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1. 发明申请

WO2006104236A1 HOT-MELT SILICONE ADHESIVE 审中-公开
标题翻译：热熔硅胶
公开(公告)号：WO2006104236A1
公开(公告)日：2006-10-05
申请号：PCT/JP2006/306996
申请日：2006-03-27
申请人： DOW CORNING TORAY CO., LTD. , FUJISAWA, Toyohiko , USHIO, Yoshito , SUTOH, Manabu , TANIGUCHI, Yoshinori , NAKANISHI, Koji
发明人： FUJISAWA, Toyohiko , USHIO, Yoshito , SUTOH, Manabu , TANIGUCHI, Yoshinori , NAKANISHI, Koji
IPC分类号： C08L83/04 , C09J183/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/18 , C08G77/20 , C08G77/70 , C08G2170/20 , Y10T428/1476 , C08L83/00
摘要： A hot-melt silicone adhesive comprising: (A) an organopolysiloxane resin with a softening point in the range of 40 to 250°C; (B) an organopolysiloxane that at 25°C is liquid or in the state of a crude rubber, which contains in one molecule at least two alkenyl groups; (C) a composition selected from a mixture of (i) an organopolysiloxane that contains silicon-bonded hydrogen atoms and (ii) an organic silicon compound that contains a silicon-bonded alkoxy group; or (iii) an organopolysiloxane that contains silicon-bonded hydrogen atoms and a silicon-bonded alkoxy group; (D) a hydrosilylation catalyst; and (E) a hydrosilylation-reaction inhibitor, demonstrates good gap-filling ability during thermo-compressive bonding to adherends with high surface roughness, even at low pressures, and that provides strong adhesion to the adherend after cross-linking.
摘要翻译：一种热熔性硅氧烷粘合剂，其包含：（A）软化点在40至250℃范围内的有机聚硅氧烷树脂; （B）在25℃下为液体或呈粗橡胶状态的有机聚硅氧烷，其在一分子中含有至少两个烯基; （C）选自（i）含硅键合的氢原子的有机聚硅氧烷和（ii）含有硅键合的烷氧基的有机硅化合物的混合物的组合物; 或（iii）含硅键合氢原子和与硅键合的烷氧基的有机聚硅氧烷; （D）氢化硅烷化催化剂; 和（E）氢化硅烷化反应抑制剂，即使在低压下也具有高表面粗糙度的被粘物的热压粘合中的良好间隙填充能力，并且在交联后对被粘物提供强粘合性。

2. 发明申请

WO2007026727A1 INSULATING LIQUID DIE-BONDING AGENT AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：绝缘液体粘合剂和半导体器件
公开(公告)号：WO2007026727A1
公开(公告)日：2007-03-08
申请号：PCT/JP2006/317033
申请日：2006-08-23
申请人： DOW CORNING TORAY CO., LTD. , FUJISAWA, Toyohiko , USHIO, Yoshito
发明人： FUJISAWA, Toyohiko , USHIO, Yoshito
IPC分类号： C08L83/04 , C09J183/04 , H01L21/58 , H01L23/373
CPC分类号： H01L23/3114 , C08G77/12 , C08G77/18 , C08G77/20 , C08L83/00 , C08L83/04 , C09J183/04 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/83 , H01L2224/2919 , H01L2224/29191 , H01L2224/2929 , H01L2224/2939 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2224/8385 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10329 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01L2924/0715 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/45015 , H01L2924/207
摘要： An insulating liquid die-bonding agent for bonding a semiconductor-chip-mounting member to an active surface of a semiconductor chip, said agent comprising: (A) a mixture of (a-1) an organopolysiloxane resin having alkenyl groups and (a-2) a linear-chain organopolysiloxane having in one molecule at least two alkenyl groups; (B) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; (C) an organic silicon compound having in one molecule at least one silicon-bonded alkoxy groups; (D) insulating spherical silicone rubber particles having an average diameter of 0.1 to 50 µm and having a type A durometer hardness according to JIS K 6253 equal to or below 80; and (E) a hydrosilylation-reaction catalyst, may not damage the active surface of the semiconductor chip, is well suited for screen printing, is resistant to the formation of voids on the interface between the semiconductor chip and the die-bonding agent, and does not lose its wire-bonding properties.
摘要翻译：一种用于将半导体芯片安装部件接合到半导体芯片的有源表面的绝缘液体芯片接合剂，所述试剂包括：（A）（a-1）具有烯基的有机聚硅氧烷树脂和（a- 2）在一个分子中具有至少两个烯基的直链有机聚硅氧烷; （B）在一个分子中具有至少两个与硅键合的氢原子的有机聚硅氧烷; （C）在一个分子中具有至少一个与硅键合的烷氧基的有机硅化合物; （D）平均直径为0.1〜50μm且根据JIS K 6253的A型硬度计硬度等于或小于80的绝缘球形硅橡胶颗粒; 和（E）氢化硅烷化反应催化剂不会损坏半导体芯片的活性表面，非常适合于丝网印刷，耐半导体芯片和芯片结合剂之间的界面上形成空隙，以及不会失去其引线接合性能。

3. 发明申请

WO2007145226A1 DISPLAY DEVICE, METHOD OF MANUFACTURING THEREOF, AND METHOD OF IMPROVING VISIBILITY 审中-公开
标题翻译：显示装置，其制造方法和改进可见性的方法
公开(公告)号：WO2007145226A1
公开(公告)日：2007-12-21
申请号：PCT/JP2007/061848
申请日：2007-06-06
申请人： DOW CORNING TORAY CO., LTD. , NAKATA, Toshiki , SARUYAMA, Toshio , FUJISAWA, Toyohiko , IMAIZUMI, Toru , OZAKI, Kouichi , AOYAMA, Takaki
发明人： NAKATA, Toshiki , SARUYAMA, Toshio , FUJISAWA, Toyohiko , IMAIZUMI, Toru , OZAKI, Kouichi , AOYAMA, Takaki
IPC分类号： B24C1/06 , G09F9/33
CPC分类号： G09F9/33 , B24C1/06 , B24C1/08 , G09F2013/222
摘要： A display device having a surface with light-emitting regions and non-light-emitting regions, wherein the aforementioned light-emitting regions and non-light-emitting regions are subjected to simultaneous surface treatment selected from: (1) brush treatment; (2) blast treatment; or (3) combined brush and blast treatment, whereby after the aforementioned treatment the surfaces of the light-emitting regions have a 60°-mirror-surface glossiness according to JIS Z 8741 exceeding 20%, while the surfaces of the non-light-emitting regions have a 60°-mirror-surface glossiness according to JIS Z 8741 not exceeding 20%, has good visibility of images reproduced by the display, which is especially suitable for outdoor application.
摘要翻译：具有发光区域和非发光区域的表面的显示装置，其中上述发光区域和非发光区域经受同时的表面处理，其选自：（1）刷子处理; （2）爆破处理; 或（3）组合式刷涂和喷砂处理，由此在上述处理之后，发光区域的表面根据JIS Z 8741具有超过20％的60°镜面光泽度，而非发光区域的表面，发光区域根据JIS Z 8741不超过20％具有60°镜面光泽度，对于显示器再现的图像具有良好的可视性，这特别适用于户外应用。

4. 发明申请

WO2010032870A1 LIQUID DIE BONDING AGENT 审中-公开
标题翻译：液体接合剂
公开(公告)号：WO2010032870A1
公开(公告)日：2010-03-25
申请号：PCT/JP2009/066718
申请日：2009-09-16
申请人： DOW CORNING TORAY CO., LTD. , DOW CORNING KOREA LTD. , FUJISAWA, Toyohiko , HYUN, Daesup , NAKANISHI, Junji
发明人： FUJISAWA, Toyohiko , HYUN, Daesup , NAKANISHI, Junji
IPC分类号： C08L83/04 , C09J183/04 , H01L33/56
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08L83/00 , C09J183/04
摘要： A liquid die bonding agent comprising (A) an organopolysiloxane that has at least 2 alkenyl groups in one molecule, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms in one molecule, (C) a hydrosilylation reaction catalyst, (D) a hydrosilylation reaction inhibitor, and (E) an organic solvent that can dissolve components (A), (B), and (D), that is liquid, and that has a boiling point of 180°C to 400°C. Also, the preceding liquid die bonding agent that additionally comprises (F) an organosilicon compound-based adhesion promoter.
摘要翻译：一种液体胶片粘合剂，其包含（A）在一个分子中具有至少2个烯基的有机聚硅氧烷，（B）在一个分子中具有至少2个与硅键合的氢原子的有机聚硅氧烷，（C）氢化硅烷化反应催化剂（ D）氢化硅烷化反应抑制剂，和（E）能够溶解液体的成分（A），（B）和（D），沸点为180℃〜400℃的有机溶剂。另外，还包含（F）基于有机硅化合物的粘合促进剂的前述液体芯片粘合剂。

5. 发明申请

WO2004007628A1 SILICONE-BASED ADHESIVE SHEET, METHOD OF BONDING A SEMICONDUCTOR CHIP TO A CHIP ATTACHMENT COMPONENT, AND A SEMICONDUCTOR DEVICE 审中-公开
标题翻译：基于硅胶的粘合片，将半导体芯片连接到芯片连接部件的方法和半导体器件
公开(公告)号：WO2004007628A1
公开(公告)日：2004-01-22
申请号：PCT/JP2003/008936
申请日：2003-07-14
申请人： DOW CORNING TORAY SILICONE CO., LTD. , SUTOH, Manabu , USHIO, Yoshito , FUJISAWA, Toyohiko , MINE, Katsutoshi
发明人： SUTOH, Manabu , USHIO, Yoshito , FUJISAWA, Toyohiko , MINE, Katsutoshi
IPC分类号： C09J7/02
CPC分类号： H01L21/6836 , C08L83/00 , C09J5/06 , C09J7/35 , C09J183/04 , C09J2201/128 , C09J2203/326 , C09J2483/00 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/73 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/29 , H01L2224/2919 , H01L2224/29191 , H01L2224/29298 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83194 , H01L2224/83855 , H01L2224/85207 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01043 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01052 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01092 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/1301 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/00014 , H01L2924/0715 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/20753
摘要： A silicone-based adhesive sheet has either a layer of clay-like curable silicone composition on one side and a layer of slower curing clay-like curable silicone composition than the first composition layer on the other side, or a cured silicone layer on one side and a layer of clay-like curable silicone composition on the other side. The silicone-based adhesive sheet may be used in a method for bonding a semiconductor chip and a chip attachment component. A semiconductor device may be prepared by the method.
摘要翻译：硅酮类粘合片在一侧具有一层粘土状可固化硅酮组合物，另一侧具有比另一侧的第一组合物层更慢的固化粘土状可固化硅氧烷组合物层，或者一侧的固化的硅氧烷层和另一侧的粘土状可固化硅氧烷组合物层。硅酮类粘合片可以用于将半导体芯片和芯片安装部件接合的方法。可以通过该方法制备半导体器件。

6. 发明申请

WO2003031528A1 ADHESIVE SHEET OF CROSS-LINKED SILICONE, METHOD OF MANUFACTURING THEREOF, AND DEVICE_COMPRISING THE SHEET 审中-公开
标题翻译：交联硅胶的粘合片，其制造方法和装置 - 组合片
公开(公告)号：WO2003031528A1
公开(公告)日：2003-04-17
申请号：PCT/JP2002/010200
申请日：2002-09-30
申请人： DOW CORNING TORAY SILICONE CO., LTD. , USHIO, Yoshito , NAKAYAMA, Katsuyuki , FUJISAWA, Toyohiko
发明人： USHIO, Yoshito , NAKAYAMA, Katsuyuki , FUJISAWA, Toyohiko
IPC分类号： C09J7/00
CPC分类号： H01L24/83 , C09J7/10 , C09J7/40 , C09J183/04 , C09J2483/00 , H01L23/3121 , H01L24/29 , H01L24/45 , H01L24/48 , H01L2224/05599 , H01L2224/29 , H01L2224/2919 , H01L2224/29191 , H01L2224/29298 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73265 , H01L2224/8319 , H01L2224/8385 , H01L2224/85424 , H01L2224/85444 , H01L2224/8547 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01059 , H01L2924/01061 , H01L2924/01078 , H01L2924/01079 , H01L2924/01092 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/1301 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , Y10T428/31663 , H01L2924/00014 , H01L2924/0715 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/00012
摘要： A cross-linked silicone adhesive sheet has stability of peeling surfaces during peeling protective films away from both sides of the sheet. An adhesive sheet of a cross-linked silicone has protective films on both sides of the sheet. The protective films each have a thickness of 100 μm or less. A force of peeling of the protective films from the sheet is equal to or below 5.0 N/m. The difference between peeling forces of the films is equal to or exceeds 0.2 N/m. A method of manufacturing the adhesive sheet of a cross-linked silicone includes the steps of forming a film-like body by placing a cross-linkable silicone composition in a layer having a thickness of 100 μm or less between two protective films of different materials and then cross-linking the composition.
摘要翻译：交联的硅氧烷粘合片在从片材的两侧剥离保护膜时具有剥离表面的稳定性。交联硅树脂的粘合片在片材的两侧具有保护膜。保护膜的厚度为100μm以下。保护膜从片材剥离的力等于或低于5.0N / m。膜的剥离力之差等于或超过0.2N / m。制造交联硅氧烷粘合片的方法包括以下步骤：通过将可交联的硅氧烷组合物放置在不同材料的两个保护膜之间的厚度为100μm以下的层中，形成膜状体，以及然后交联组合物。

7. 发明申请

WO2014024807A2 CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF 审中-公开
标题翻译：可固化的硅氧烷组合物及其固化产物
公开(公告)号：WO2014024807A2
公开(公告)日：2014-02-13
申请号：PCT/JP2013/071087
申请日：2013-07-29
申请人： DOW CORNING TORAY CO., LTD.
发明人： ENAMI, Hiroji , FUJISAWA, Toyohiko
IPC分类号： C08L83/04
CPC分类号： C08L83/04 , H01L23/296 , H01L2924/0002 , H01L2924/00
摘要： The present invnetion relates to a curable silicone composition comprises: (A) an organopolysiloxane represented by the average composition formula: R a SiO (4-a)/2 (in the formula, R is a halogen-substituted or unsubstituted monovalent hydrocarbon group, but from 0.1 to 2.1 mol% of the groups represented by R are alkenyl groups, and "a" is a number from 1.9 to 2.4); (B) an organopolysiloxane having an average of 2 silicon-bonded hydrogen atoms in a molecule, in an amount such that silicon-bonded hydrogen atoms in component (B) is from 0.1 to 3.0 moles relative to 1 mole of alkenyl groups in component (A); and (C) a platinum-based catalyst, wherein a content of component (C) is an amount such that a content of platinum atoms is from 10 to 100 ppm, in terms of mass units, relative to the present composition, and a content of each of sodium and potassium in the present composition is 3 ppm or less, in terms of mass units, relative to the present composition. The curable silicone composition forms a cured product having excellent heat resistance, and a cured product having excellent heat resistance.
摘要翻译：本发明涉及一种可固化有机硅组合物，其包含：（A）由平均组成式R a a SiO（4-a）/ （式中，R是卤素取代的或未取代的一价烃基，但由R表示的基团0.1至2.1摩尔％为烯基，“a”为1.9至 2.4）; （B）分子中具有平均2个与硅键合的氢原子的有机聚硅氧烷，其用量相对于组分（1）中的1摩尔链烯基，组分（B）中与硅键合的氢原子为0.1-3.0摩尔，一个）; 和（C）铂基催化剂，其中组分（C）的含量为铂原子的含量以质量单位计相对于本发明组合物为10至100ppm，相对于本发明组合物，钠和钾中每一种的质量单位均为3ppm或更少。可固化有机硅组合物形成具有优异耐热性的固化产物和具有优异耐热性的固化产物。

8. 发明申请

WO2014105974A1 CURABLE ORGANOPOLYSILOXANE COMPOSITION FOR TRANSDUCERS AND APPLICATIONS OF SUCH CURABLE SILICONE COMPOSITION FOR TRANSDUCERS 审中-公开
标题翻译：用于变送器的可固化有机聚硅氧烷组合物和这种可固化硅酮组合物用于变送器的应用
公开(公告)号：WO2014105974A1
公开(公告)日：2014-07-03
申请号：PCT/US2013/077847
申请日：2013-12-26
申请人： DOW CORNING CORPORATION , DOW CORNING TORAY CO., LTD.
发明人： FUJISAWA, Toyohiko , FURUKAWA, Haruhiko , HUPFIELD, Peter Cheshire , KATO, Tomoko , KIM, Hong Sub , KITAURA, Eiji , LARSON, Kent, R. , NISHIUMI, Wataru , OGAWA, Takuya , ONISHI, Masayuki , OZAKI, Kouichi , WAKITA, Keiji
IPC分类号： C08K9/06 , C08L83/04 , H01B1/20 , H01B3/10 , H01B3/46
CPC分类号： H01B3/10 , C08G77/12 , C08G77/20 , C08K9/06 , C08K2003/2206 , C08K2003/2237 , C08K2003/2241 , C08L83/00 , C08L83/04 , H01B3/46 , H04R19/02 , H04R19/04
摘要： The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition and at least one or more type of fine particles, wherein a part or the entire amount of said fine particles is surface-treated by one or more types of surface treatment agent.
摘要翻译：本发明提供一种可固化的有机基聚硅氧烷组合物，其能够生产可用作换能器并具有优异的机械特性和/或电特性的固化制品。本发明还涉及用于换能器用途的新型可固化的有机基聚硅氧烷组合物，其包含可固化的有机基聚硅氧烷组合物和至少一种或多种类型的细颗粒，其中一部分或全部量的所述细颗粒用一种或多种类型进行表面处理的表面处理剂。

9. 发明申请

WO2014017670A1 MICROPARTICLES AND CURABLE ORGANOPOLYSILOXANE COMPOSITION CONTAINING THE SAME 审中-公开
标题翻译：含有相同的微量元素和可固化的有机聚硅氧烷组合物
公开(公告)号：WO2014017670A1
公开(公告)日：2014-01-30
申请号：PCT/JP2013/070954
申请日：2013-07-26
申请人： Dow Corning Toray Co., Ltd.
发明人： FUJISAWA, Toyohiko , OZAKI, Kouichi , IMAIZUMI, Toru , SUTOH, Manabu
IPC分类号： C08K5/56 , C08L23/00 , C08K3/00 , C08K5/57 , C08K13/00 , C08L83/04 , C08K9/10
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08J3/241 , C08J2383/04 , C08K5/0091 , C08K5/01 , C08K5/56 , C08L23/06 , C08L83/00 , C08L91/00
摘要： The present invention relates to microparticles comprising: (i) at least one type of an organic metal compound selected from the group consisting of organic titanium compounds, organic zirconium compounds, organic aluminum compounds, and organic tin compounds, and (ii) a thermoplastic polyolefin resin with a Z-average (Mz) of a weight average molecular weight (Mw) of at least 2500 and Mz/Mw of not more than 2.0, wherein the organic metal compound is dispersed in the thermoplastic polyolefin resin. The microparticles can provide a curable organopolysiloxane composition which forms a cured product having excellent adhesion with various base materials when heated and enables the sufficient suppression of the diminishment of the hardness and adhesiveness of the cured product due to changes over time during the storage of the curable organopolysiloxane composition.
摘要翻译：本发明涉及微粒，其包含：（i）至少一种选自有机钛化合物，有机锆化合物，有机铝化合物和有机锡化合物的有机金属化合物，和（ii）热塑性聚烯烃重均分子量（Mw）至少为2500的Z平均值（Mz）和Mz / Mw为2.0以下的树脂，其中有机金属化合物分散在热塑性聚烯烃树脂中。微粒可以提供可固化的有机基聚硅氧烷组合物，其在加热时形成与各种基材具有优异粘附性的固化产物，并且能够充分抑制固化产物的硬度和粘合性的降低，这是由于可固化的有机聚硅氧烷组合物。

10. 发明申请

WO2014105965A1 CURABLE ORGANOPOLYSILOXANE COMPOSITION FOR TRANSDUCERS AND APPLICATIONS OF SUCH CURABLE SILICONE COMPOSITION FOR TRANSDUCERS 审中-公开
标题翻译：用于传感器的可固化有机聚硅氧烷组合物和这种用于传感器的可固化硅氧烷组合物的应用
公开(公告)号：WO2014105965A1
公开(公告)日：2014-07-03
申请号：PCT/US2013/077830
申请日：2013-12-26
申请人： DOW CORNING CORPORATION , DOW CORNING TORAY CO., LTD.
发明人： FUJISAWA, Toyohiko , FUKUI, Hiroshi , FURUKAWA, Haruhiko , HUPFIFELD, Peter, Cheshire , KIM, Hong, Sub , KITAURA, Eiji , LARSON, Kent, R. , NISHIUMI, Wataru , OGAWA, Takuya , ONISHI, Masayuki , OZAKI, Kouichi , WAKITA, Keiji
IPC分类号： C08K9/06 , C08L83/04 , H01B1/20 , H01B3/10 , H01B3/46
CPC分类号： H01L41/193 , C08G77/12 , C08G77/20 , C08K3/01 , C08K3/04 , C08K3/22 , C08K3/34 , C08K3/36 , C08K9/06 , C08K2003/2206 , C08K2003/2227 , C08K2003/2237 , C08K2003/2241 , C08K2003/2275 , C08K2003/2296 , C08K2201/005 , C08K2201/006 , C08L83/00 , C08L83/04 , H01B3/10 , H01B3/46 , H01L41/083 , H01L41/45 , H04R19/00 , H04R19/02 , H04R19/04
摘要： The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition, dielectric inorganic fine particles having a specific dielectric constant of greater than or equal to 10, and fine particles having a specific dielectric constant of less than 10.
摘要翻译：本发明提供一种可固化的有机基聚硅氧烷组合物，其能够制备可用作换能器并具有优异的机械特性和/或电特性的固化制品。本发明还涉及用于换能器用途的新型可固化的有机聚硅氧烷组合物，其包含可固化的有机基聚硅氧烷组合物，具有大于或等于10的比介电常数的介电无机细颗粒和具有小于10的比介电常数的细颗粒。

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