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1. 发明专利

JPH08316301A HOUSING VESSEL 失效
公开(公告)号：JPH08316301A
公开(公告)日：1996-11-29
申请号：JP14123795
申请日：1995-05-16
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： NUMAZAKI MASAHITO , TSUBOI KAZUYA , ENOMOTO USUKE
IPC分类号： B65D85/86 , H01L21/673 , H01L21/68
摘要： PURPOSE: To prevent housing failure by forming each clearance part at each corner part of a housing recessed part so that clearance spaces where corner parts of a sealing body in a housed package of a semiconductor device are allowed to open is installed. CONSTITUTION: On the top of a body 11, multiple housing recessed parts 12 formed into a square hole shape are formed by injection in the same form aligned in vertical and horizontal directions. A clearance part 14 is formed at each corner part of the housing recessed part 12, and the each clearance part 14 provides a clearance space 15 where a corner part 5 of a sealing body 4 in a housed package 2 of a semiconductor device is allowed to open. So that, when housed in the housing recessed part 12, each corner part 5 of the sealing body 4 of the semiconductor device is in the state positioned in the clearance space 15 of the housing recessed part 12. Thus each corner part 5 of the sealing body 4 is prevented from being left engaged with each corner part of the housing recessed part 12. So that occurring of a state where housing is prevented is avoided beforehand.

2. 发明专利

JPH09156682A TRANSPORTATION TAPE AND TRANSPORTATION METHOD OF ELECTRONIC COMPONENT BY USE THEREOF 失效
公开(公告)号：JPH09156682A
公开(公告)日：1997-06-17
申请号：JP31869695
申请日：1995-12-07
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： TSUBOI KAZUYA , NUMAZAKI MASAHITO , SUZUKI MASAKATSU
IPC分类号： B65D85/86 , H01L21/673 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To prevent delamination defects of a cover tape stuck on the surface of a transportation tape containing electronic parts like LSI packages. SOLUTION: This transportation tape is provided with a belt-form delamination tape 7 stretching along both longitudinal ends of a cover tape 5. This delamination tape 7 has nearly the same film thickness with the cover tape 5 and a higher strength plastic film than the cover tape 5 or it is constituted of the same material quality with the cover tape and thicker plastic films. And the tape is stuck on the rear face of the cover tape 5 with an adhesive layer.

3. 发明专利

JPH08324679A CONTAINER AND SEMICONDUCTOR DEVICE WITH HEAT-SINK 失效
公开(公告)号：JPH08324679A
公开(公告)日：1996-12-10
申请号：JP16144395
申请日：1995-06-05
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： NUMAZAKI MASAHITO , SAITO KUNIHIKO
IPC分类号： B65D85/86 , H01L21/673 , H01L21/68 , H01L23/04
摘要： PURPOSE: To make it possible to contain all PGA.ICs (pin grid array integrated semiconductor circuit device) with heat-sink having different heights if the containing recess is made deep since the sealed body is pushed down by a positioning protrusion. CONSTITUTION: A support part 13 on which a sealed body 4 of a PGA.IC 1 with heat-sink is placed, is protruded on the bottom face of the containing recess 12 made on the upper face of the body 11 of a container 10 for PGA.IC with heat-sink. And positioning protrusions 14 are arranged downward to correspond with respective corners of the containing recess 12 at the lower face of the body 11. On the other hand, beveled parts 8 are formed at the corners of the heat-sink body 6 of the PGA.IC with heat-sink. When the container 10 is stacked on the same container with contents, the corner parts of the sealed body 4 of PGA.IC with heat-sink contained in the lower stage container are pushed by the positioning protrusions 14 of the upper container.

4. 发明专利

JPH0837265A MANUFACTURE OF RESIN-SEALED TYPE SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0837265A
公开(公告)日：1996-02-06
申请号：JP17385894
申请日：1994-07-26
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： TSUBOI KAZUYA , NUMAZAKI MASAHITO
IPC分类号： H01L23/28 , H01L21/56 , H01L23/50
摘要： PURPOSE:To unnecessitate a dam bar, and to prevent generation of cutting scraps and whiskers by a method wherein solder is adhered between the leads provided on the circumference of a die pad part where a semiconductor chip is mounted, each lead is fixed, and the solder is removed from between the leads by heating. CONSTITUTION:A die pad part 2 is provided on the center part of a lead frame 1, the die pad part 2 is hung down by a die pad hanging lead 3, the hanging lead 3 is connected to the frame part 4 of the outer frame, and a plurality of leads 5 are arranged on the area from the frame part 4 to the internal part. After solder 6 has been attached between the lead 5 and the lead 5, a die 7 is mounted on the die pad part 2, the electrode of the die and the inner lead part of the lead 5 of the lead frame 1 are wire-bonded by a bonding wire 8, and resin sealing is conducted inside the solder 6. Then, the lead 5 is locally heated, the solder 6 is removed by dropping from between the lead 5 and the lead 5.

5. 发明专利

JPH0817856A RESIN MOLDING METHOD OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0817856A
公开(公告)日：1996-01-19
申请号：JP14774894
申请日：1994-06-29
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： NUMAZAKI MASAHITO , WADA TAMAKI , TSUBOI KAZUYA
IPC分类号： B29C45/26 , B29C45/02 , B29C45/14 , B29L31/34 , H01L21/56
摘要： PURPOSE:To prevent resin from flowing out without providing a tie bar to a lead frame by a method wherein resin is injected between all leads except four corners. CONSTITUTION:A semiconductor device is sealed in with resin through a resin molding method that resin is injected through a gate into a molding die where a lead frame mounted with a semiconductor chip is set, wherein resin is injected between all leads 1 except four corners. For instance, a gate which branches out into four parts for injecting resin between all the leads 1, a resin filling spot, and an air vent for removing air from a molding die when resin is injected are provided to a molding die. Resin is injected in first through a gate out of four gates located furthest from the air vent by a control device to move air inside the molding die toward the air vent to remove air through the air vent. Then, after a certain span of time elapses, resin is injected through the other gates to fill a resin filling spot for molding so as not to protrude between the leads 1.

6. 发明专利

JPH07135288A SEMICONDUCTOR DEVICE AND LEAD FRAME 失效
公开(公告)号：JPH07135288A
公开(公告)日：1995-05-23
申请号：JP27993493
申请日：1993-11-09
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： TSUBOI KAZUYA , NUMAZAKI MASAHITO
IPC分类号： H01L23/50 , H05K3/34
摘要： PURPOSE:To make a package extremely thin by making the leads at their outer end sections thicker than that at their inner end section and protruding the side faces of the outer end sections toward desired mounting object surfaces from the external side face of the package. CONSTITUTION:The thickness t1 of leads 2 at their outer end sections 2b protruded from a package 1 are made larger than those t2 at their inner end sections 2a. By utilizing the thickness difference between the outer end sections 2b and inner end sections 2a of the leads 2, the package 1 is formed so that the external side faces 2c of the outer end sections 2b of the leads 2 can protrude from the external side faces 1a of the package 1 against mounting object surfaces 100. Therefore, the package 1 can be made extremely thin without performing any bending work, etc., by only cutting the leads 2 and surface mounting can be realized by using the external side faces 2c of the outer end sections 2b of the leads 2.

7. 发明专利

JPH08310587A HOUSING CONTAINER AND TAKE-OUT JIG 失效
公开(公告)号：JPH08310587A
公开(公告)日：1996-11-26
申请号：JP14123895
申请日：1995-05-16
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： TSUBOI KAZUYA , NUMAZAKI MASAHITO , WADA TAMAKI , ENOMOTO USUKE
IPC分类号： B65D85/86
摘要： PURPOSE: To provide a housing container wherein a semiconductor device can be safely put in and taken out. CONSTITUTION: On a lower face of a body 11 of a housing container 10 for QFP.ICs wherein a plurality of identical pieces are prepared and used while being vertically overlaid, a set of four positioning protrusions 16 for regulating lateral movement closely to each side of a resin molded body 4 of the QFP.IC 1 received in a housing recess 12 of the container 10 in a lower stage are made to protrude downward, while an attack angle face 17 inclined wider downward is formed on an inner side of each positioning protrusion 16. A through hole 14 having a size for exhibiting each corner 5 of the resin molded body 4 supported by a support 13 is opened on each corner of the housing recess 12. Therefore, when a subsequent container is stacked on the container already containing the QFP.IC, a QFP.IC received in the housing recess in the lower stage may be prevented from loosely moving up/down, front/back and right/left by cooperation of upper and lower containers, thereby preventing an outer lead from bending due to loose movement.

8. 发明专利

JPH09148424A CARRIAGE TRAY, AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE CARRIED BY IT 失效
公开(公告)号：JPH09148424A
公开(公告)日：1997-06-06
申请号：JP30536695
申请日：1995-11-24
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： TSUBOI KAZUYA , NUMAZAKI MASAHITO , ENOMOTO USUKE
IPC分类号： B65D85/86 , H01L21/673 , H01L21/68 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To prevent bump electrode trouble from occurring by providing a salient electrode for supporting a package by a point, in the specified position of a package storage region. SOLUTION: On the main face of a carriage tray, the package storage regions 1a1 quadrangular in plan view stand in line regularly in matrix form, and these are made by the indents formed on the main face of the carriage tray 1a1 . That is, semiconductor integrated circuit devices can be carried in condition that they are accommodated in individual storage regions 1a1 . What is more, this is arranged so that they can be carried in condition that plural sheets of carry trays lie on top of on another at the time of carriage. Projections 1a2 quadrangular in plan view are made in the vicinities of the four corners of the bottom in this package storage region 1a1 . This projection 1a2 is a member for supporting it in floating condition so that the bump electrode 2a may not contact with the bottom of the package storage region 1a1 , in the case of storing it so that the face where the bump electrode 2a is made may oppose the bottom of the package storage region 1a1 . Therefore, this prevents the bump electrode from contacting with the carriage tray during carriage.

9. 发明专利

JPH0717592A TRAY FOR TRANSPORTATION OF DEVICE 失效
公开(公告)号：JPH0717592A
公开(公告)日：1995-01-20
申请号：JP14468593
申请日：1993-06-16
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： KITAMURA WAHEI , NUMAZAKI MASAHITO
IPC分类号： B65D85/00 , B65D85/86 , H01L21/673 , H01L21/68
摘要： PURPOSE:To provide a tray for transportation of integrated circuits, which prevents lead wires of circuits from shifting or deforming during appearance inspections. CONSTITUTION:A pocket 3 for containing a semiconductor IC device 2 is provided at the front face 1a side of a tray 1. Holes 4 for tweezers from which the semiconductor IC device 2 is taken out with tweezers or the like are molded integrally with the pocket 3 at respective four sides of pocket 3. The holes 4 for tweezers are formed by protrusions projecting from the front surfaces 1a side of transferable tray 1 to the rear face thereof and the semiconductor IC device on the rear face of transferable tray 1 is restricted its moving by the protrusion.

10. 发明专利

JPH05330584A SEMICONDUCTOR DEVICE TRAY 失效
公开(公告)号：JPH05330584A
公开(公告)日：1993-12-14
申请号：JP12898792
申请日：1992-05-21
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： WADA TAMAKI , NUMAZAKI MASAHITO , KITAMURA WAHEI
IPC分类号： B65D85/00 , B65D85/38 , B65D85/86 , H01L21/673 , H01L21/68
摘要： PURPOSE:To comply with flexible production, moreover to reduce the design, manufacturing and management costs by providing steps on side walls of package containing portions, for enabling multi-stacking of a plurality of packages different in shape and size, in a tray for conveying and shipping LSI packages. CONSTITUTION:A semiconductor device tray 1 is formed by a synthetic resin molding body, and a plurality of package containing portions 3 are provided thereon. Then, step portions 4 formed into a step shape are formed on the side walls of the package containing portions 3. Moreover, LSI packages 2 different in length are contained in the package containing portions 3 so as to be overlapped without contacting to each other. By this construction, plural kinds of the LSI packages 2 can be contained in one tray, so that the kinds of trays can be decreased.

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