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    • 10. 发明申请
    • CURABLE ORGANOPOLYSILOXANE COMPOSITION
    • 可固化的有机硅氧烷组合物
    • WO2006135036A1
    • 2006-12-21
    • PCT/JP2006/312088
    • 2006-06-09
    • DOW CORNING TORAY CO., LTD.USHIO, YoshitoMITANI, Osamu
    • USHIO, YoshitoMITANI, Osamu
    • C08L83/04
    • C08L83/04C08L83/14C08L2666/14C08L83/00
    • A curable organopolysiloxane composition comprising: (A) an organopolysiloxane (a1) that contains in one molecule at least one silicon-bonded alkoxysilyl-containing group and an average of at least 0.5 alkenyl groups; or a mixture of said organopolysiloxane (a1) with an organopolysiloxane (a2) that contains in one molecule at least two alkenyl groups and that is free of the alkoxysilyl-containing groups; (B) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms; (C) an organosilicon compound that contains in one molecule at least one silicon-bonded alkoxy group and that is free of the alkoxysilyl-containing groups; and (D) a hydrosilylation-reaction catalyst, has good adhesion to unclean aluminum die castings, PPS resins, etc., even when cured by heating at relatively low temperatures such as 100°C.
    • 一种可固化的有机聚硅氧烷组合物,其包含:(A)在一个分子中含有至少一个含硅键合的含烷氧基甲硅烷基且平均至少含有0.5个烯基的有机聚硅氧烷(a1) 或所述有机聚硅氧烷(a1)与一分子中含有至少两个烯基并且不含烷氧基甲硅烷基的有机聚硅氧烷(a2)的混合物; (B)在一个分子中含有至少两个与硅键合的氢原子的有机聚硅氧烷; (C)在一分子中含有至少一个与硅键合的烷氧基并且不含烷氧基甲硅烷基的基团的有机硅化合物; 和(D)氢化硅烷化反应催化剂,即使在相对低的温度如100℃下加热固化,也对不干净的铝压铸件,PPS树脂等具有良好的粘合性。