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    • 4. 发明申请
    • Electronic device including a memory array and conductive lines
    • 电子设备包括存储器阵列和导线
    • US20070019472A1
    • 2007-01-25
    • US11188898
    • 2005-07-25
    • Jane YaterGowrishankar ChindaloreCheong Hong
    • Jane YaterGowrishankar ChindaloreCheong Hong
    • G11C16/04
    • G11C16/10
    • An electronic circuit can include a first memory cell and a second memory cell. In one embodiment, source/drain regions of the first and second memory cells can be electrically connected to each other. The source/drain regions may electrically float regardless of direction in which carriers flow through channel regions of the memory cells. In another embodiment, the first memory cell can be electrically connected to a first gate line, and the second memory cell can be electrically connected to a greater number of gate lines as compared to the first memory cell. In another aspect, the first and second memory cells are connected to the same bit line. Such bit line can electrically float when programming or reading the first memory cell or the second memory cell or any combination thereof.
    • 电子电路可以包括第一存储单元和第二存储单元。 在一个实施例中,第一和第二存储器单元的源极/漏极区域可彼此电连接。 源极/漏极区域可以电浮动,而不管载流子流过存储器单元的沟道区域的方向如何。 在另一个实施例中,与第一存储器单元相比,第一存储单元可以电连接到第一栅极线,并且第二存储单元可以电连接到更多数量的栅极线。 在另一方面,第一和第二存储器单元连接到相同的位线。 当编程或读取第一存储器单元或第二存储单元或其任何组合时,这种位线可以电浮动。
    • 6. 发明授权
    • Hot carrier injection programmable structure including discontinuous storage elements and spacer control gates in a trench
    • 热载体注入可编程结构,包括沟槽中的不连续存储元件和间隔物控制栅极
    • US07112490B1
    • 2006-09-26
    • US11188604
    • 2005-07-25
    • Cheong HongChi-Nan Li
    • Cheong HongChi-Nan Li
    • H01L21/336H01L21/84H01L21/8242H01L29/76G11C11/34
    • G11C16/10B82Y10/00H01L27/115H01L27/11556H01L29/4232H01L29/42332H01L29/42336H01L29/7881H01L29/792
    • A programmable storage device includes a first diffusion region underlying a portion of a first trench defined in a semiconductor substrate and a second diffusion region occupying an upper portion of the substrate adjacent to the first trench. The device includes a charge storage stack lining sidewalls and a portion of a floor of the first trench. The charge storage stack includes a layer of discontinuous storage elements (DSEs). Electrically conductive spacers formed on opposing sidewalls of the first trench adjacent to respective charge storage stacks serve as control gates for the device. The DSEs may be silicon, polysilicon, metal, silicon nitride, or metal nitride nanocrystals or nanoclusters. The storage stack includes a top dielectric of CVD silicon oxide overlying the nanocrystals overlying a bottom dielectric of thermally formed silicon dioxide. The device includes first and second injection regions in the layer of DSEs proximal to the first and second diffusion regions.
    • 可编程存储装置包括在半导体衬底中限定的第一沟槽的部分下面的第一扩散区域和占据与第一沟槽相邻的衬底的上部的第二扩散区域。 该装置包括一个电荷存储层,衬垫侧壁和第一沟槽的一部分地板。 电荷存储堆叠包括不连续存储元件(DSE)层。 形成在与相应电荷存储堆叠相邻的第一沟槽的相对侧壁上的导电间隔件用作该装置的控制栅极。 DSE可以是硅,多晶硅,金属,氮化硅或金属氮化物纳米晶体或纳米团簇。 存储堆叠包括覆盖在热形成的二氧化硅的底部电介质上的纳米晶体上的CVD氧化硅的顶部电介质。 该装置包括位于第一和第二扩散区域附近的DSE层中的第一和第二注入区域。
    • 9. 发明申请
    • ELECTRONIC DEVICE INCLUDING A MEMORY ARRAY AND CONDUCTIVE LINES
    • 包括记忆阵列和导电线的电子设备
    • US20080019178A1
    • 2008-01-24
    • US11834391
    • 2007-08-06
    • Jane YaterGowrishankar ChindaloreCheong Hong
    • Jane YaterGowrishankar ChindaloreCheong Hong
    • G11C16/04G11C11/34
    • G11C16/10
    • An electronic circuit can include a first memory cell and a second memory cell. In one embodiment, source/drain regions of the first and second memory cells can be electrically connected to each other. The source/drain regions may electrically float regardless of direction in which carriers flow through channel regions of the memory cells. In another embodiment, the first memory cell can be electrically connected to a first gate line, and the second memory cell can be electrically connected to a greater number of gate lines as compared to the first memory cell. In another aspect, the first and second memory cells are connected to the same bit line. Such bit line can electrically float when programming or reading the first memory cell or the second memory cell or any combination thereof.
    • 电子电路可以包括第一存储单元和第二存储单元。 在一个实施例中,第一和第二存储器单元的源极/漏极区域可彼此电连接。 源极/漏极区域可以电浮动,而不管载流子流过存储器单元的沟道区域的方向如何。 在另一个实施例中,与第一存储器单元相比,第一存储单元可以电连接到第一栅极线,并且第二存储单元可以电连接到更多数量的栅极线。 在另一方面,第一和第二存储器单元连接到相同的位线。 当编程或读取第一存储器单元或第二存储单元或其任何组合时,这种位线可以电浮动。