专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JPS6174358A Manufacture of resin-sealed semiconductor device 失效
标题翻译：树脂密封半导体器件的制造
公开(公告)号：JPS6174358A
公开(公告)日：1986-04-16
申请号：JP19471784
申请日：1984-09-19
申请人： Akita Denshi Kk , Hitachi Ltd , Hitachi Micro Comput Eng Ltd
发明人： KIMOTO RYOSUKE , KAWANOBE TORU , OTSUKA KENICHI , MIYAMOTO KEIJI , INABA KICHIJI , ICHIHARA SEIICHI , ISHIKAWA KAZUYA
IPC分类号： H01L23/50 , H01L21/48 , H01L21/60 , H01L21/607
CPC分类号： H01L21/4821 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2224/92247 , H01L2924/01078 , H01L2924/181 , H01L2924/00012
摘要： PURPOSE:To prevent a surface treating solution from intruding into the interior of a package and to enable to improve the moisture resistance of a resin-sealed semiconductor device by a method wherein, before the assembly and sealing of the semiconductor device is performed, a surface treatment is performed on a lead frame, which is used for the assembly and sealing. CONSTITUTION:The assembly and sealing of a resin-sealed semiconductor device is performed using a lead frame. In that case, the lead frame is dipped in a fused solder 9 before the assembly and sealing is performed and a surface treatment is performed on the lead frame or a reflowing treatment is performed on the lead frame or a reflowing treatment is performed after a solder plating is performed on the lead frame. According to such a way, the surface treating solution is prevented from intruding into the interior of the package and the moisture resistance of the device is made to improve, and at the same time, the sealing strength is also made to improve.
摘要翻译：目的：为了防止表面处理溶液侵入到封装的内部，并且能够通过以下方法改善树脂密封的半导体器件的耐湿性，其中在半导体器件的组装和密封之前，在用于组装和密封的引线框架上进行处理。构成：树脂密封半导体器件的组装和密封使用引线框执行。在这种情况下，在进行组装和密封之前，引线框架被浸入熔融焊料9中，并且在引线框架上进行表面处理或者在引线框架上进行回流处理，或者在焊料之后进行回流处理在引线框架上进行电镀。按照这样一种方式，能够防止表面处理液侵入到包装体的内部，从而提高装置的耐湿性，同时也提高密封强度。

2. 发明专利

MY115170A SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE DEVICES 未知
公开(公告)号：MY115170A
公开(公告)日：2003-04-30
申请号：MYPI9500270
申请日：1995-02-08
申请人： HITACHI LTD
发明人： TSUNODA SHIGEHARU , ANJOH ICHIRO , OTSUKA KENICHI , SAEKI JUNICHI , YOSHIDA ISAMU , OOJI KAZUYA , HONDA MICHIHARU , KITANO MAKOTO , YONEDA NAE , EGUCHI SHUJI , NISHI KUNIHIKO
IPC分类号： H01L21/50 , H01L21/56 , H01L21/58 , H01L21/60 , H01L23/04 , H01L23/31
摘要： A SEMICONDUCTOR PLASTIC PACKAGE, MORE PARTICULARLY A PREFERRED PACKAGE STRUCTURE AND METHOD FOR MAKING A BGA PACKAGE. A RESIN SEALED BGA PACKAGE WHERE A SUPPORTING FRAME (5,27,28,34,36) WHICH FIXEDLY SUPPORTS SEMICONDUCTOR PARTS; I.E., AN IC CHIP (1), A CIRCUIT BOARD (2), OR A CIRCUIT FILM (31,38), IS SEALED WITH RESIN, USING A MOLD (16,40-43,46-53) WHICH IS COMPOSED OF AN UPPER MOLD HALF (20) AND A LOWER MOLD HALF (21) WITH THE LOWER MOLD HALF HAVING A PLURALITY OF PROJECTIONS, ONE AT A POSITION CORRESPONDING TO EACH OF THE EXTERNAL TERMINALS. THE MOLD HAS A DIVISIONAL STRUCTURE WHICH HAS AN AIR VENT BETWEEN THE DIVISIONAL ELEMENTS THEREOF. (FIG. 36A & 36B)

3. 发明专利

JP2003142531A METHOD OF MOUNTING SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：JP2003142531A
公开(公告)日：2003-05-16
申请号：JP2002300143
申请日：2002-10-15
申请人： HITACHI LTD
发明人： SUMIYA AKIRO , ANJO ICHIRO , ARITA JUNICHI , KAWAI SUEO , TSUBOSAKI KUNIHIRO , NISHI KUNIHIKO , OTSUKA KENICHI
IPC分类号： H01L23/12 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a technique permitting mounting without improper electrical connection even in the case when the warp of a package is caused, and the visual inspection of the mounting of a ball grid array semiconductor device. SOLUTION: In this mounting method, a ball grid array semiconductor device provided with a plurality of solder bumps on a plane opposite to a plane mounting a semiconductor chip of a substrate is mounted on a mounting substrate, and the central part of the substrate of the ball grid array semiconductor device is warped in such a manner as to project in the direction of the plane opposite to the plane mounting the semiconductor chip at the time of the reflow of solder, so as to electrically connect the electrode on the mounting substrate with the solder bumps.

4. 发明专利

JP2001168239A BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS PACKAGING METHOD 失效
公开(公告)号：JP2001168239A
公开(公告)日：2001-06-22
申请号：JP2000386583
申请日：2000-12-20
申请人： HITACHI LTD
发明人： SUMIYA AKIRO , ANJO ICHIRO , ARITA JUNICHI , KAWAI SUEO , TSUBOSAKI KUNIHIRO , NISHI KUNIHIKO , OTSUKA KENICHI
IPC分类号： H01L23/12 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a BGA semiconductor device which is free from any electrical connection failure even if a package is warped, and to provide a packaging substrate for the BGA semiconductor device and its packaging method. SOLUTION: In the BGA semiconductor device, a semiconductor chip 3 is mounted on a substrate 1 with circuit wiring, the electrode of the semiconductor chip 3 is electrically connected to the circuit wiring, at least the semiconductor chip and the electrical connection part are sealed by region 5, and a plurality of solder bumps 8 are provided on a surface opposite to the surface where the semiconductor chip of the substrate 1 is mounted. The central part of the substrate is warped in projection shape in the direction of a face 6 at the opposite side of a face 2 where the semiconductor chip 3 is mounted.

5. 发明专利

JPH10194376A TRAY WITH CARRIER AND PROTECTIVE SHEET, AND TRAY 失效
公开(公告)号：JPH10194376A
公开(公告)日：1998-07-28
申请号：JP256097
申请日：1997-01-10
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： EMATA KOJI , TSUBOI KAZUYA , NUMAZAKI MASAHITO , OKINAGA TAKAYUKI , OTSUKA KENICHI , ENOMOTO USUKE
IPC分类号： B65D85/86 , H01L21/673 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To improve workability of assembly and to prevent breakage and staining from occurring by providing a sheet-like tray with a recessed storing cavities, a freely removable fixing tool to be laminated and integrally fixed, and providing positional slip preventing parts on the tray. SOLUTION: Positional slip preventing parts 20 prevent positional slip of a protective sheet 6 from occurring and are provided on the corners of a rectangular fitting part 11 on the top face of which a plurality of storing cavities 7 are provided so as to be projected. In addition, they guide the corners of the rectangular protective sheet 6 and are L-shaped guide pieces 21 opened by 90 degrees. The stop movement of the protective sheet 6 placed on the top face of a tray along the top face of the tray, the height of the guide pieces 21 is a dimension the same as or larger than the thickness of the protective sheet 6. A fitting cavity is provided on the underside of the tray 2. The tray 2 is laminated in the fitting cavity and the fitting cavity 11 of the lower side tray 2 is fitted therein. As escape cavities in which the top end parts of the guide pieces 21 enter are provided on the bottom, there exists no possibility of direct contact with the upper tray 2.

6. 发明专利

JPH07193162A BALL-GRID ARRAY SEMICONDUCTOR DEVICE AND MOUNTING SUBSTRATE THEREOF 失效
公开(公告)号：JPH07193162A
公开(公告)日：1995-07-28
申请号：JP33064193
申请日：1993-12-27
申请人： HITACHI LTD
发明人： SUMIYA AKIRO , ANJO ICHIRO , ARITA JUNICHI , KAWAI SUEO , TSUBOSAKI KUNIHIRO , NISHI KUNIHIKO , OTSUKA KENICHI
IPC分类号： H01L23/12 , H01L23/50
摘要： PURPOSE:To provide a BGA semiconductor device, which does not have defective electric connections even if a package is warped, a mounting substrate for the BGA semiconductor device and the mounting method thereof. CONSTITUTION:A semiconductor chip 3 is mounted on a substrate 1 having the circuit wiring. The electrodes of the semiconductor chip 3 and the circuit wirings are electrically connected. At least the semiconductor chip and the electric connecting part are sealed with resin 5. A plurality of solder bumps 8 are provided at the face on the opposite side of the face of the substrate 1, on which the semiconductor chip 3 is mounted. In this BGA semiconductor device, the central part of the substrate l is warped in the direction of the face 6 on the opposite side with respect to the face 2, on which the semiconductor chip 3 is mounted, in the protruding shape.

7. 发明专利

JPH053281A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH053281A
公开(公告)日：1993-01-08
申请号：JP15296391
申请日：1991-06-25
申请人： HITACHI LTD , HITACHI MICOM SYST KK
发明人： OTSUKA KENICHI , TERADA KAZUHIRO , KIMOTO RYOSUKE , KAMEOKA AKIHIKO
IPC分类号： H01L23/50
摘要： PURPOSE:To improve accuracy of a semiconductor device and to improve package density thereof. CONSTITUTION:In a semiconductor device 1 having a plurality of leads 2, a supporting frame 4 commonly connected to a plurality of leads 2 is connected to the lead 2 through a connecting material 3. Since strength of the lead 2 is reinforced by the supporting frame 4, deformation of the lead 2 is reduced. Since strength of the lead 2 is ensured by the supporting frame 4 even if the lead 2 is thinned, it is possible to arrange a number of pins at a small pitch.

8. 发明专利

JPS61217298A INTEGRATED CIRCUIT CARD 失效
公开(公告)号：JPS61217298A
公开(公告)日：1986-09-26
申请号：JP5841385
申请日：1985-03-25
申请人： HITACHI MICROCUMPUTER ENG , HITACHI LTD
发明人： ICHIHARA SEIICHI , KAWANOBE TORU , OTSUKA KENICHI , MIYAMOTO KEIJI
IPC分类号： H01L23/28 , B42D15/02 , B42D15/10

9. 发明专利

JPS61178877A HOUSING TOOL FOR ELECTRONIC PART 失效
公开(公告)号：JPS61178877A
公开(公告)日：1986-08-11
申请号：JP905285
申请日：1985-01-23
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG
发明人： OTSUKA KENICHI , KAWANOBE TORU , KIMOTO RYOSUKE
IPC分类号： H01L21/673 , B65D85/00 , B65D85/38 , B65D85/86 , H01L21/67 , H01L21/68

10. 发明专利

JPS6173354A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：JPS6173354A
公开(公告)日：1986-04-15
申请号：JP19463984
申请日：1984-09-19
申请人： Hitachi Ltd
发明人： OTSUKA KENICHI , KAWANOBE TORU , SATO HAJIME , TANAKA HIDEKI
IPC分类号： H01L23/50 , H01L23/495
CPC分类号： H01L23/49582 , H01L23/49555 , H01L2224/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： PURPOSE:To reinforce a bending section around the side end of a package simultaneously besides an improvement in the solderability of an external lead section and the protection of the surface by coating the external lead section with a metal having excellent solderability so that the bending section is thickened. CONSTITUTION:Wires 4 electrically connecting a pellet 2 and the internal end sections of leads 3 and internal lead sections 3a are sealed with a resin 5, thus forming a package. External lead sections 3b are bent largely to the insides, and the whole surfaces of the lead sections 3b are coated with solders 7. The lead sections 3b are coated with solders 7 so that bending sections are thickened at that time, thus attaining not only an improvement in solderability but also the reinforcement of the lead sections 3b.
摘要翻译：目的：为了加强包装侧面的弯曲部，同时除了外部引线部的可焊接性的提高以及通过用优异的可焊性的金属涂覆外部引线部来保护表面，使得弯曲部为增厚构成：将电池2与电线3的内部端部和内部引线部3a电连接的电线4用树脂5密封，形成封装。外部引线部分3b大量弯曲到内部，引线部分3b的整个表面涂覆有焊料7.引线部分3b涂覆有焊料7，使得弯曲部分在此时变厚，从而不仅获得可焊性的提高，而且引线部分3b的加强。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式