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1. 发明申请

US20150198762A1 LED PACKAGE AND A BACKLIGHT UNIT COMPRISING SAID LED PACKAGE 审中-公开
标题翻译： LED封装和包含固定LED封装的背光单元
公开(公告)号：US20150198762A1
公开(公告)日：2015-07-16
申请号：US14668295
申请日：2015-03-25
申请人： Geun-Young KIM , Tomohisa ONISHI , Jung-Hun LEE , Young-Taek KIM , Jong-Jin PARK , Mi-Jeong YUN , Young-Sam PARK , Hun-Joo HAHM , Hyung-Suk KIM , Seong-Yeon HAN , Do-Hun KIM , Dae-Yeon KIM , Dae-Hyun KIM , Jung-Kyu PARK
发明人： Geun-Young KIM , Tomohisa ONISHI , Jung-Hun LEE , Young-Taek KIM , Jong-Jin PARK , Mi-Jeong YUN , Young-Sam PARK , Hun-Joo HAHM , Hyung-Suk KIM , Seong-Yeon HAN , Do-Hun KIM , Dae-Yeon KIM , Dae-Hyun KIM , Jung-Kyu PARK
IPC分类号： F21V8/00 , H01L33/48 , H01L33/62
CPC分类号： G02B6/0073 , G02B6/0023 , G02B6/005 , G02F1/133606 , G02F2001/133601 , G02F2001/133607 , H01L33/486 , H01L33/58 , H01L33/62 , H01L2224/45139 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/01322 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00011
摘要： A light emitting diode (LED) package includes: a main body mounted on a substrate; a light emitting diode that is mounted in the main body and emits light; and a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted. A backlight unit includes: a light guide plate configured to allow a light source to proceed to a liquid crystal panel; a light emitting diode (LED) mounted in a main body mounted on a substrate and generating a light source; and an LED package having a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted, and being mounted on the light guide plate.
摘要翻译：发光二极管（LED）封装包括：安装在基板上的主体; 发光二极管，其安装在主体内并发光; 并且引线框架暴露以允许主体选择性地顶部安装或侧面安装。背光单元包括：导光板，被配置为允许光源前进到液晶面板; 安装在安装在基板上并产生光源的主体中的发光二极管（LED）; 以及LED封装，其具有暴露的引线框架，以允许主体选择性地顶部安装或侧面安装，并且安装在导光板上。

2. 发明授权

US09022632B2 LED package and a backlight unit unit comprising said LED package 有权
标题翻译： LED封装和包括所述LED封装的背光单元单元
公开(公告)号：US09022632B2
公开(公告)日：2015-05-05
申请号：US13002419
申请日：2009-07-03
申请人： Geun-Young Kim , Tomohisa Onishi , Jung-Hun Lee , Young-Taek Kim , Jong-Jin Park , Mi-Jeong Yun , Young-Sam Park , Hun-Joo Hahm , Hyung-Suk Kim , Seong-Yeon Han , Do-Hun Kim , Dae-Yeon Kim , Dae-Hyun Kim , Jung-Kyu Park
发明人： Geun-Young Kim , Tomohisa Onishi , Jung-Hun Lee , Young-Taek Kim , Jong-Jin Park , Mi-Jeong Yun , Young-Sam Park , Hun-Joo Hahm , Hyung-Suk Kim , Seong-Yeon Han , Do-Hun Kim , Dae-Yeon Kim , Dae-Hyun Kim , Jung-Kyu Park
IPC分类号： G09F13/04 , G09F13/08 , F21V7/04 , H01L23/02 , H01L23/48 , F21V8/00 , G02F1/1335 , H01L33/48 , H01L33/58
CPC分类号： G02B6/0073 , G02B6/0023 , G02B6/005 , G02F1/133606 , G02F2001/133601 , G02F2001/133607 , H01L33/486 , H01L33/58 , H01L33/62 , H01L2224/45139 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/01322 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00011
摘要： A light emitting diode (LED) package includes: a main body mounted on a substrate; a light emitting diode that is mounted in the main body and emits light; and a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted. A backlight unit includes: a light guide plate configured to allow a light source to proceed to a liquid crystal panel; a light emitting diode (LED) mounted in a main body mounted on a substrate and generating a light source; and an LED package having a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted, and being mounted on the light guide plate.
摘要翻译：发光二极管（LED）封装包括：安装在基板上的主体; 发光二极管，其安装在主体内并发光; 并且引线框架暴露以允许主体选择性地顶部安装或侧面安装。背光单元包括：导光板，被配置为允许光源前进到液晶面板; 安装在安装在基板上并产生光源的主体中的发光二极管（LED）; 以及LED封装，其具有暴露的引线框架，以允许主体选择性地顶部安装或侧面安装，并且安装在导光板上。

3. 发明授权

US08735931B2 Light emitting diode package and fabrication method thereof 有权
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US08735931B2
公开(公告)日：2014-05-27
申请号：US12907348
申请日：2010-10-19
申请人： Kyung Taeg Han , In Tae Yeo , Hun Joo Hahm , Chang Ho Song , Seong Yeon Han , Yoon Sung Na , Dae Yeon Kim , Ho Sik Ahn , Young Sam Park
发明人： Kyung Taeg Han , In Tae Yeo , Hun Joo Hahm , Chang Ho Song , Seong Yeon Han , Yoon Sung Na , Dae Yeon Kim , Ho Sik Ahn , Young Sam Park
IPC分类号： H01L33/62
CPC分类号： H01L33/62 , H01L33/486 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.
摘要翻译：一种LED封装及其制造方法。 LED封装包括由热和电导体制成的第一引线框架和第二引线框架，每个引线框架包括平面基座和从基座向相反方向和向上方向延伸的延伸部分。封装还包括由树脂制成的封装主体，并且被配置为围绕第一引线框架和第二引线框架的延伸部分以固定第一和第二引线框架同时暴露第一引线框架和第二引线框架的下侧表面。 LED封装还包括设置在第一引线框架的基座的上表面上并电连接到第一引线框架和第二引线框架的基座的发光二极管芯片，以及用于封装发光二极管芯片的透明密封剂。

4. 发明授权

US08488081B2 Plane light source and LCD backlight unit having the same 有权
标题翻译：平面光源和具有相同的LCD背光单元
公开(公告)号：US08488081B2
公开(公告)日：2013-07-16
申请号：US12839945
申请日：2010-07-20
申请人： Seong Yeon Han , Hun Joo Hahm , Hyung Suk Kim , Young June Jeong , Young Sam Park , Chul Hee Yoo
发明人： Seong Yeon Han , Hun Joo Hahm , Hyung Suk Kim , Young June Jeong , Young Sam Park , Chul Hee Yoo
IPC分类号： G02F1/1335
CPC分类号： G02F1/133603
摘要： There are provided a plane light source and an LCD backlight unit having the same. A plane light source including light emitting device matrixes each having a plurality of light emitting devices arranged in rows and columns on a substrate according to an aspect of the invention includes: a first matrix having a plurality of light emitting devices arranged in rows and columns; and a second matrix having a plurality of light emitting devices arranged in rows and columns, the light emitting devices each located within a rectangle formed by four adjacent light emitting devices included in the first matrix, and forming angles θ satisfying the condition of 45°≦θ≦55° therebetween on the basis of a horizontal direction, wherein among pitches between one light emitting devices included in the light emitting device matrixes and another lighting light emitting device adjacent to the light emitting device, a pitch P1 between the light emitting device and the light emitting device diagonally across from the light emitting device satisfies the condition of 25 mm≦P1≦29 mm, and a pitch P2 between the light emitting device and another light emitting device located in a horizontal direction satisfies the condition of 34 mm≦P2≦38 mm.
摘要翻译：提供有平面光源和具有该平面光源的LCD背光单元。根据本发明的一个方面的包括发光器件矩阵的平面光源包括：具有排列成行和列的多个发光器件的发光器件矩阵，包括：具有排列成行和列的多个发光器件的第一矩阵; 以及具有排列成行和列的多个发光器件的第二矩阵，所述发光器件各自位于由包括在所述第一矩阵中的四个相邻的发光器件形成的矩形内，并且形成满足条件为45°@ 其中基于水平方向的θ@ 55°，其中在包括在发光器件矩阵中的一个发光器件和与发光器件相邻的另一个照明发光器件之间的间距中，发光器件与发光器件对角地穿过发光器件的发光器件满足25mm @ P1 @ 29mm的条件，并且发光器件和位于水平方向的另一个发光器件之间的间距P2满足条件为34mm @ P2 @ 38毫米。

5. 发明申请

US20120127705A1 LIGHT EMITTING MODULE 有权
标题翻译：发光模块
公开(公告)号：US20120127705A1
公开(公告)日：2012-05-24
申请号：US13363879
申请日：2012-02-01
申请人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Seong Yeon Han , Dae Hyun Kim , Do Hun Kim , Dae Yeon Kim
发明人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Seong Yeon Han , Dae Hyun Kim , Do Hun Kim , Dae Yeon Kim
IPC分类号： F21V21/005 , F21V5/04 , F21V21/00
CPC分类号： F21V21/005 , F21K9/00 , F21V13/02 , F21V13/08 , F21V23/06 , F21Y2103/10 , F21Y2115/10 , H01L2224/48091 , H01L2924/181 , H05K1/142 , H05K3/0061 , H05K2201/10106 , H05K2201/10189 , H05K2201/10446 , Y10S362/80 , H01L2924/00014 , H01L2924/00012
摘要： There is provided a light emitting module including: a printed circuit board; a plurality of light emitting diode chips disposed at a distance from one another on a conductive pattern formed on a top of the printed circuit board; and a connector formed on a bottom of the printed circuit board and electrically connected to the plurality of light emitting diode chips. The light emitting diode chips and the connector are optimally arranged to ensure that the light emitting module is suitably utilized as a high-density linear light source including a great number of light emitting diode chips and emits light outward with minimum loss.
摘要翻译：提供了一种发光模块，包括：印刷电路板; 在形成在印刷电路板的顶部上的导电图案上彼此间隔一定距离设置的多个发光二极管芯片; 以及形成在印刷电路板的底部并且电连接到多个发光二极管芯片的连接器。最优地布置发光二极管芯片和连接器，以确保发光模块适合用作包括大量发光二极管芯片的高密度线性光源，并以最小的损耗向外发光。

6. 发明授权

US07968894B2 LED package frame and LED package having the same 有权
标题翻译： LED封装框架和LED封装相同
公开(公告)号：US07968894B2
公开(公告)日：2011-06-28
申请号：US12549252
申请日：2009-08-27
申请人： Young Sam Park , Seung Ick Lee , Hun Joo Hahm , Hyung Suk Kim , Bum Jin Kim , Young June Jeong , Ho Sik Ahn , Jung Kyu Park
发明人： Young Sam Park , Seung Ick Lee , Hun Joo Hahm , Hyung Suk Kim , Bum Jin Kim , Young June Jeong , Ho Sik Ahn , Jung Kyu Park
IPC分类号： H01L27/15 , H01L31/12 , H01L33/00
CPC分类号： H01L33/62 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014
摘要： An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead-coating assembly configured to be inserted into the receiving part of the heat conductive member, including a lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member isolates the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability.
摘要翻译： LED封装框架包括LED芯片和由高导热性材料制成的导热部件。导热构件在侧部具有接收部，并且安装有LED芯片。构造成插入到包括导线的导热构件的接收部分的引线涂层组件的一端插入导热构件的接收部分中，并且电连接到LED芯片。引线与导热部件的接收部之间紧密接触的电绝缘层使引线与接收部分隔离。通过将导线插入导热构件，可以在保持高导热性和稳定性的同时减小尺寸。

7. 发明授权

US07946724B2 Surface light source using white light emitting diodes and liquid crystal display backlight unit having the same 有权
标题翻译：使用白色发光二极管的表面光源和具有相同的液晶显示器背光单元
公开(公告)号：US07946724B2
公开(公告)日：2011-05-24
申请号：US12078717
申请日：2008-04-03
申请人： Jae Hong Shin , Hun Joo Hahm , Hyung Suk Kim , Chang Ho Shin , Dae Yeon Kim , Chul Hee Yoo , Dong Hyun Cho
发明人： Jae Hong Shin , Hun Joo Hahm , Hyung Suk Kim , Chang Ho Shin , Dae Yeon Kim , Chul Hee Yoo , Dong Hyun Cho
IPC分类号： F21V21/00
CPC分类号： G02F1/133603 , G02F1/133606 , G02F1/133611 , G09G3/3413 , G09G3/3426 , G09G2320/0233
摘要： There is provided a surface light source using white light emitting diodes including: a plurality of white light emitting diodes arranged at a predetermined distance from one another, wherein the white light emitting diodes are arranged such that a light emitting diode unit defined by each of the white light emitting diodes and corresponding ones of the white light emitting diodes disposed at a closest distance from the each white light emitting diode has a central light amount ranging from 80% to 120% with respect to an average light amount of the white light emitting diodes.
摘要翻译：提供了一种使用白色发光二极管的表面光源，包括：布置成彼此预定距离的多个白色发光二极管，其中白色发光二极管被布置成使得由每个布置在与白色发光二极管最近距离的白色发光二极管和白色发光二极管中的相应的白色发光二极管的中心光量相对于白色发光二极管的平均光量为80％〜120％。

8. 发明授权

US07887225B2 Direct-type backlight unit having surface light source 失效
标题翻译：具有表面光源的直接型背光单元
公开(公告)号：US07887225B2
公开(公告)日：2011-02-15
申请号：US11822331
申请日：2007-07-05
申请人： Won Joon Lee , In Tae Yeo , Hun Joo Hahm , Young Sam Park , Kyung Taeg Han , Ho Sik Ahn , Chang Ho Song
发明人： Won Joon Lee , In Tae Yeo , Hun Joo Hahm , Young Sam Park , Kyung Taeg Han , Ho Sik Ahn , Chang Ho Song
IPC分类号： F21V8/00
CPC分类号： G02F1/133603 , H01L33/52 , H01L2224/16225 , H01L2224/48091 , H01L2924/00011 , H01L2924/00014 , H01L2933/005 , H01L2224/0401
摘要： In a direct-type backlight unit, a board has upper and lower surfaces defining a thickness therebetween. A plurality of unit light sources are disposed on the board. Here, in each of the unit light sources, a wiring pattern is formed on the board. A light emitting device is disposed on the wiring pattern to electrically connect thereto. A non-conductive side wall surrounds, without interruption, the light emitting device at a predetermined interval therefrom, the non-conductive side wall having a height lower than that of the light emitting device. Also, an encapsulant is formed in a dome shape inside the side wall. In this fashion, the light emitting devices are mounted on the board by a chip-on-board technique.
摘要翻译：在直接型背光单元中，板具有限定其间厚度的上表面和下表面。多个单元光源设置在板上。这里，在各单位光源中，在基板上形成配线图案。发光器件设置在布线图案上以与其电连接。非导电侧壁以不间断的方式围绕发光器件以预定的间隔包围，非导电侧壁的高度低于发光器件的高度。此外，密封剂在侧壁内形成为圆顶形状。以这种方式，发光器件通过板上芯片技术安装在板上。

9. 发明授权

US07683470B2 LED package 有权
标题翻译： LED封装
公开(公告)号：US07683470B2
公开(公告)日：2010-03-23
申请号：US11709154
申请日：2007-02-22
申请人： Seon Goo Lee , Hun Joo Hahm , Dae Yeon Kim
发明人： Seon Goo Lee , Hun Joo Hahm , Dae Yeon Kim
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/62 , F21K9/00 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2924/01078 , H01L2924/01079 , H05K1/021 , H05K3/244 , H05K2201/09827 , H05K2201/09981 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014
摘要： A Chip on Board (COB) package which can reduce the manufacturing costs by using a general PCB as a substrate, increase a heat radiation effect from a light source, thereby realizing a high quality light source at low costs, and a manufacturing method thereof. The COB package includes a board-like substrate with a circuit printed on a surface thereof, the substrate having a through hole. The package also includes a light source positioned in the through hole and including a submount and a dome structure made of resin, covering and fixing the light source to the substrate. The invention allows a good heat radiation effect by using the general PCB as the substrate, enabling manufacture of a high quality COB package at low costs. This in turn improves emission efficiency of the light source, ultimately realizing a high quality light source.
摘要翻译：通过使用通用PCB作为基板可以降低制造成本的芯片上（COB）封装，增加了来自光源的散热效果，从而以低成本实现高质量的光源及其制造方法。 COB封装包括具有印刷在其表面上的电路的板状衬底，该衬底具有通孔。封装还包括位于通孔中的光源，并且包括底座和由树脂制成的圆顶结构，将光源覆盖并固定到基板。本发明通过使用通用PCB作为基板来实现良好的散热效果，能够以低成本制造高质量的COB封装。这又提高了光源的发光效率，最终实现了高质量的光源。

10. 发明申请

US20100053956A1 LIGHT EMITTING MODULE 有权
标题翻译：发光模块
公开(公告)号：US20100053956A1
公开(公告)日：2010-03-04
申请号：US12535251
申请日：2009-08-04
申请人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Seong Yeon Han , Dae Hyun Kim , Do Hun Kim , Dae Yeon Kim
发明人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Seong Yeon Han , Dae Hyun Kim , Do Hun Kim , Dae Yeon Kim
IPC分类号： F21V1/00 , F21S4/00 , F21V29/00
CPC分类号： F21V21/005 , F21K9/00 , F21V13/02 , F21V13/08 , F21V23/06 , F21Y2103/10 , F21Y2115/10 , H01L2224/48091 , H01L2924/181 , H05K1/142 , H05K3/0061 , H05K2201/10106 , H05K2201/10189 , H05K2201/10446 , Y10S362/80 , H01L2924/00014 , H01L2924/00012
摘要： There is provided a light emitting module including: a printed circuit board; a plurality of light emitting diode chips disposed at a distance from one another on a conductive pattern formed on a top of the printed circuit board; and a connector formed on a bottom of the printed circuit board and electrically connected to the plurality of light emitting diode chips. The light emitting diode chips and the connector are optimally arranged to ensure that the light emitting module is suitably utilized as a high-density linear light source including a great number of light emitting diode chips and emits light outward with minimum loss.
摘要翻译：提供了一种发光模块，包括：印刷电路板; 在形成在印刷电路板的顶部上的导电图案上彼此间隔一定距离设置的多个发光二极管芯片; 以及形成在印刷电路板的底部并且电连接到多个发光二极管芯片的连接器。最优地布置发光二极管芯片和连接器，以确保发光模块适合用作包括大量发光二极管芯片的高密度线性光源，并以最小的损耗向外发光。

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