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1. 发明授权

US06964885B2 Stress resistant land grid array (LGA) module and method of forming the same 失效
标题翻译：耐压地格栅阵列（LGA）模块及其形成方法
公开(公告)号：US06964885B2
公开(公告)日：2005-11-15
申请号：US10752255
申请日：2004-01-06
申请人： Patrick Anthony Coico , James H. Covell , Benjamin V. Fasano , Lewis S. Goldman , Ronald L. Hering , Sundar Kamath , Kenneth Charles Marston , Frank Louis Pompeo , Karl J. Puttlitz , Jeffrey Allen Zitz
发明人： Patrick Anthony Coico , James H. Covell , Benjamin V. Fasano , Lewis S. Goldman , Ronald L. Hering , Sundar Kamath , Kenneth Charles Marston , Frank Louis Pompeo , Karl J. Puttlitz , Jeffrey Allen Zitz
IPC分类号： H01L21/50 , H01L23/04 , H01L25/065 , H05K1/02 , H05K3/30 , H01L21/44 , H01L21/48
CPC分类号： H01L21/50 , H01L23/04 , H01L25/0655 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/09701 , H01L2924/16152 , H01L2924/3511 , H05K1/0271 , H05K3/301 , H01L2224/0401
摘要： An integrated circuit module, a land grid array module, and a method for forming the module, include a substrate, which mounts one or more chips or discrete electronic components, and a cap for covering the substrate, and including at least one protrusion coupled to the cap for limiting the amount of flexing of the substrate during actuation. The at least one protrusion can be either rigidly fixed to the cap or adjustably inserted through the cap.
摘要翻译：集成电路模块，焊盘栅阵列模块以及用于形成模块的方法包括安装一个或多个芯片或分立电子部件的基板以及用于覆盖基板的盖，并且包括至少一个连接到用于在致动期间限制基板的弯曲量的盖。所述至少一个突起可以刚性地固定到盖上或者可调节地插入通过盖。

2. 发明授权

US06703560B2 Stress resistant land grid array (LGA) module and method of forming the same 有权
标题翻译：耐压地格栅阵列（LGA）模块及其形成方法
公开(公告)号：US06703560B2
公开(公告)日：2004-03-09
申请号：US09838454
申请日：2001-04-19
申请人： Patrick Anthony Coico , James H. Covell , Benjamin V. Fasano , Lewis S. Goldman , Ronald L. Hering , Sundar M. Kamath , Kenneth Charles Marston , Frank Louis Pompeo , Karl J. Puttlitz , Jeffrey Allen Zitz
发明人： Patrick Anthony Coico , James H. Covell , Benjamin V. Fasano , Lewis S. Goldman , Ronald L. Hering , Sundar M. Kamath , Kenneth Charles Marston , Frank Louis Pompeo , Karl J. Puttlitz , Jeffrey Allen Zitz
IPC分类号： H01L2302
CPC分类号： H01L21/50 , H01L23/04 , H01L25/0655 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/09701 , H01L2924/16152 , H01L2924/3511 , H05K1/0271 , H05K3/301 , H01L2224/0401
摘要： An integrated circuit module, a land grid array module, and a method for forming the module, include a substrate, which mounts one or more chips or discrete electronic components, and a cap for covering the substrate, and including at least one protrusion coupled to the cap for limiting the amount of flexing of the substrate during actuation. The at least one protrusion can be either rigidly fixed to the cap or adjustably inserted through the cap.
摘要翻译：集成电路模块，焊盘栅阵列模块以及用于形成模块的方法包括安装一个或多个芯片或分立电子部件的基板以及用于覆盖基板的盖，并且包括至少一个连接到用于在致动期间限制基板的弯曲量的盖。所述至少一个突起可以刚性地固定到盖上或者可调节地插入通过盖。

3. 发明授权

US07989229B2 Tactile surface inspection during device fabrication or assembly 有权
标题翻译：器件制造或装配期间的触觉表面检查
公开(公告)号：US07989229B2
公开(公告)日：2011-08-02
申请号：US11852493
申请日：2007-09-10
申请人： James H. Covell
发明人： James H. Covell
IPC分类号： G01R31/26
CPC分类号： H01L22/12
摘要： Processes for inspecting a surface during device fabrication include contacting the surface with a tactile sensor. The tactile sensor is an electroluminescent tactile sensor array or a current electrode sensor array or a capacitive sensor array. The sensor is configured to convert local stress resulting from contact with the surface into light intensity and/or modulation in local current density. Both the light intensity and current density are linearly proportional to the local stress. The image stress provided by the sensor can then be captured by focusing the light intensity onto a suitable detector to provide a topographical image of the surface. Current density can alternatively be directly sensed via high resolution electrode array.
摘要翻译：用于在装置制造期间检查表面的工艺包括使表面与触觉传感器接触。触觉传感器是电致发光触觉传感器阵列或电流电极传感器阵列或电容传感器阵列。该传感器被配置成将局部应力转化为局部电流密度的光强度和/或调制。光强度和电流密度都与局部应力成线性比例。然后可以通过将光强度聚焦到合适的检测器上来提供传感器提供的图像应力以提供表面的地形图像。可以通过高分辨率电极阵列直接感测电流密度。

4. 发明授权

US06276596B1 Low temperature solder column attach by injection molded solder and structure formed 失效
标题翻译：低温焊料柱通过注塑焊料附着并形成结构
公开(公告)号：US06276596B1
公开(公告)日：2001-08-21
申请号：US09649487
申请日：2000-08-28
申请人： Peter A. Gruber , Lannie R. Bolde , Guy P. Brouillette , James H. Covell , David Danovitch , Chon C. Lei
发明人： Peter A. Gruber , Lannie R. Bolde , Guy P. Brouillette , James H. Covell , David Danovitch , Chon C. Lei
IPC分类号： B23K3102
CPC分类号： H05K3/3468 , B23K3/0638 , B23K35/0222 , B23K2101/40 , H01L21/4846 , H05K2203/0113 , H05K2203/0338 , H05K2203/0415 , H05K2203/074 , H05K2203/128
摘要： A method for joining a multiplicity of multi-alloy solder columns to an electronic substrate and the structure formed by such method are disclosed. In the method, a mold plate equipped with a multiplicity of cavities is first filled by an injection molded solder technique with a high temperature solder forming a multiplicity of solder columns. The mold plate is then sandwiched between an extraction plate and a transfer plate by utilizing a multiplicity of displacement means equipped in the extraction plate to displace the multiplicity of solder columns from the mold plate into a multiplicity of apertures equipped in the transfer plate. The multiplicity of cavities in the transfer plate each has a straight opening and a flared opening. The flared opening is then filled with a low temperature solder paste to encapsulate one end of the high temperature solder column. The low temperature solder paste is then reflown on top of a conductive pad on an electronic substrate at a temperature lower than the melting temperature of the high temperature solder to form a bond between the solder column and the conductive pad.
摘要翻译：公开了一种将多种多合金焊料柱连接到电子基板的方法以及通过这种方法形成的结构。在该方法中，首先通过注射成型的焊接技术填充配备有多个空腔的模板，其中高温焊料形成多个焊料柱。然后通过利用设置在提取板中的多个位移装置将模板夹在提取板和转印板之间，以将多个焊料柱从模板移位成装配在转印板中的多个孔。传递板中的多个空腔各具有直的开口和扩口的开口。然后用扩散的开口填充低温焊膏以封装高温焊料柱的一端。然后在低于高温焊料的熔融温度的温度下，将低温焊膏在电子基板上的导电焊盘的顶部上进行退火，以在焊料柱和导电焊盘之间形成接合。

5. 发明授权

US07806312B2 Method and apparatus for removing known good die 失效
标题翻译：去除已知好模具的方法和装置
公开(公告)号：US07806312B2
公开(公告)日：2010-10-05
申请号：US11551754
申请日：2006-10-23
申请人： Lannie R. Bolde , James H. Covell , Mark W. Kapfhammer
发明人： Lannie R. Bolde , James H. Covell , Mark W. Kapfhammer
IPC分类号： B23K1/018
CPC分类号： H01L21/67144 , B23K1/018
摘要： A method and structure is disclosed for detaching a chip from a substrate that delays the delivery of shear force to the chip until the connectors attaching the chip to the substrate are soft enough that the delivery of shear force will not damage the chip's connectors. More particularly, the shear force is created by a bimetallic disk that, when heat is applied, is transformed into shearing force. The shearing force is delayed by a delaying device until the connectors connecting the chip to the substrate are soft enough that the application of shear force will separate the chip from the substrate without damaging the chip's connectors. The delaying device includes a physical gap that may be adjusted to control when the shear force is applied to the chip.
摘要翻译：公开了一种用于将芯片从衬底上分离的方法和结构，其将剪切力的传递延迟到芯片，直到将芯片附接到衬底的连接器足够柔软，使得剪切力的传递不会损坏芯片的连接器。更具体地，剪切力由双金属盘产生，当加热时，双金属盘被转化为剪切力。剪切力由延迟装置延迟，直到将芯片连接到基板的连接器足够柔软，使得施加剪切力将使芯片与基板分离而不损坏芯片的连接器。该延迟装置包括物理间隙，该物理间隙可以被调整以控制何时施加剪切力到芯片。

6. 发明授权

US06278193B1 Optical sensing method to place flip chips 有权
标题翻译：放置倒装芯片的光学感应方法
公开(公告)号：US06278193B1
公开(公告)日：2001-08-21
申请号：US09206157
申请日：1998-12-07
申请人： Patrick A. Coico , James H. Covell
发明人： Patrick A. Coico , James H. Covell
IPC分类号： H01L23544
CPC分类号： H01L24/81 , H01L23/544 , H01L2223/5442 , H01L2223/54473 , H01L2224/81801 , H01L2924/01023 , H01L2924/01033 , H01L2924/01075 , H01L2924/014 , H01L2924/14
摘要： A method and structure for manufacturing semiconductor devices comprising providing a chip and a substrate, aligning the chip and the substrate, attaching the chip to the substrate and optionally verifying chip/substrate alignment, the aligning comprising providing at least one chip alignment mark on a first side of the chip (wherein the chip alignment mark corresponds to chip pads on a second side of the chip) and aligning the alignment mark with substrate pads on the substrate.
摘要翻译：一种用于制造半导体器件的方法和结构，包括提供芯片和衬底，对准芯片和衬底，将芯片连接到衬底并且可选地验证芯片/衬底对准，该对准包括在第一衬底上提供至少一个芯片对准标记（其中芯片对准标记对应于芯片的第二侧上的芯片焊盘），并将对准标记与衬底上的衬底焊盘对准。

7. 发明申请

US20090068770A1 TACTILE SURFACE INSPECTION DURING DEVICE FABRICATION OR ASSEMBLY 有权
标题翻译：设备制造期间的手表表面检查或装配
公开(公告)号：US20090068770A1
公开(公告)日：2009-03-12
申请号：US11852493
申请日：2007-09-10
申请人： James H. Covell
发明人： James H. Covell
IPC分类号： H01L21/66
CPC分类号： H01L22/12
摘要： Processes for inspecting a surface during device fabrication include contacting the surface with a tactile sensor. The tactile sensor is an electroluminescent tactile sensor array or a current electrode sensor array or a capacitive sensor array. The sensor is configured to convert local stress resulting from contact with the surface into light intensity and/or modulation in local current density. Both the light intensity and current density are linearly proportional to the local stress. The image stress provided by the sensor can then be captured by focusing the light intensity onto a suitable detector to provide a topographical image of the surface. Current density can alternatively be directly sensed via high resolution electrode array.
摘要翻译：用于在装置制造期间检查表面的工艺包括使表面与触觉传感器接触。触觉传感器是电致发光触觉传感器阵列或电流电极传感器阵列或电容传感器阵列。该传感器被配置成将局部应力转化为局部电流密度的光强度和/或调制。光强度和电流密度都与局部应力成线性比例。然后可以通过将光强度聚焦到合适的检测器上来提供传感器提供的图像应力以提供表面的地形图像。可以通过高分辨率电极阵列直接感测电流密度。

8. 发明授权

US06333209B1 One step method for curing and joining BGA solder balls 失效
标题翻译：固化和连接BGA焊球的一步法
公开(公告)号：US06333209B1
公开(公告)日：2001-12-25
申请号：US09301569
申请日：1999-04-29
申请人： Patrick A. Coico , James H. Covell , Lewis S. Goldmann , Kimberly A. Kelly
发明人： Patrick A. Coico , James H. Covell , Lewis S. Goldmann , Kimberly A. Kelly
IPC分类号： H01L2148
CPC分类号： H01L21/563 , H01L24/28 , H01L2224/13111 , H01L2224/16 , H01L2224/29111 , H01L2224/2919 , H01L2224/73203 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/15311 , H01L2924/15787 , H01L2924/1579 , H01L2924/16152 , H01L2924/3011 , H01L2924/00015 , H01L2924/00014 , H01L2924/00
摘要： A one step method for curing encapsulant and joining Ball Grid Array (BGA) solder balls comprises curing an encapsulant material simultaneously with the joining of the eutectic material of the apparatus whether that eutectic material is a solder paste or preform, the balls being of a higher melt material or the balls themselves being an eutectic material. The method performs both functions in one pass through a furnace avoiding the separate and time consuming encapsulant and/or underfill curing step.
摘要翻译：用于固化密封剂和连接球栅阵列（BGA）焊球的一步法包括：与装置的共晶材料的接合同时固化密封剂材料，无论该共晶材料是焊膏还是预型体，球的高度熔化材料或球本身是共晶材料。该方法在一次通过炉中执行两个功能，避免了单独且耗时的密封剂和/或底部填充固化步骤。

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