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1. 发明专利

JPS6151952A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：JPS6151952A
公开(公告)日：1986-03-14
申请号：JP17331184
申请日：1984-08-22
申请人： Akita Denshi Kk , Hitachi Ltd , Hitachi Micro Comput Eng Ltd
发明人： MIYAMOTO KEIJI , KAWANOBE TORU , ICHIHARA SEIICHI , KIMOTO RYOSUKE , ISHIKAWA KAZUYA
IPC分类号： H05K1/18 , H01L23/495 , H01L23/50 , H05K3/34
CPC分类号： H01L23/49555 , H01L2924/0002 , H05K3/3421 , H01L2924/00
摘要： PURPOSE:To enhance the reliability of a connection part by sure connection with solder by a method wherein a projection or a hole is formed to an outer lead at the part of abutment against an electrode provided on the substrate. CONSTITUTION:The outer leads 3 and 13 of a semiconductor device 1 connected to the mounting substrate 6 at the bent part of the outer leads 3 and 13 are provided with the projection 18 or hole 8 at the part of abutment against an electrode 7 of the mounting substrate 6. For example, in the case of forming the hole 8 at the position where the lead 3 comes to abutment against the electrode 7, mounting to the substrate 6 is carried out by first swelling a solder 5a at the part of the electrode 7 of the substrate 6, and then bringing each lead 3 of the semiconductor device 1 into abutment against this part. At this time, the solder 5a partly penetrates through the hole 8 to the inside of the lead and spreads along the inside surface of the lead 3. Therefore, solidification on cooling enables the sure connection of leads 3 to electrodes 7 because the solder 5a holds the lead 3 from its inside and outside via hole 8.
摘要翻译：目的：通过确保与焊料的连接来提高连接部件的可靠性，其方法是在与设置在基板上的电极抵接的部分处将凸起或孔形成到外部引线上。构成：在外引线3和13的弯曲部处连接到安装基板6的半导体器件1的外引线3和13在与电极7的电极7抵接的部分处设置有突起18或孔8 例如，在将引线3与电极7抵接的位置形成孔8的情况下，通过首先在电极的一部分上溶解焊料5a来进行对基板6的安装 7，然后使半导体器件1的每个引线3与该部分抵接。此时，焊料5a部分地穿过孔8到引线的内部并沿引线3的内表面扩散。因此，冷却时的固化使得能够确保将引线3连接到电极7，因为焊料5a保持引线3从其内部和外部通孔8。

2. 发明专利

JPS6174358A Manufacture of resin-sealed semiconductor device 失效
标题翻译：树脂密封半导体器件的制造
公开(公告)号：JPS6174358A
公开(公告)日：1986-04-16
申请号：JP19471784
申请日：1984-09-19
申请人： Akita Denshi Kk , Hitachi Ltd , Hitachi Micro Comput Eng Ltd
发明人： KIMOTO RYOSUKE , KAWANOBE TORU , OTSUKA KENICHI , MIYAMOTO KEIJI , INABA KICHIJI , ICHIHARA SEIICHI , ISHIKAWA KAZUYA
IPC分类号： H01L23/50 , H01L21/48 , H01L21/60 , H01L21/607
CPC分类号： H01L21/4821 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2224/92247 , H01L2924/01078 , H01L2924/181 , H01L2924/00012
摘要： PURPOSE:To prevent a surface treating solution from intruding into the interior of a package and to enable to improve the moisture resistance of a resin-sealed semiconductor device by a method wherein, before the assembly and sealing of the semiconductor device is performed, a surface treatment is performed on a lead frame, which is used for the assembly and sealing. CONSTITUTION:The assembly and sealing of a resin-sealed semiconductor device is performed using a lead frame. In that case, the lead frame is dipped in a fused solder 9 before the assembly and sealing is performed and a surface treatment is performed on the lead frame or a reflowing treatment is performed on the lead frame or a reflowing treatment is performed after a solder plating is performed on the lead frame. According to such a way, the surface treating solution is prevented from intruding into the interior of the package and the moisture resistance of the device is made to improve, and at the same time, the sealing strength is also made to improve.
摘要翻译：目的：为了防止表面处理溶液侵入到封装的内部，并且能够通过以下方法改善树脂密封的半导体器件的耐湿性，其中在半导体器件的组装和密封之前，在用于组装和密封的引线框架上进行处理。构成：树脂密封半导体器件的组装和密封使用引线框执行。在这种情况下，在进行组装和密封之前，引线框架被浸入熔融焊料9中，并且在引线框架上进行表面处理或者在引线框架上进行回流处理，或者在焊料之后进行回流处理在引线框架上进行电镀。按照这样一种方式，能够防止表面处理液侵入到包装体的内部，从而提高装置的耐湿性，同时也提高密封强度。

3. 发明专利

JPS63257256A LEAD FRAME 失效
公开(公告)号：JPS63257256A
公开(公告)日：1988-10-25
申请号：JP9079987
申请日：1987-04-15
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： ISHIKAWA KAZUYA , KAWAJIRI TOSHINORI
IPC分类号： H01L23/50
摘要： PURPOSE:To remove burrs easily without damaging the surface of a lead frame by a method wherein a metal sheet material is stamped out from a face which is opposite to the face where a semiconductor chip is mounted. CONSTITUTION:A metal sheet material 4 is stamped out and a lead frame for a semiconductor device is formed. During this process, the metal sheet material 4 is stamped out from a face which is opposite to the face where a semiconductor chip is mounted. Then, a cross section of the sheet material 4 is shaped in such a way that its width becomes narrow from the upper part to the lower part over the face where the chip is mounted and its opposite face. Accordingly, when resins 17 which have adhered to side faces of the sheet material 4 are to be pushed off by using thrusting blades 19, the blades are not hooked; the resins 17 can be pushed off easily downward. By this setup, it is possible to remove burrs easily without damaging the surface of a lead frame.

4. 发明专利

JPH09172031A MOLDING METHOD AND FRAME FOR THIS METHOD 失效
公开(公告)号：JPH09172031A
公开(公告)日：1997-06-30
申请号：JP33124595
申请日：1995-12-20
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： ISHIKAWA KAZUYA
IPC分类号： H01L21/56
摘要： PROBLEM TO BE SOLVED: To reduce the production cost (resin burr removing cost) of a semiconductor device. SOLUTION: In a molding method of forming a resin sealed body 1 at a part of a frame by the transfer molding, a cover 7 is formed along the edge of the sealed body formed region at one or more faces of the frame and the sealed body 1 is formed in the frame. The cover 7 outside the sealed body 1 is removed. the cover is made of a material easy to be deteriorated and dropped by irradiating with ultraviolet rays. After forming the body 1, an ultraviolet ray is irradiated on the cover and vibrated to remove the cover outside the body 1, together with a resin burr 9 on the cover.

5. 发明专利

JPH08195475A SEMICONDUCTOR MODULE 失效
公开(公告)号：JPH08195475A
公开(公告)日：1996-07-30
申请号：JP611495
申请日：1995-01-19
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： ISHIKAWA KAZUYA
IPC分类号： H01L25/10 , H01L23/50 , H01L25/18
摘要： PURPOSE: To facilitate assembly and reduce the manufacture cost by supporting all semiconductor devices on a module substrate by one sheet of lead frame. CONSTITUTION: This semiconductor module comprises a module substrate 1 and a plurality of semiconductor devices 2 mounted in a row on the main surface of this module substrate 1. Especially, this is of such a constitution that all semiconductor devices 2 on the module substrate 1 are supported by one sheet of lead frame 2. Accordingly, in the manufacture or assembly, positioning the lead frame 3 to the module substrate 1 and mounting each semiconductor substrate 2 will enable all the semiconductor devices 2 to be mounted on the module 1 accurately and easily. Moreover, the manufacture becomes easy, and also the manufacture cost of the semiconductor module becomes possible.

6. 发明专利

JPH05152709A ELECTRONIC DEVICE 失效
公开(公告)号：JPH05152709A
公开(公告)日：1993-06-18
申请号：JP31041791
申请日：1991-11-26
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： ISHIKAWA KAZUYA
IPC分类号： H05K1/18 , H05K3/34 , H05K3/40
摘要： PURPOSE:To improve yield and reliability of an electronic device, by inserting outer leads into recessed parts, and mounting the outer leads on terminals of a board, via solder bonding layers. CONSTITUTION:Recessed parts 4 which are mutually isolated in the arrangement direction of outer leads 11 are formed in the region of a board 1 where a plurality of terminals 3 are arranged. Solder bonding layers 5 are formed in the respective recessed parts 4. The outer lead 11 is inserted into the recessed part 4. The outer lead 11 of a semiconductor device is connected with a terminal 3 of the board 1, via the solder bonding layer 5. In this constitution, a region (protruding region) between the mutually isolated recessed parts 4 functions as a dam, so that the periphery of the solder bonding layer 5 is defined. Thereby generation of short between the solder layers is reduced in a reflow process, so that yield of an electronic device can be improved.

7. 发明专利

JPH07147366A LEAD FRAME AND SEMICONDUCTOR DEVICE USING IT 失效
公开(公告)号：JPH07147366A
公开(公告)日：1995-06-06
申请号：JP29323793
申请日：1993-11-24
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： ISHIKAWA KAZUYA
IPC分类号： H01L23/28 , H01L23/50
摘要： PURPOSE:To surely remove resin flashes from a semiconductor device molded with resin. CONSTITUTION:A resin leaking out from spaces between metallic molds at the time of molding a semiconductor device with a resin forms resin flashes 3 in areas surrounded by a package 1, leads 2a, and dam bars 2b. The flashes 3 are removed by cutting off lead frames 2c for cutting which are composed of parts of the leads 2a and dam bars 2b together with the dam bars 2b during a lead cutting and forming process.

8. 发明专利

JPH04369897A WIRING BOARD 失效
公开(公告)号：JPH04369897A
公开(公告)日：1992-12-22
申请号：JP14705891
申请日：1991-06-19
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： ISHIKAWA KAZUYA
IPC分类号： H05K3/34 , H01F7/02 , H05K3/30
摘要： PURPOSE:To dispense with a process which is carried out at the mounting of a surface-mounting type electronic part on a wiring board to temporarily fix it with adhesive agent. CONSTITUTION:A permanent magnet 4 is installed on the package mounting region A of a wiring board 1. When a surface-mounting type DRAM package provided with outer leads of magnetic substance is mounted on the package mounting region A, the DRAM package is temporarily fixed to the wiring board 1 with a permanent magnet 4.

9. 发明专利

JP2008099376A Stator, its manufacturing method and rotary electric machine 审中-公开
标题翻译：定子，其制造方法和旋转电机
公开(公告)号：JP2008099376A
公开(公告)日：2008-04-24
申请号：JP2006275963
申请日：2006-10-10
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： MITA TORU , ISHIKAWA KAZUYA , HOSHINO KATSUHIRO
IPC分类号： H02K3/52 , H02K3/18 , H02K19/22
摘要： PROBLEM TO BE SOLVED: To facilitate shaping of a segment coil and to facilitate bonding of segment coils by reducing shaping error.
SOLUTION: A turning portion bent into substantially U-shaped, a first straight portion extending substantially linearly from one end of the turning portion, a first separating portion extending from the other end of the turning portion in the direction receding from the first straight portion, a second bend bending substantially in the same direction as the first straight portion at the end of the first separating portion, a second straight portion extending substantially linearly from the second bend substantially in the same direction as the first straight portion, a third bend bending from the second straight portion in the direction receding from the first separating portion, and a second separating portion extending from the third bend in the direction receding from the first straight portion are formed in a segment coil and then the ends of respective segment coils are joined.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了促进段线圈的成形并且通过减小成形误差来促进段线圈的接合。解决方案：弯曲成大致U形的转动部分，从转动部分的一端基本上线性延伸的第一直线部分，从转向部分的另一端延伸的第一分离部分，在第一分离部分的端部处基本上与第一直线部分相同的方向弯曲的第二弯曲部分，基本上沿着与第一直线部分相同的方向从第二弯曲部大致直线地延伸的第二直线部分，从第二直线部分沿着从第一分离部分退出的方向弯曲弯曲;以及第二分离部分，其从第三直线部分沿着从第一直线部分退回的方向延伸，然后形成分段线圈，被加入。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2008099375A Stator and its manufacturing method and rotary electric machine 审中-公开
标题翻译：定子及其制造方法和旋转电机
公开(公告)号：JP2008099375A
公开(公告)日：2008-04-24
申请号：JP2006275961
申请日：2006-10-10
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： MITA TORU , ISHIKAWA KAZUYA , HOSHINO KATSUHIRO
IPC分类号： H02K3/34 , H02K3/487 , H02K15/06 , H02K19/22
摘要： PROBLEM TO BE SOLVED: To insert a stator coil easily into a slot through an insulating paper even if the clearance between the slot and the stator coil is small.
SOLUTION: The insulating paper wound around the stator coil is formed to surround the surface in the slot and divided to overlap at the opening of the slot on the inner circumferential side thereof. The insulating paper is folded at a part facing the circumferential side face of the slot in the opening direction of the divided part, and further folded axially inward to overlap the opposite ends. Consequently, the stator coil can be inserted easily from the wide opening and the divided parts of the insulating paper can be overlapped by simply inserting the stator coil.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：即使槽和定子线圈之间的间隙小，也可以通过绝缘纸将定子线圈容易地插入槽中。解决方案：卷绕在定子线圈上的绝缘纸被形成为围绕槽中的表面，并且在其内周侧上的槽的开口处被分割成重叠。绝缘纸在分割部分的打开方向的面向槽的周向侧面的部分处被折叠，并且进一步沿轴向向内折叠以与相对端重叠。因此，可以容易地从宽开口插入定子线圈，并且通过简单地插入定子线圈，绝缘纸的分割部分可以重叠。版权所有（C）2008，JPO＆INPIT

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