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    • 8. 发明授权
    • Multi-bit non-volatile memory device and method therefor
    • 多位非易失性存储装置及其方法
    • US06706599B1
    • 2004-03-16
    • US10393065
    • 2003-03-20
    • Michael SaddBruce E. WhiteCraig T. Swift
    • Michael SaddBruce E. WhiteCraig T. Swift
    • H01L218247
    • B82Y10/00H01L21/28273H01L29/66825H01L29/7887
    • A multi-bit non-volatile memory device includes a charge storage layer (14) sandwiched between two insulating layers (12 and 16) formed on a semiconductor substrate (10). A thick oxide layer (18) is formed over the charge storage layer (14) and a minimum feature sized hole is etched in the thick oxide layer (18). An opening is formed in the thick oxide layer (18). Side-wall spacers (60) formed on the inside wall of the hole over the charge storage layer have a void (62) between them that is less than the minimum feature size. The side-wall spacers (60) function to mask portions of the charge storage layer (14), when the charge storage layer is etched away, to form the two separate charge storage regions (55 and 57) under the side-wall spacers (60). The device can be manufactured using only one mask step. Separating the charge storage regions prevents lateral conduction of charge in the nitride.
    • 多位非易失性存储器件包括夹在形成在半导体衬底(10)上的两个绝缘层(12和16)之间的电荷存储层(14)。 在电荷存储层(14)之上形成厚的氧化物层(18),并且在厚氧化物层(18)中蚀刻最小特征尺寸的孔。 在厚氧化物层(18)中形成开口。 形成在电荷存储层上的孔的内壁上的侧壁间隔物(60)在它们之间具有小于最小特征尺寸的空隙(62)。 当电荷存储层被蚀刻掉时,侧壁间隔物(60)用于掩蔽电荷存储层(14)的部分,以形成侧壁间隔物下面的两个分开的电荷存储区域(55和57) 60)。 该装置可以仅使用一个掩模步骤制造。 分离电荷存储区域可防止氮化物中电荷的横向传导。