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1. 发明授权

US07239516B2 Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip 有权
标题翻译：用于保持冷却板/散热器和微芯片之间的接触的挠曲板
公开(公告)号：US07239516B2
公开(公告)日：2007-07-03
申请号：US10939230
申请日：2004-09-10
申请人： David C. Long , Glenn G. Daves , David L. Edwards , Ronald L. Hering , Sushumna Iruvanti , Kenneth C. Marston , Jason S. Miller
发明人： David C. Long , Glenn G. Daves , David L. Edwards , Ronald L. Hering , Sushumna Iruvanti , Kenneth C. Marston , Jason S. Miller
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A flexible plate for securing a microchip surface to the surface of a cooling device. The flexible plate allows for z-directional movement between the microchip subassembly having a circuit board and a semiconductor substrate, and the cooling device. The flexible plate is a compact, single piece design that provides constraints in alignment in the x-, y-, and theta-directions, while allowing for z-direction compliance and tilt compliance. The flexible plate has tabs for mounting the microchip subassembly and tabs for mounting the cooling device. The microchip tabs are opposite one another and the cooling device mounting tabs are opposite one another. The flexible plate is a one-piece construction made from sheet metal, plastic, or metal castings. The flexible plate has a band with all the tabs mounted on the inside of the band, or one set of tabs mounted on the outside of the band.
摘要翻译：用于将微芯片表面固定到冷却装置的表面的柔性板。柔性板允许具有电路板的微芯片组件和半导体衬底之间的z方向运动以及冷却装置。柔性板是一种紧凑的单件设计，可在x轴，y轴和θ轴方向上对齐，同时允许z方向顺应性和倾斜顺应性。柔性板具有用于安装用于安装冷却装置的微芯片组件和突出部的突片。微芯片接头彼此相对，并且冷却装置安装接头彼此相对。柔性板是由金属板，塑料或金属铸件制成的一体式结构。柔性板具有带子，其中所有突片安装在带的内部，或者一组安装在带的外侧上的突片。

2. 发明授权

US07086896B2 Expandable standoff connector with slit collar and related method 失效
标题翻译：具有狭缝环的可扩展的支座连接器及相关方法
公开(公告)号：US07086896B2
公开(公告)日：2006-08-08
申请号：US10904198
申请日：2004-10-28
申请人： David L. Edwards , Ronald L. Hering , David C. Long , Jason S. Miller
发明人： David L. Edwards , Ronald L. Hering , David C. Long , Jason S. Miller
IPC分类号： H01R13/73
CPC分类号： H05K7/142
摘要： An expanding standoff connector is disclosed including a collar having a slit through a wall of the collar, a tapered interior surface and an exterior surface configured to engage an interior of a mounting opening of the circuit board. A fastener including a threaded portion and a substantially cone shaped portion configured to mate with the tapered interior surface of the collar is placed within the collar and advanced to expand the collar to mount the circuit board. A related method for mounting a circuit board is also disclosed. Since the expansion is horizontal only (purely radial), a more uniform radial expansion from top-to-bottom of the collar is applied to the circuit board and a best-fit alignment between a circuit board and heatsink can be maintained.
摘要翻译：公开了一种扩展的支座连接器，其包括具有通过套环的壁的狭缝的套环，锥形内表面和被配置为接合电路板的安装开口的内部的外表面。包括螺纹部分和构造成与套环的锥形内表面配合的基本锥形部分的紧固件被放置在套环内并且前进以扩展套环以安装电路板。还公开了一种用于安装电路板的相关方法。由于膨胀仅是水平的（纯径向），所以从电路板的顶部到底部的更均匀的径向膨胀被施加到电路板上，并且可以保持电路板和散热器之间的最佳匹配对准。

3. 发明授权

US07394666B2 Circuit board cam-action standoff connector 有权
标题翻译：电路板凸轮动作支座连接器
公开(公告)号：US07394666B2
公开(公告)日：2008-07-01
申请号：US10904276
申请日：2004-11-02
申请人： David L. Edwards , Ronald L. Hering , David C. Long , Jason S. Miller , Carl R. Peterson
发明人： David L. Edwards , Ronald L. Hering , David C. Long , Jason S. Miller , Carl R. Peterson
IPC分类号： H05K1/11
CPC分类号： H05K7/142
摘要： A cam-action expanding standoff connector and related method are disclosed for mounting a circuit board. The standoff connector includes a body and a plurality of mounting members having interior longitudinally-extending camming portions for engagement by a cam. A cam is configured to be positioned within the mounting members in a first position in which the mounting members are not expanded against the interior of a mounting opening and in a second position in which the cam engages the camming portions to expand the plurality of mounting members against the interior of the mounting opening. Since the camming action is horizontal only (purely radial), practically no vertical forces are applied to the circuit board and a best-fit alignment between a circuit board and heatsink can be established and maintained.
摘要翻译：公开了一种用于安装电路板的凸轮动作扩展型支座连接器及相关方法。支座连接器包括主体和多个安装构件，其具有用于由凸轮接合的内部纵向延伸的凸轮部分。凸轮构造成在安装构件内定位在第一位置，在第一位置，安装构件不会抵靠安装开口的内部膨胀，并且在第二位置中凸轮接合凸轮部分以使多个安装构件抵靠安装开口的内部。由于凸轮作用仅仅是水平的（纯径向的），实际上没有垂直力施加到电路板上，并且可以建立和维持电路板和散热器之间的最佳配合。

4. 发明申请

US20080232072A1 CIRCUIT BOARD CAM-ACTION STANDOFF CONNECTOR 审中-公开
标题翻译：电路板摄像机保持连接器
公开(公告)号：US20080232072A1
公开(公告)日：2008-09-25
申请号：US12131352
申请日：2008-06-02
申请人： David L. Edwards , Ronald L. Hering , David C. Long , Jason S. Miller , Carl R. Peterson
发明人： David L. Edwards , Ronald L. Hering , David C. Long , Jason S. Miller , Carl R. Peterson
IPC分类号： H05K3/30 , H01R13/73
CPC分类号： H05K7/142
摘要： A cam-action expanding standoff connector and related method are disclosed for mounting a circuit board. The standoff connector includes a body and a plurality of mounting members having interior longitudinally-extending camming portions for engagement by a cam. A cam is configured to be positioned within the mounting members in a first position in which the mounting members are not expanded against the interior of a mounting opening and in a second position in which the cam engages the camming portions to expand the plurality of mounting members against the interior of the mounting opening. Since the camming action is horizontal only (purely radial), practically no vertical forces are applied to the circuit board and a best-fit alignment between a circuit board and heatsink can be established and maintained.
摘要翻译：公开了一种用于安装电路板的凸轮动作扩展型支座连接器及相关方法。支座连接器包括主体和多个安装构件，其具有用于由凸轮接合的内部纵向延伸的凸轮部分。凸轮构造成在安装构件内定位在第一位置，在第一位置，安装构件不会抵靠安装开口的内部膨胀，并且在第二位置中凸轮接合凸轮部分以使多个安装构件抵靠安装开口的内部。由于凸轮作用仅仅是水平的（纯径向的），实际上没有垂直力施加到电路板上，并且可以建立和维持电路板和散热器之间的最佳配合。

5. 发明授权

US06444082B1 Apparatus and method for removing a bonded lid from a substrate 失效
标题翻译：用于从基底去除粘结的盖的装置和方法
公开(公告)号：US06444082B1
公开(公告)日：2002-09-03
申请号：US09599754
申请日：2000-06-22
申请人： Barrie C. Campbell , David L. Edwards , Ronald L. Hering , Richard F. Shortt
发明人： Barrie C. Campbell , David L. Edwards , Ronald L. Hering , Richard F. Shortt
IPC分类号： B32B3500
CPC分类号： H01L21/67092 , Y10T29/49822 , Y10T29/53274 , Y10T156/1184 , Y10T156/1961
摘要： An apparatus and a method for removing a bonded lid from a substrate of variable size including nesting jaws to support and secure the substrate; and gripping jaws to grip the lid; wherein, in operation, the gripping jaws pivot with respect to the nesting jaws and create a, peeling action which separates the lid from the substrate with minimum force and without damage to the substrate or attached semiconductor devices.
摘要翻译：一种用于从包括嵌套爪的可变尺寸的基底去除粘合的盖的装置和方法，以支撑和固定基板; 和夹紧爪以夹紧盖子; 其中，在操作中，夹爪相对于嵌套爪枢转并且产生剥离动作，其以最小的力将盖与基板分开，并且不损坏基板或附接的半导体器件。

6. 发明授权

US06436223B1 Process and apparatus for improved module assembly using shape memory alloy springs 失效
标题翻译：使用形状记忆合金弹簧改进模块组装的工艺和装置
公开(公告)号：US06436223B1
公开(公告)日：2002-08-20
申请号：US09250312
申请日：1999-02-16
申请人： David L. Edwards , Enrique C. Abreu , Ronald L. Hering , David C. Olson
发明人： David L. Edwards , Enrique C. Abreu , Ronald L. Hering , David C. Olson
IPC分类号： B32B3100
CPC分类号： H01L21/68778 , F16F2224/0258 , H01L21/67092 , H01L21/67144 , Y10S148/908 , Y10S269/903 , Y10T29/53978
摘要： A fixture and process for assembly of semiconductor modules. Each module comprises a substrate and a cover attached to the substrate. The fixture comprises a baseplate adapted to accept the substrate and a spring-loading device containing a shape memory alloy spring engaging the cover. The shape memory alloy spring exerts a lesser force at room temperature and an elevated force at the bonding temperature of the bonding agent used to attach the cover to the substrate. The process comprises the steps of (a) loading she module into an assembly fixture and aligning a shape memory alloy spring over the module at room temperature; (b) placing the fixture and module into a heating chamber; (c) heating the fixture and module to a temperature sufficient for bonding and above the shape memory alloy spring transition temperature range so that the spring exerts an elevated force on the module; and (d) cooping the fixture and module below the transition temperature so that the spring exerts a lesser amount of force on the module, and disengaging the springs at the lower temperature.
摘要翻译：用于组装半导体模块的夹具和工艺。每个模块包括衬底和附接到衬底的盖。所述固定装置包括适于接纳所述基板的基板和包含接合所述盖的形状记忆合金弹簧的弹簧加载装置。形状记忆合金弹簧在室温下施加较小的力，并且在用于将盖附着到基底上的粘结剂的粘结温度下提高力。该过程包括以下步骤：（a）将模块加载到组装夹具中并在室温下将形状记忆合金弹簧对准模块; （b）将灯具和模块放入加热室; （c）将夹具和模块加热到足以粘结的温度并高于形状记忆合金弹簧转变温度范围，使得弹簧在模块上施加升高的力; 和（d）将夹具和模块配合在转变温度以下，使得弹簧在模块上施加较小的力，并在较低温度下分离弹簧。

7. 发明授权

US06703560B2 Stress resistant land grid array (LGA) module and method of forming the same 有权
标题翻译：耐压地格栅阵列（LGA）模块及其形成方法
公开(公告)号：US06703560B2
公开(公告)日：2004-03-09
申请号：US09838454
申请日：2001-04-19
申请人： Patrick Anthony Coico , James H. Covell , Benjamin V. Fasano , Lewis S. Goldman , Ronald L. Hering , Sundar M. Kamath , Kenneth Charles Marston , Frank Louis Pompeo , Karl J. Puttlitz , Jeffrey Allen Zitz
发明人： Patrick Anthony Coico , James H. Covell , Benjamin V. Fasano , Lewis S. Goldman , Ronald L. Hering , Sundar M. Kamath , Kenneth Charles Marston , Frank Louis Pompeo , Karl J. Puttlitz , Jeffrey Allen Zitz
IPC分类号： H01L2302
CPC分类号： H01L21/50 , H01L23/04 , H01L25/0655 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/09701 , H01L2924/16152 , H01L2924/3511 , H05K1/0271 , H05K3/301 , H01L2224/0401
摘要： An integrated circuit module, a land grid array module, and a method for forming the module, include a substrate, which mounts one or more chips or discrete electronic components, and a cap for covering the substrate, and including at least one protrusion coupled to the cap for limiting the amount of flexing of the substrate during actuation. The at least one protrusion can be either rigidly fixed to the cap or adjustably inserted through the cap.
摘要翻译：集成电路模块，焊盘栅阵列模块以及用于形成模块的方法包括安装一个或多个芯片或分立电子部件的基板以及用于覆盖基板的盖，并且包括至少一个连接到用于在致动期间限制基板的弯曲量的盖。所述至少一个突起可以刚性地固定到盖上或者可调节地插入通过盖。

8. 发明授权

US6049456A Electronic module adjustment design and process using shims 有权
标题翻译：电子模块调整设计和使用垫片的过程
公开(公告)号：US6049456A
公开(公告)日：2000-04-11
申请号：US152904
申请日：1998-09-14
申请人： Gaetano P. Messina , Armando S. Cammarano , Patrick A. Coico , Ronald L. Hering , Eric B. Hultmark , Raed A. Sherif
发明人： Gaetano P. Messina , Armando S. Cammarano , Patrick A. Coico , Ronald L. Hering , Eric B. Hultmark , Raed A. Sherif
IPC分类号： H01L23/40 , H05K7/20
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4087 , H01L2924/0002 , H01L2924/09701
摘要： A thermal conduction module for cooling one or more integrated circuit chips mounted on a substrate is described. At least one shim is disposed between the base plate and the cover plate of the module to establish a predetermined dimension between the cover plate and the integrated circuit chips mounted on the substrate for insertion of a thermal paste. The shims may be metal, engineered plastic, or thermally and electrically conductive or nonconductive creep resistant materials able to withstand the stress and load within the module over time. The shim may be a plurality of shims having the same thickness or a plurality of shims having a multiplicity of thicknesses. Most preferably, the shim conforms to the periphery of the cover plate or base plate. A method of determining the proper shim thickness is also described wherein an initial reading of the thickness of the cover plate and base plate of the module is obtained. A second reading of the thickness of the module is obtained after the substrate, mounted with at least one integrated circuit chip, is placed onto the base plate followed by a temporary spacer and the cover plate. One or more shims are selected which are equal to the difference between the initial reading and the second reading. The cover plate is removed and the spacer is replaced with the appropriate shim. The cover plate is then fastened to the base plate. Also described is a kit for fixing the thermal paste gap dimension in electronic modules comprising a base plate, cover plate, and a plurality of shims having a multiplicity of thicknesses.
摘要翻译：描述了用于冷却安装在基板上的一个或多个集成电路芯片的热传导模块。在基板和模块的盖板之间设置至少一个垫片，以在盖板和安装在基板上的用于插入热粘贴的集成电路芯片之间建立预定尺寸。垫片可以是金属，工程塑料，或导热或非导电的抗蠕变材料，能够经受住模块内的应力和负荷。垫片可以是具有相同厚度的多个垫片或具有多个厚度的多个垫片。最优选地，垫片符合盖板或底板的周边。还描述了确定适当垫片厚度的方法，其中获得了模块的盖板和基板的厚度的初始读数。在安装有至少一个集成电路芯片的基板被放置在基板上，之后是临时间隔件和盖板之后，获得模块厚度的二读。选择一个或多个垫片，其等于初始读数和第二读数之间的差。拆下盖板，并用适当的垫片更换垫片。然后将盖板固定在基板上。还描述了一种用于将热糊料间隙尺寸固定在包括基板，盖板和多个厚度的多个垫片的电子模块中的套件。

9. 发明申请

US20090098666A1 CHIP PACKAGE ASSEMBLY USING CHIP HEAT TO CURE AND VERIFY 审中-公开
标题翻译：芯片包装组件使用芯片热固化和验证
公开(公告)号：US20090098666A1
公开(公告)日：2009-04-16
申请号：US11870571
申请日：2007-10-11
申请人： Ronald L. Hering , Kathryn C. Rivera , Kamal K. Sikka
发明人： Ronald L. Hering , Kathryn C. Rivera , Kamal K. Sikka
IPC分类号： H01L21/66
CPC分类号： H01L22/14 , G01R31/2875 , H01L23/34 , H01L23/3675 , H01L23/42 , H01L23/4275 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/16152 , H01L2924/00
摘要： Methods of assembling a chip package are disclosed that employ heat from test pattern operation of the chip to cure a thermal interface material. The methods may also simultaneously verify thermal performance of the package using the heat from test pattern operation. Further, the heat may be used to cure the sealing material and/or underfill material, where they are used.
摘要翻译：公开了组装芯片封装的方法，其采用来自芯片的测试图案操作的热量来固化热界面材料。该方法还可以使用来自测试图案操作的热量同时验证包装的热性能。此外，可以使用热量来固化所使用的密封材料和/或底部填充材料。

10. 发明授权

US06964885B2 Stress resistant land grid array (LGA) module and method of forming the same 失效
标题翻译：耐压地格栅阵列（LGA）模块及其形成方法
公开(公告)号：US06964885B2
公开(公告)日：2005-11-15
申请号：US10752255
申请日：2004-01-06
申请人： Patrick Anthony Coico , James H. Covell , Benjamin V. Fasano , Lewis S. Goldman , Ronald L. Hering , Sundar Kamath , Kenneth Charles Marston , Frank Louis Pompeo , Karl J. Puttlitz , Jeffrey Allen Zitz
发明人： Patrick Anthony Coico , James H. Covell , Benjamin V. Fasano , Lewis S. Goldman , Ronald L. Hering , Sundar Kamath , Kenneth Charles Marston , Frank Louis Pompeo , Karl J. Puttlitz , Jeffrey Allen Zitz
IPC分类号： H01L21/50 , H01L23/04 , H01L25/065 , H05K1/02 , H05K3/30 , H01L21/44 , H01L21/48
CPC分类号： H01L21/50 , H01L23/04 , H01L25/0655 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/09701 , H01L2924/16152 , H01L2924/3511 , H05K1/0271 , H05K3/301 , H01L2224/0401
摘要： An integrated circuit module, a land grid array module, and a method for forming the module, include a substrate, which mounts one or more chips or discrete electronic components, and a cap for covering the substrate, and including at least one protrusion coupled to the cap for limiting the amount of flexing of the substrate during actuation. The at least one protrusion can be either rigidly fixed to the cap or adjustably inserted through the cap.
摘要翻译：集成电路模块，焊盘栅阵列模块以及用于形成模块的方法包括安装一个或多个芯片或分立电子部件的基板以及用于覆盖基板的盖，并且包括至少一个连接到用于在致动期间限制基板的弯曲量的盖。所述至少一个突起可以刚性地固定到盖上或者可调节地插入通过盖。

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