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    • 9. 发明授权
    • Method of manufacturing a silicon/silicon germanium heterojunction
bipolar transistor
    • 制造硅/硅锗异质结双极晶体管的方法
    • US5897359A
    • 1999-04-27
    • US987474
    • 1997-12-09
    • Deok Ho ChoSoo Min LeeTae Hyeon HanByung Ryul RyumKwang Eui Pyun
    • Deok Ho ChoSoo Min LeeTae Hyeon HanByung Ryul RyumKwang Eui Pyun
    • H01L29/74H01L21/331H01L29/737H01L21/8222
    • H01L29/66242H01L29/7378
    • There is disclosed a method of manufacturing a silicon/silicon germanium heterojunction bipolar transistor having a good conformity and an improved speed characteristic, which includes the steps of sequentially laminating an underlying nitride film, an oxide film, a polycrystalline silicon film and an upper nitride on a semiconductor substrate on which devices are separated and a collector is formed; sequentially etching said upper nitride film and said polycrystalline silicon film using the emitter as a mask, and then forming a side wall nitride film; selectively wet-etching said oxide film to form a side base linker opening; burying said base linker opening with a polycrystalline silicon; oxidizing said polycrystalline silicon film buried into said base linker opening and then removing said oxide film by means of the selective wet-etch process; removing said upper nitride and then forming a silicon/silicon germanium film as a base film on the exposed thereof; and forming an emitter said silicon/silicon germanium film.
    • 公开了一种制造具有良好一致性和改进的速度特性的硅/硅锗异质结双极晶体管的方法,其包括以下步骤:将下面的氮化物膜,氧化物膜,多晶硅膜和上部氮化物依次层压在 半导体衬底,器件分离并形成集电极; 使用发射极作为掩模,依次蚀刻所述上部氮化物膜和所述多晶硅膜,然后形成侧壁氮化物膜; 选择性地湿蚀刻所述氧化膜以形成侧基连接器开口; 用多晶硅掩埋所述基底连接器开口; 氧化所述多晶硅膜,所述多晶硅膜埋入所述基底连接器开口中,然后通过选择性湿蚀刻工艺除去所述氧化物膜; 去除所述上部氮化物,然后在其暴露时形成硅/硅锗膜作为基膜; 以及形成所述硅/硅锗膜的发射极。