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1. 发明专利

JPH09148521A LEAD FRAME, SEMICONDUCTOR INTEGRATED CIRCUIT USING THE FRAME AND WIRE BONDING 失效
公开(公告)号：JPH09148521A
公开(公告)日：1997-06-06
申请号：JP30895795
申请日：1995-11-28
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： KOMATA MAKOTO , OKINAGA TAKAYUKI , EMATA KOJI , HORIUCHI HITOSHI , HONDA ATSUSHI
IPC分类号： H01L21/60 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To prevent leads oscillation during wire bonding by an oscillation preventing member with a belt shape having insulating and hard characteristics being made to adhere to a lower surface of bonding part of inner leads by means of junctioning neighbor leads with each other. SOLUTION: A belt shape tape (an oscillation preventing member) having insulating and hard characteristics and preventing oscillation of leads 6 caused by a capillary operation during inner leads 6b bonding is made to be so bonded that the neighbor leads 6 are junctioned with each other. This means the tape 11 is cut into a necessary size and made to adhere to a lower surface of a bonding part 10 after a lead frame 1 is made to a predetermined form. Here a recess part 12a for preventing deformation of the leads 6 to which the tape 6 is bonded is formed in a heat block 12 of a wire bonding device which makes wire bonding of the lead frame 11 and is junctioned with the tape 11.

2. 发明专利

JPH08181238A RESIN-SEALED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH08181238A
公开(公告)日：1996-07-12
申请号：JP32425294
申请日：1994-12-27
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： SATO KEIICHI , HONDA ATSUSHI , NOSE FUJIAKI , HORIUCHI HITOSHI , EMATA KOJI
IPC分类号： H01L23/04 , H01L23/06 , H01L23/50
摘要： PURPOSE: To improve reliability by preventing the generation of residual stress in a package when a substrate for grounding is fixed onto a lead frame and sealed with resin and the package is formed. CONSTITUTION: An insulating material having a thermal expansion coefficient approximating to the thermal expansion coefficient of a package 10 made of resin and flexibility is used as a substrate 5 for grounding, and the substrate 5 is composed of an insulating board 13 consisting of the same epoxy resin as the material of the package 10 and a conductive layer 14 made of a conductive material such as Al formed on the surface of the insulating board 13 through an evaporation method, etc. Since the epoxy resin (under the state, in which fillers are mixed) constituting the package 10 has the thermal expansion coefficient of approximately 10×1/10 / deg.C, the substrate 5 for grounding has approximately the same thermal expansion coefficient as the value.

3. 发明专利

JPH07256688A RESIN MOLD ASSEMBLY 失效
公开(公告)号：JPH07256688A
公开(公告)日：1995-10-09
申请号：JP4762394
申请日：1994-03-18
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： HORIUCHI HITOSHI , OKINAGA TAKAYUKI , HONDA ATSUSHI , HOZOJI HIROYUKI , TABATA KATSUHIRO , TAKATSU KENJI , EMATA KOJI
IPC分类号： B29C45/26 , B29C45/02 , B29L31/34 , H01L21/56
摘要： PURPOSE:To stabilize the charging of molding resin and infallibly mold resin molded package. CONSTITUTION:Pots 4 and cavities 2, every predetermined number of which communicate with one another by communicating holes 4a, communicate with one another through runners 5, which are engraved so as to realize the same distance and shape as one another. To each cavity 2, a flow cavity, through which excess resin material flows out of the cavity 2, is provided. The flow cavities 2a communicate with one another. Thus, the pressures in the cavities are uniformized so as to mold resin molded packages.

4. 发明专利

JPH07106364A SEMICONDUCTOR DEVICE, AND METHOD AND DEVICE FOR WIRE BONDING 失效
公开(公告)号：JPH07106364A
公开(公告)日：1995-04-21
申请号：JP24421793
申请日：1993-09-30
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： SASAKI MASAKO , OKINAGA TAKAYUKI , EMATA KOJI , HORIUCHI HITOSHI , HONDA ATSUSHI
IPC分类号： H01L21/60 , H01L23/50
摘要： PURPOSE:To make it possible to perform reliably the wire bonding of a semiconductor chip in a tabless lead frame by a method wherein second wires, which connect mechanically the dummy electrode parts of the chip with second leads which are dummy electrodes, are provided for fixing the chip. CONSTITUTION:A semiconductor device, which consists of a tabless lead frame 2, has first wires 3 for connecting electrically electrode parts 1a of a semiconductor chip 1 with terminals of first leads 2a for connecting electrically with external terminals. Moreover, the device is constituted in such a way as to have second wires 4, which connect mechanically dummy electrode parts 1b of the chip 1 with second leads 2b which are dummy terminals, for fixing the chip 1. For example, the dummy electrode parts 1b formed at the corner parts of the chip 1 and the end parts, which are formed in the vicinities of the dummy electrode parts 1b, of the dummy leads 2b are mechanically connected with each other by the wires 4 having a rigidity higher than that of the wires 3.

5. 发明专利

JPH0738051A RESIN MOLD ELECTRIC DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JPH0738051A
公开(公告)日：1995-02-07
申请号：JP17776493
申请日：1993-07-19
申请人： HITACHI LTD , HITACHI HOKKAI SEMICONDUCTOR , HITACHI MICOM SYST KK , HITACHI VLSI ENG
发明人： NAITO TAKAHIRO , TANAKA SHIGEKI , SUZUKI HIROMICHI , OKINAGA TAKAYUKI , EMATA KOJI , HORIUCHI HITOSHI , KOMATA MAKOTO , YAMADA MASARU
IPC分类号： H01L23/28 , H01L23/48 , H01L23/50
摘要： PURPOSE:To provide a resin mold type of electronic device which can prevent the break of a lead after formation of the lead or the transformation of the lead by the shock at the time of taking in and out or transportation of a testing socket, concerning a resin mold type of electronic device, especially, in a resin mold type of semiconductor device for mounting on a surface. CONSTITUTION:The prevention of transformation of leads and the simplification of the process can be accomplished by charging resin 3 as far as the area between the leads 2 led out of the package body 1 by public transfer mold method, using a lead frame, which does not have dam bars between outer leads, for the assembling of a resin mold type of semiconductor device for mounting on a surface, and making the resin 3 between the leads 2 in the thickness approximately equal to the thickness of the lead 2. Moreover, the improvement of the close adhesion between the leads 2 and the resin 3 between them can be accomplished by fixing the heads of the leads together with the resin 3 with a ring-shaped resin frame.

6. 发明专利

JPH06350003A LEAD FRAME AND SEMICONDUCTOR INTEGRATED CIRCUIT USING LEAD FRAME 失效
公开(公告)号：JPH06350003A
公开(公告)日：1994-12-22
申请号：JP14102993
申请日：1993-06-14
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： EMATA KOJI , OKINAGA TAKAYUKI , HAYASHIDA TETSUYA , SHIRAI MASAYUKI , HONDA ATSUSHI , KOMATA MAKOTO
IPC分类号： H01L23/50
摘要： PURPOSE:To provide a QFP-type lead frame, which is hard to be deformed when a lead is molded. CONSTITUTION:A lead width A1 of a shoulder part 2a2 of an outer lead 2a in a QFP-(Quad Flat Package) type lead frame is made wider than a lead width A2 of a base part 2a3. Thus, the sufficient rigidity is imparted to the shoulder part 2a2 of the outer lead. Therefore, even if mechanical stress is applied in molding, the lead is hard to be deformed.

7. 发明专利

JPH06236952A MANUFACTURE OF SEALED SEMICONDUCTOR DEVICE, AND SEALED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH06236952A
公开(公告)日：1994-08-23
申请号：JP31302793
申请日：1993-12-14
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： MATSUNAGA TOSHIHIRO , SHIRAI MASAYUKI , OKINAGA TAKAYUKI , HORIUCHI HITOSHI , EMATA KOJI , KOMATA MAKOTO
IPC分类号： H01L21/56 , H01L23/28 , H01L23/50
摘要： PURPOSE:To eliminate the removal of resin burrs by forming a lead frame provided with a plurality of long leads and forming a blocking bank by aligning a strip-shaped member on the mold line of the lead frame and adhering the member almost vertical to the lengthwise direction of the lead. CONSTITUTION:For a lead frame 1, a strip-shaped member 9 is adhered at a clamping position of a lead 6 to be clamped by the mold die of a mold device permitting the adjacent lead 6 to be alternately connected. Namely, the strip- shaped member 9 is aligned so as to permit the edge closer to the first edge of an inner lead 6a to be on the mold line ML or on the inner side of the line, and is adhered almost vertical to the lengthwise direction of the lead 6 on the lead 6 so as to form a blocking bank. Since an adhesive layer 9b is inserted between the leads 6, resin 7 injected during a mold process is prevented from leaking from the mold die 8.

8. 发明专利

JPH0338865A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0338865A
公开(公告)日：1991-02-19
申请号：JP17509589
申请日：1989-07-06
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： MATSUGAMI SHOJI , OTSUKA KANJI , SHIRAI MASAYUKI , OKINAGA TAKAYUKI , EMATA KOJI
IPC分类号： H01L21/60 , H01L23/28
摘要： PURPOSE:To reduce a capacity between wirings of a package, to prevent malfunction and to prevent a board from cracking by inhibiting formation of a solder resist film inside from a dam. CONSTITUTION:A solder resist film 3 is not formed inside from a dam 4, i.e., wirings in the dam 4 are connected directly to a silicon gel 7 having lower specific permittivity than that of solder resist. The innermost end of the film 3 is disposed under the dam 4, and secured with the dam 4. Accordingly, wirings disposed in high density in the dam 4 are connected directly to the gel 7 having lower specific permittivity than that of the film 3. Thus, a capacity between the wirings of the package is reduced to prevent a crosstalk, thereby preventing a malfunction.

9. 发明专利

JPS62249458A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS62249458A
公开(公告)日：1987-10-30
申请号：JP9217586
申请日：1986-04-23
申请人： HITACHI VLSI ENG , HITACHI LTD
发明人： EMATA KOJI , TATE HIROSHI , OKINAGA TAKAYUKI , SHIRAI MASAYUKI , OTSUKA KANJI
IPC分类号： H01L23/02 , H01L23/04 , H01L23/10 , H01L23/24
摘要： PURPOSE:To eliminate necessity of attaching a separate spacer and improve moisture resistant properties by a method wherein a cap is unified with a dam and two supports which support the cap are stood on the back surface of the cap and the space between the supports is filled with sealing material and, further, the end of the cap is protruded from the bottom surface of a base. CONSTITUTION:A cap 5 is put on supports 8 and 9. The cap 5 is composed of a ceiling 11, an extension 12 perpendicular to the ceiling 11 and a spacer 13 extended further from the extension 12. The inside of the support 8 is sealed with silicone system gel 6 and further the space between the two supports 8 and 9 is filled with silicone system gel 6. The spacer 13 is protruded from the back surface of a base 1 with a proper length. Thus, by providing the spacer 13 on the cap 5 itself, a separate process in which a spacer is attached to an external connecting pin 2 can be eliminated. Further, by filling the space between the support 8 and the support 9 with the gel 6, even if harmful substance such as moisture penetrates between the cap 5 and the base 1, the moisture resistant properties can be maintained and, by such double-sealing, the moisture resistant properties can be further improved.

10. 发明专利

JPH08288437A HEAT RADIATING FIN, SEMICONDUCTOR DEVICE USING IT, AND SEMICONDUCTOR DEVICE MOUNTING STRUCTURE 失效
公开(公告)号：JPH08288437A
公开(公告)日：1996-11-01
申请号：JP11516595
申请日：1995-04-17
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： KOMATA MAKOTO , EMATA KOJI , OKINAGA TAKAYUKI , TATE HIROSHI , HORIUCHI HITOSHI , SASAKI MASAKO , HONDA ATSUSHI
IPC分类号： H01L23/40
摘要： PURPOSE: To surely prevent a heat radiating fin from coming off a semiconductor device by mechanically fixing the fin to the device with a plurality of retaining claws protruded from the outer periphery of the fin. CONSTITUTION: The main body 11 of a heat radiating fin 10 is brought into contact with the upper surface of a resin body 3 sealing a QFP and IC1 with the fin section 12 of the fin 10 upward. When the main body 11 is brought into contact with the upper surface of the body 3, the tour retaining claws 16 of the fin 10 are pressed down while the claws 16 are respectively aligned with the four corners of the body 3. Therefore, the claws 16 are respectively locked to the edge of the body 3 at the four corners on the rear surface side. Since the fin 10 is mechanically fixed to the QFP and IC1 with the tour claws 16 in such a way, the fin 10 is surely fixed to the QFP and IC1 without receiving any influence from the mold release agent of the body 3. Therefore, the QFP and IC1 can surely maintain their heat radiating abilities.

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