上,该调制器芯片的下表面再次连接到波导检测器芯片。 通过以上述方式组合调制器和光电检测器,它们可以放置在单个封装中,从而与单独封装的调制器和单独封装的光电检测器相比降低了封装成本。 此外,来自光电检测器的反馈可用于优化微机械光学调制器的操作。
    • 9. 发明授权
    • Fuse for projected ordnance
    • 保险丝用于预计的弹药
    • US07216589B2
    • 2007-05-15
    • US10766449
    • 2004-01-27
    • David John BishopHerbert R. SheaDonald P. Weiss
    • David John BishopHerbert R. SheaDonald P. Weiss
    • F42C19/00
    • F42C15/18F42B3/113
    • An ordnance fuse apparatus is described that uses electrical and mechanical, and optical devices. The ordnance fuse apparatus includes a controller to control an optical switch and a laser to detonate an explosive charge of the ordnance. Other embodiments include an accelerometer and/or spin detector for detecting that the ordnance has been fired and an optical detector for detecting the proper operation of the laser and a position sensor for detecting correct positioning of the optical switch. Another embodiment includes a microlens to focus the laser optical signal onto the ignitor. In yet other embodiments, the explosive charge is detonated either by ignition of an ignitor or by a shock wave from the ignitor. The resulting ordnance fuse apparatus has significantly reduced size and improved performance and safety.
    • 描述了使用电和机械和光学装置的军火熔断器装置。 军火保险丝装置包括控制器,用于控制光学开关和激光以引爆弹药的炸药。 其他实施例包括用于检测军火已经被点火的加速度计和/或自旋检测器以及用于检测激光器的正常操作的光学检测器和用于检测光学开关的正确定位的位置传感器。 另一个实施例包括将激光光信号聚焦到点火器上的微透镜。 在另外的其它实施例中,通过点火器的点火或来自点火器的冲击波来引爆炸药。 所得到的军火保险丝装置具有显着减小的尺寸和改进的性能和安全性。