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    • 7. 发明申请
    • THERMALLY CONDUCTIVE SILICONE RUBBER COMPOSITION
    • 导热硅橡胶组合物
    • WO2011093353A2
    • 2011-08-04
    • PCT/JP2011051538
    • 2011-01-20
    • DOW CORNING TORAY CO LTDKODAMA HARUMIONISHI MASAYUKISAKAGUCHI RYONAKAYOSHI KAZUMI
    • KODAMA HARUMIONISHI MASAYUKISAKAGUCHI RYONAKAYOSHI KAZUMI
    • H01L23/296C08G77/20C08L83/04H01L2924/0002H01L2924/09701C08L83/00H01L2924/00
    • A thermally conductive silicone rubber composition comprises: (A) an organopolysiloxane that contains at least two silicon-bonded alkenyl groups in each molecule, that does not contain silicon-bonded hydroxyl and alkoxy groups, and that has a content of cyclic siloxanes having from 4 to 20 siloxane units of not more than 1,000 ppm in mass units; (B) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule and that does not contain silicon-bonded alkenyl, hydroxyl group, and alkoxy groups; (C) an adhesion promoter; (D) a thermally conductive filler; and (E) a hydrosilylation reaction catalyst; wherein the total quantity of components (B) and (C) is from 0.5 to 10 mass% of the total quantity of components (A), (B), and (C). The composition is characterized by reduced oil fraction that bleeds out during the course of curing, and by reduced low-boiling fraction that volatilizes during the course of curing.
    • 导热硅橡胶组合物包含:(A)在每个分子中含有至少两个与硅键合的烯基的有机聚硅氧烷,其不含硅键合的羟基和烷氧基,并且具有4 至20质量单位不超过1,000ppm的硅氧烷单元; (B)在每个分子中含有至少两个与硅键合的氢原子并且不含与硅键合的烯基,羟基和烷氧基的有机聚硅氧烷; (C)粘合促进剂; (D)导热填料; 和(E)氢化硅烷化反应催化剂; 其中组分(B)和(C)的总量为组分(A),(B)和(C)总量的0.5-10质量%。 该组合物的特征在于在固化过程中渗出的油分减少,并且通过减少在固化过程中挥发的低沸点馏分。
    • 8. 发明申请
    • CURABLE ORGANOPOLYSILOXANE COMPOSITION
    • 可固化的有机硅氧烷组合物
    • WO2005123839A1
    • 2005-12-29
    • PCT/JP2005/010759
    • 2005-06-07
    • DOW CORNING TORAY CO., LTD.NAKATA, ToshikiONISHI, MasayukiOZAKI, Kouichi
    • NAKATA, ToshikiONISHI, MasayukiOZAKI, Kouichi
    • C08L83/04
    • C08L83/04C08G77/12C08G77/14C08G77/16C08G77/20C08L83/00
    • A curable organopolysiloxane composition comprising: (A) an organopolysiloxane having an average of at least 1.5 alkenyl groups per molecule; (B) an organopolysiloxane having an average of at least 1.5 silicon-bonded hydrogen atoms per molecule; (C) a hydrosilylation-reaction catalyst; and (D) microscopic particles of thermoplastic resin, said particles comprising a thermoplastic resin and at least one type of an organometallic compound selected from the group consisting of organotitanium compound, organozirconium compound, organoaluminum compound, and organotin compound, said organometallic compound being either admixed or encapsulated with said thermoplastic resin, allows obtaining of a cured body not subject to decrease in hardness with the lapse of time during storage of the composition, and forms cured body exhibiting excellent adhesion to various substrates by heating.
    • 一种可固化的有机聚硅氧烷组合物,其包含:(A)每分子平均具有至少1.5个烯基的有机聚硅氧烷; (B)每分子平均具有至少1.5个硅键合的氢原子的有机聚硅氧烷; (C)氢化硅烷化反应催化剂; 和(D)热塑性树脂的微观颗粒,所述颗粒包含热塑性树脂和至少一种选自有机钛化合物,有机锆化合物,有机铝化合物和有机锡化合物的有机金属化合物,所述有机金属化合物被混合 或与所述热塑性树脂一起封装,可以获得在组合物储存期间随着时间推移而不会降低硬度的固化体,并且通过加热形成对各种基材具有优异粘附性的固化体。