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    • 2. 发明申请
    • PAD CONDITIONING HEAD FOR CMP PROCESS
    • 用于CMP工艺的PAD调节头
    • US20080057836A1
    • 2008-03-06
    • US11927048
    • 2007-10-29
    • Alexander PolyakAvi Tepman
    • Alexander PolyakAvi Tepman
    • B24B1/00
    • B24B53/017H01L21/31053
    • In a first aspect, a first apparatus is provided for a chemical mechanical polishing (CMP) process. The first apparatus includes (1) a rotatable member; (2) an end effector adapted to receive and retain a conditioning disk; and (3) an elastic device disposed between the rotatable member and the end effector. The elastic device is (a) adapted to rotate the end effector via a torque from the rotatable member, and (b) flexibly extensible so as to impart a force to the end effector while permitting the end effector to deviate from a perpendicular alignment with the rotatable member in order for a conditioning surface of the conditioning disk to conform to an irregular polishing surface of a pad being conditioned. Numerous other aspects are provided, including methods and apparatus for using liquid or gas to deter polishing slurry or debris from entering the conditioning head.
    • 在第一方面,提供了用于化学机械抛光(CMP)工艺的第一设备。 第一装置包括(1)可旋转构件; (2)适于接收和保持调节盘的端部执行器; 和(3)设置在可旋转构件和末端执行器之间的弹性装置。 弹性装置是(a)适于通过来自可旋转构件的扭矩旋转末端执行器,以及(b)柔性可伸展的,以便向末端执行器施加力,同时允许末端执行器偏离与 可旋转构件,以便调节盘的调节表面与被调节的垫的不规则抛光表面相一致。 提供了许多其它方面,包括使用液体或气体来阻止抛光浆料或碎屑进入调节头的方法和装置。
    • 5. 发明申请
    • Pad conditioning head for CMP process
    • 用于CMP工艺的垫片调节头
    • US20050167048A1
    • 2005-08-04
    • US10970365
    • 2004-10-21
    • Alexander PolyakAvi Tepman
    • Alexander PolyakAvi Tepman
    • B24B37/04B24B53/007H01L21/3105C23F1/00
    • B24B53/017H01L21/31053
    • In a first aspect, a first apparatus is provided for a chemical mechanical polishing (CMP) process. The first apparatus includes (1) a rotatable member; (2) an end effector adapted to receive and retain a conditioning disk; and (3) an elastic device disposed between the rotatable member and the end effector. The elastic device is (a) adapted to rotate the end effector via a torque from the rotatable member, and (b) flexibly extensible so as to impart a force to the end effector while permitting the end effector to deviate from a perpendicular alignment with the rotatable member in order for a conditioning surface of the conditioning disk to conform to an irregular polishing surface of a pad being conditioned. Numerous other aspects are provided, including methods and apparatus for using liquid or gas to deter polishing slurry or debris from entering the conditioning head.
    • 在第一方面,提供了用于化学机械抛光(CMP)工艺的第一设备。 第一装置包括(1)可旋转构件; (2)适于接收和保持调节盘的端部执行器; 和(3)设置在可旋转构件和末端执行器之间的弹性装置。 弹性装置是(a)适于通过来自可旋转构件的扭矩旋转末端执行器,以及(b)柔性可伸展的,以便向末端执行器施加力,同时允许末端执行器偏离与 可旋转构件,以便调节盘的调节表面与被调节的垫的不规则抛光表面相一致。 提供了许多其它方面,包括使用液体或气体来阻止抛光浆料或碎屑进入调节头的方法和装置。