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1. 发明申请

WO2021016743A1 CURABLE ORGANOPOLYSILOXANE COMPOSITION, CURED PRODUCT, AND ELECTRIC/ELECTRONIC EQUIPMENT 审中-公开
公开(公告)号：WO2021016743A1
公开(公告)日：2021-02-04
申请号：PCT/CN2019/097918
申请日：2019-07-26
申请人： DOW SILICONES CORPORATION , DOW TORAY CO., LTD. , FANG, Lei , CHEN, Chen , HUANG, Yan , ONISHI, Masayuki , FUJISAWA, Toyohiko , CHEN, Qi , YANG, Guijun
发明人： FANG, Lei , CHEN, Chen , HUANG, Yan , ONISHI, Masayuki , FUJISAWA, Toyohiko , CHEN, Qi , YANG, Guijun
IPC分类号： C08L83/07 , C09J183/07 , C09J183/05 , C08L83/05
摘要： A curable organopolysiloxane composition comprises: (A) an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organosiloxane having one silicon atom-bonded hydrogen atom per molecule and free of alkenyl groups and silicon atom-bonded alkoxy groups; (C) an organosiloxane having one silicon atom-bonded hydrogen atom and at least one silicon atom-bonded alkoxy group per molecule and free of alkenyl groups; (D) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule and free of alkenyl groups and silicon atom-bonded alkoxy groups; (E) a hydrosilylation reaction catalyst; and (F) a condensation reaction catalyst. The composition can be cured to form a cured product exhibiting excellent adhesion property against various substrates without occurring crack and delamination after a thermal shock test.

2. 发明申请

WO2012137854A1 ROOM-TEMPERATURE-CURABLE SILICONE RUBBER COMPOSITION 审中-公开
标题翻译：室温可固化硅橡胶组合物
公开(公告)号：WO2012137854A1
公开(公告)日：2012-10-11
申请号：PCT/JP2012/059275
申请日：2012-03-28
申请人： DOW CORNING TORAY CO., LTD. , KODAMA, Harumi , ONISHI, Masayuki
发明人： KODAMA, Harumi , ONISHI, Masayuki
IPC分类号： C08L83/14
CPC分类号： C08K3/36 , C08G77/18 , C08G77/50 , C08K5/5419 , C08K5/57 , C08L83/00 , C08L83/14 , C08L2666/52 , C08L2666/44
摘要： A room-temperature-curable silicone rubber composition comprises: (A) an organopolysiloxane having on silicon atoms in the molecular chain in one molecule at least two specific alkoxysilyl-containing groups; (B) an organopolysiloxane having on silicon atom in the molecular chain neither a hydroxyl group nor an alkoxy group; (C) an alkoxysilane or its partial hydrolysis and condensation product; (D) a condensation reaction catalyst; and optionally comprises (E) an adhesion promoter and/or (F) a reinforcing filler. The composition cures at room temperature due to contact with atmospheric moisture and exhibits an excellent adhesiveness to substrate in contact with the composition during the cure of the composition.
摘要翻译：室温可固化的硅橡胶组合物包含：（A）在一个分子中具有至少两个特定的含有烷氧基甲硅烷基的基团在分子链上的硅原子上的有机聚硅氧烷; （B）在分子链中的硅原子上既不具有羟基也不具有烷氧基的有机聚硅氧烷; （C）烷氧基硅烷或其部分水解和缩合产物; （D）缩合反应催化剂; 并且任选地包含（E）粘合促进剂和/或（F）增强填料。组合物由于与大气湿气接触而在室温下固化，并且在组合物固化期间与组合物接触时对基材表现出优异的粘附性。

3. 发明申请

WO2009054279A1 ROOM-TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION 审中-公开
标题翻译：室温可固化有机硅氧烷组合物
公开(公告)号：WO2009054279A1
公开(公告)日：2009-04-30
申请号：PCT/JP2008/068517
申请日：2008-10-06
申请人： DOW CORNING TORAY CO., LTD. , NABETA, Akiko , ONISHI, Masayuki , USHIO, Yoshito
发明人： NABETA, Akiko , ONISHI, Masayuki , USHIO, Yoshito
IPC分类号： C09D183/06
CPC分类号： C08L83/04 , C08G77/18 , C08K5/0091 , C08K5/5419 , C08L2666/52 , C08L2666/44
摘要： A room-temperature curable organopolysiloxane composition comprising: (A) a diorganopolysiloxane capped at both molecular terminals with trialkoxysilyl groups and having viscosity of 100 to 1,000,000 mPa⋅s at 25 °C; (B) a diorganodimethoxysilane or a partially hydrolyzed product thereof; (C) a diorganodialkoxysilane having silicon-bonded alkoxy group with two or more carbon atoms or a partially hydrolyzed product thereof; and (D) a titanium chelate catalyst, exhibits excellent storage stability and easiness of controlling curing speed as well as by strong adhesion to a substrate with which this composition is in contact during curing along with the possibility of interfacial peeling of the cured product from the aforementioned substrate.
摘要翻译：一种室温可固化的有机聚硅氧烷组合物，其包含：（A）在两个分子末端用三烷氧基甲硅烷基封端的二有机聚硅氧烷，并且在25℃下的粘度为100至1,000,000mPa·s; （B）二有机二甲氧基硅烷或其部分水解产物; （C）具有硅键合的具有两个或更多个碳原子的烷氧基的二有机二烷氧基硅烷或其部分水解产物; 和（D）钛螯合催化剂，表现出优异的储存稳定性和控制固化速度的容易性，以及通过对固化期间该组合物接触的基材的强粘合性以及固化产物的界面剥离的可能性上述基材。

4. 发明申请

WO2006006371A3 ROOM-TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION AND ELECTRICAL OR ELECTRONIC DEVICES 审中-公开
标题翻译：室温固化的有机聚硅氧烷组合物和电子或电子器件
公开(公告)号：WO2006006371A3
公开(公告)日：2006-03-02
申请号：PCT/JP2005011576
申请日：2005-06-17
申请人： DOW CORNING TORAY CO LTD , MITANI OSAMU , ONISHI MASAYUKI , KODAMA HARUMI
发明人： MITANI OSAMU , ONISHI MASAYUKI , KODAMA HARUMI
IPC分类号： C08L83/04
CPC分类号： C08L83/04 , C08G77/18 , C08G77/70 , C08K5/0091 , C08L83/00 , C08L2666/44
摘要： A room-temperature curable organopolysiloxane composition comprising: (A) organopolysiloxane that contains in each molecule at least two trialkoxysilyl-containing groups that are bonded to silicon atoms of the molecular chain; (B) diorganodialkoxysilane or product of its partial hydrolyzation; (C) organopolysiloxane that contains at least one silicon-bonded phenyl group in each molecule and is free of alkoxy groups; and (D) a titanium chelate catalyst, adheres during curing to a substrate with a sufficient strength but allows separation of a cured body of the composition from the substrate at the interface even after a long period of time.
摘要翻译：一种常温可固化的有机基聚硅氧烷组合物，其包含：（A）在每个分子中含有至少两个与分子链的硅原子键合的含三烷氧基甲硅烷基的基团的有机聚硅氧烷; （B）二有机二烷氧基硅烷或其部分水解产物; （C）在每个分子中含有至少一个与硅键合的苯基且不含烷氧基的有机聚硅氧烷; 和（D）钛螯合物催化剂，在固化过程中粘附到具有足够强度的基材上，但即使在长时间之后也允许组合物的固化体从界面处分离。

5. 发明申请

WO2006006371A2 ROOM-TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION AND ELECTRICAL OR ELECTRONIC DEVICES 审中-公开
标题翻译：室温可固化有机硅氧烷组合物和电气或电子设备
公开(公告)号：WO2006006371A2
公开(公告)日：2006-01-19
申请号：PCT/JP2005/011576
申请日：2005-06-17
申请人： DOW CORNING TORAY CO., LTD. , MITANI, Osamu , ONISHI, Masayuki , KODAMA, Harumi
发明人： MITANI, Osamu , ONISHI, Masayuki , KODAMA, Harumi
IPC分类号： C08L83/04
CPC分类号： C08L83/04 , C08G77/18 , C08G77/70 , C08K5/0091 , C08L83/00 , C08L2666/44
摘要： A room-temperature curable organopolysiloxane composition comprising: (A) organopolysiloxane that contains in each molecule at least two trialkoxysilyl-containing groups that are bonded to silicon atoms of the molecular chain; (B) diorganodialkoxysilane or product of its partial hydrolyzation; (C) organopolysiloxane that contains at least one silicon-bonded phenyl group in each molecule and is free of alkoxy groups; and (D) a titanium chelate catalyst, adheres during curing to a substrate with a sufficient strength but allows separation of a cured body of the composition from the substrate at the interface even after a long period of time.
摘要翻译：一种室温可固化的有机聚硅氧烷组合物，其包含：（A）在每个分子中含有至少两个与所述分子链的硅原子键合的含有三烷氧基甲硅烷基的基团的有机聚硅氧烷; （B）二有机二烷氧基硅烷或其部分水解产物; （C）在每个分子中含有至少一个与硅键合的苯基并且不含烷氧基的有机聚硅氧烷; 和（D）钛螯合催化剂，在固化期间以足够的强度固化到基材上，但是即使在长时间之后也允许组合物的固化体在界面处与界面处的界面分离。

6. 发明申请

WO2005021652A8 ADHESIVE SILICONE ELASTOMER SHEET 审中-公开
标题翻译：粘合硅胶弹性片
公开(公告)号：WO2005021652A8
公开(公告)日：2005-12-08
申请号：PCT/JP2004012801
申请日：2004-08-27
申请人： DOW CORNING TORAY CO LTD , TAKANAMI AKIKO , USHIO YOSHITO , MITANI OSAMU , ONISHI MASAYUKI
发明人： TAKANAMI AKIKO , USHIO YOSHITO , MITANI OSAMU , ONISHI MASAYUKI
IPC分类号： B32B25/20 , B32B25/08 , C08L83/04 , C08L83/05 , C08L83/07 , C09J7/00 , C09J7/02 , C09J183/04 , C09J183/05 , C09J183/07
CPC分类号： B32B25/20 , B32B25/08 , B32B2319/00 , B32B2405/00 , B32B2457/202 , C08G77/12 , C08G77/20 , C08G2170/40 , C08L83/00 , C09J7/10 , C09J7/38 , C09J183/04 , C09J2483/00 , G02F2202/28 , Y10T428/31663 , Y10T428/31786
摘要： Adhesive silicone elastomer sheet afforded by the cure of a hydrosilylation-curing silicone elastomer composition comprising: (A) an organopolysiloxane that contains at least one diorganosiloxane unit and that has at least two silicon-bonded alkenyl groups in each molecule, (B) an organopolysiloxane resin with the average unit formula: (R 3SiO1/2)x(SiO4/2)1.0 in which R is substituted or unsubstituted monovalent hydrocarbon group and x is a number from 0.5 to 1.0, (C) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule, and (D) a hydrosilylation catalyst. The adhesive silicone elastomer sheet is transparent, and whose surface exhibits a stable and permanent adhesiveness.
摘要翻译：通过固化氢化硅烷化固化的硅氧烷弹性体组合物提供的粘合性硅氧烷弹性体片，其包含：（A）含有至少一个二有机硅氧烷单元并且在每个分子中具有至少两个硅键合的烯基的有机聚硅氧烷，（B）有机聚硅氧烷树脂，其中R 1是取代或未取代的单价烃基，x是0.5至1.0的数的平均单元式：（R 1 3 SiO 1/2）x（SiO 4/2）1.0，（C）在每个分子中含有至少两个与硅键合的氢原子的有机聚硅氧烷，和（D）氢化硅烷化催化剂。粘合性有机硅弹性体片材是透明的，其表面具有稳定且永久的粘合性。

7. 发明申请

WO2011093353A2 THERMALLY CONDUCTIVE SILICONE RUBBER COMPOSITION 审中-公开
标题翻译：导热硅橡胶组合物
公开(公告)号：WO2011093353A2
公开(公告)日：2011-08-04
申请号：PCT/JP2011051538
申请日：2011-01-20
申请人： DOW CORNING TORAY CO LTD , KODAMA HARUMI , ONISHI MASAYUKI , SAKAGUCHI RYO , NAKAYOSHI KAZUMI
发明人： KODAMA HARUMI , ONISHI MASAYUKI , SAKAGUCHI RYO , NAKAYOSHI KAZUMI
CPC分类号： H01L23/296 , C08G77/20 , C08L83/04 , H01L2924/0002 , H01L2924/09701 , C08L83/00 , H01L2924/00
摘要： A thermally conductive silicone rubber composition comprises: (A) an organopolysiloxane that contains at least two silicon-bonded alkenyl groups in each molecule, that does not contain silicon-bonded hydroxyl and alkoxy groups, and that has a content of cyclic siloxanes having from 4 to 20 siloxane units of not more than 1,000 ppm in mass units; (B) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule and that does not contain silicon-bonded alkenyl, hydroxyl group, and alkoxy groups; (C) an adhesion promoter; (D) a thermally conductive filler; and (E) a hydrosilylation reaction catalyst; wherein the total quantity of components (B) and (C) is from 0.5 to 10 mass% of the total quantity of components (A), (B), and (C). The composition is characterized by reduced oil fraction that bleeds out during the course of curing, and by reduced low-boiling fraction that volatilizes during the course of curing.
摘要翻译：导热硅橡胶组合物包含：（A）在每个分子中含有至少两个与硅键合的烯基的有机聚硅氧烷，其不含硅键合的羟基和烷氧基，并且具有4 至20质量单位不超过1,000ppm的硅氧烷单元; （B）在每个分子中含有至少两个与硅键合的氢原子并且不含与硅键合的烯基，羟基和烷氧基的有机聚硅氧烷; （C）粘合促进剂; （D）导热填料; 和（E）氢化硅烷化反应催化剂; 其中组分（B）和（C）的总量为组分（A），（B）和（C）总量的0.5-10质量％。该组合物的特征在于在固化过程中渗出的油分减少，并且通过减少在固化过程中挥发的低沸点馏分。

8. 发明申请

WO2005123839A1 CURABLE ORGANOPOLYSILOXANE COMPOSITION 审中-公开
标题翻译：可固化的有机硅氧烷组合物
公开(公告)号：WO2005123839A1
公开(公告)日：2005-12-29
申请号：PCT/JP2005/010759
申请日：2005-06-07
申请人： DOW CORNING TORAY CO., LTD. , NAKATA, Toshiki , ONISHI, Masayuki , OZAKI, Kouichi
发明人： NAKATA, Toshiki , ONISHI, Masayuki , OZAKI, Kouichi
IPC分类号： C08L83/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/20 , C08L83/00
摘要： A curable organopolysiloxane composition comprising: (A) an organopolysiloxane having an average of at least 1.5 alkenyl groups per molecule; (B) an organopolysiloxane having an average of at least 1.5 silicon-bonded hydrogen atoms per molecule; (C) a hydrosilylation-reaction catalyst; and (D) microscopic particles of thermoplastic resin, said particles comprising a thermoplastic resin and at least one type of an organometallic compound selected from the group consisting of organotitanium compound, organozirconium compound, organoaluminum compound, and organotin compound, said organometallic compound being either admixed or encapsulated with said thermoplastic resin, allows obtaining of a cured body not subject to decrease in hardness with the lapse of time during storage of the composition, and forms cured body exhibiting excellent adhesion to various substrates by heating.
摘要翻译：一种可固化的有机聚硅氧烷组合物，其包含：（A）每分子平均具有至少1.5个烯基的有机聚硅氧烷; （B）每分子平均具有至少1.5个硅键合的氢原子的有机聚硅氧烷; （C）氢化硅烷化反应催化剂; 和（D）热塑性树脂的微观颗粒，所述颗粒包含热塑性树脂和至少一种选自有机钛化合物，有机锆化合物，有机铝化合物和有机锡化合物的有机金属化合物，所述有机金属化合物被混合或与所述热塑性树脂一起封装，可以获得在组合物储存期间随着时间推移而不会降低硬度的固化体，并且通过加热形成对各种基材具有优异粘附性的固化体。

9. 发明申请

WO2005021652A1 ADHESIVE SILICONE ELASTOMER SHEET 审中-公开
标题翻译：胶粘剂有机硅弹性体片材
公开(公告)号：WO2005021652A1
公开(公告)日：2005-03-10
申请号：PCT/JP2004/012801
申请日：2004-08-27
申请人： DOW CORNING TORAY CO., LTD. , TAKANAMI, Akiko , USHIO, Yoshito , MITANI, Osamu , ONISHI, Masayuki
发明人： TAKANAMI, Akiko , USHIO, Yoshito , MITANI, Osamu , ONISHI, Masayuki
IPC分类号： C08L83/04
CPC分类号： B32B25/20 , B32B25/08 , B32B2319/00 , B32B2405/00 , B32B2457/202 , C08G77/12 , C08G77/20 , C08G2170/40 , C08L83/00 , C09J7/10 , C09J7/38 , C09J183/04 , C09J2483/00 , G02F2202/28 , Y10T428/31663 , Y10T428/31786
摘要： Adhesive silicone elastomer sheet afforded by the cure of a hydrosilylation-curing silicone elastomer composition comprising: (A) an organopolysiloxane that contains at least one diorganosiloxane unit and that has at least two silicon-bonded alkenyl groups in each molecule, (B) an organopolysiloxane resin with the average unit formula: (R 1 3 SiO 1/2 ) x (SiO 4/2 ) 1.0 in which R 1 is substituted or unsubstituted monovalent hydrocarbon group and x is a number from 0.5 to 1.0, (C) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule, and (D) a hydrosilylation catalyst. The adhesive silicone elastomer sheet is transparent, and whose surface exhibits a stable and permanent adhesiveness.
摘要翻译：通过固化氢化硅烷化固化有机硅弹性体组合物得到的粘合有机硅弹性体片材，其包含：（A）含有至少一个二有机硅氧烷单元并且在其中具有至少两个与硅键合的烯基的有机聚硅氧烷每个分子，（B）具有平均单元式：（R 1 1 SiO 1/2）1/2的有机聚硅氧烷树脂，（SiO 4/2）1/2其中R 1为取代或未取代的一价烃基，x为0.5至0.5的数字。 1.0，（C）在每个分子中含有至少两个与硅键合的氢原子的有机聚硅氧烷，和（D）氢化硅烷化催化剂。粘性硅橡胶片是透明的，其表面表现出稳定和永久的粘合性。

10. 发明申请

WO2003051933A1 PHOTOCURABLE ORGANIC POLYMER COMPOSITION 审中-公开
标题翻译：可光电有机聚合物组合物
公开(公告)号：WO2003051933A1
公开(公告)日：2003-06-26
申请号：PCT/JP2002/013200
申请日：2002-12-17
申请人： DOW CORNING TORAY SILICONE CO., LTD. , MITANI, Osamu , ONISHI, Masayuki , TAKANAMI, Akiko
发明人： MITANI, Osamu , ONISHI, Masayuki , TAKANAMI, Akiko
IPC分类号： C08F8/42
CPC分类号： C08C19/25 , C08F8/42 , C08K5/549
摘要： A photocurable organic polymer composition can be quickly cured into a moisture-penetration-resistant solid body by irradiation with ultraviolet rays, electron beams, or the like, and imparts adhesiveness to a cured body after aging. The photocurable organic polymer composition includes: (D) a photoinitiator and either (I) a composition or (II) a reaction product; where (I) the composition includes (A) a liquid organic polymer having at least one hydroxy group per molecule; (B) a radiation curable alkoxysilane; and (C) a condensation-reaction catalyst; and (II) the reaction product comprises (F) a reaction product of components (A), (B), and (C).
摘要翻译：可光固化的有机聚合物组合物可以通过紫外线，电子束等的照射快速固化成耐水分渗透性的固体，并且在老化后赋予固化体的粘附性。光固化性有机聚合物组合物包括：（D）光引发剂和（I）组合物或（II）反应产物; 其中（I）组合物包含（A）每分子具有至少一个羟基的液体有机聚合物; （B）可辐射固化的烷氧基硅烷; 和（C）缩合反应催化剂; 和（II）反应产物包含（F）组分（A），（B）和（C）的反应产物。

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