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    • 2. 发明申请
    • PHASE-CHANGE MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
    • 相变存储器件及其制造方法
    • US20100012915A1
    • 2010-01-21
    • US12425152
    • 2009-04-16
    • Sung Min YOONByoung Gon YUSoon Won JUNGSeung Yun LEEYoung Sam PARKJoon Suk LEE
    • Sung Min YOONByoung Gon YUSoon Won JUNGSeung Yun LEEYoung Sam PARKJoon Suk LEE
    • H01L47/00H01L21/06
    • H01L45/1233H01L45/06H01L45/126H01L45/144H01L45/1625H01L45/1683
    • A phase-change memory device in which a phase-change material layer has a multilayered structure with different compositions and a method of fabricating the same are provided. The phase-change memory device includes a first electrode layer formed on a substrate, a heater electrode layer formed on the first electrode layer, an insulating layer formed on the heater electrode layer and having a pore partially exposing the heater electrode layer, a phase-change material layer formed to fill the pore and partially contacting the heater electrode layer, and a second electrode layer formed on the phase-change material layer. The main operating region functioning as a memory operating region is formed of a Ge2Sb2+xTe5 phase-change material to ensure the stability of a memory operation, and simultaneously, the subsidiary regions formed of a Ge2Sb2Te5 phase-change material are disposed respectively on and under the Ge2Sb2+xTe5 main operating region to prevent leakage of thermal energy through an electrode, thereby reducing power consumption.
    • 提供了相变材料层具有不同组成的多层结构的相变存储器件及其制造方法。 相变存储器件包括形成在基板上的第一电极层,形成在第一电极层上的加热电极层,形成在加热器电极层上并具有部分地暴露加热器电极层的孔的绝缘层, 形成为填充孔并且部分地接触加热器电极层的改变材料层和形成在相变材料层上的第二电极层。 作为存储器工作区域的主要工作区域由Ge2Sb2 + xTe5相变材料形成,以确保存储器操作的稳定性,同时由Ge2Sb2Te5相变材料形成的辅助区域分别设置在其上 Ge2Sb2 + xTe5主要工作区域,以防止热能通过电极泄漏,从而降低功耗。
    • 7. 发明申请
    • PHASE CHANGE MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
    • 相变存储器件及其制造方法
    • US20090184307A1
    • 2009-07-23
    • US12240013
    • 2008-09-29
    • Sung Min YOONByoung Gon YuSeung Yun LeeYoung Sam ParkKyu Jeong ChoiNam Yeal Lee
    • Sung Min YOONByoung Gon YuSeung Yun LeeYoung Sam ParkKyu Jeong ChoiNam Yeal Lee
    • H01L21/06H01L45/00
    • H01L45/1233H01L45/06H01L45/126H01L45/144H01L45/1625
    • A phase change memory device and a method of fabricating the same are provided. A phase change material layer of the phase change memory device is formed of germanium (Ge)-antimony (Sb)-Tellurium (Te)-based Ge2Sb2+xTe5 (0.12≦x≦0.32), so that the crystalline state is determined as a stable single phase, not a mixed phase of a metastable phase and a stable phase, in phase transition between crystalline and amorphous states of a phase change material, and the phase transition according to increasing temperature directly transitions to the single stable phase from the amorphous state. As a result, set operation stability and distribution characteristics of set state resistances of the phase change memory device can be significantly enhanced, and an amorphous resistance can be maintained for a long time at a high temperature, i.e., around crystallization temperature, and thus reset operation stability and rewrite operation stability of the phase change memory device can be significantly enhanced.
    • 提供了一种相变存储器件及其制造方法。 相变存储器件的相变材料层由锗(Ge) - 锑(Sb) - 碲(Te)基Ge2Sb2 + xTe5(0.12 <= x <= 0.32)形成,从而确定晶体状态 作为稳定的单相,不是相变材料的晶态和非晶态之间的相转变中的亚稳相和稳定相的混合相,并且根据升温的相变随着温度的升高直接转变为单稳态 非晶态。 结果,可以显着提高相变存储器件的设定状态电阻的设定操作稳定性和分布特性,并且可以在高温下(即,结晶温度附近)长时间保持非晶形电阻,并因此复位 可以显着提高相变存储器件的操作稳定性和重写操作的稳定性。