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    • 5. 发明授权
    • Thin film formation apparatus including engagement members for support during thermal expansion
    • 薄膜形成装置包括用于在热膨胀期间支撑的接合构件
    • US07032536B2
    • 2006-04-25
    • US10680213
    • 2003-10-08
    • Yusuke FukuokaYasushi FujiokaKatsushi KishimotoHiroyuki FukudaKatsuhiko Nomoto
    • Yusuke FukuokaYasushi FujiokaKatsushi KishimotoHiroyuki FukudaKatsuhiko Nomoto
    • C23C16/50
    • H01J37/32009C23C16/5096H01J37/32082H01J37/32568H01J37/32724
    • A thin film formation apparatus for forming a thin film on a substrate is provided, which comprises: a reaction chamber; a gas introduction section for introducing a reactant gas into the reaction chamber; an evacuation section for exhausting the reactant gas from the reaction chamber; first and second planar electrodes provided in the reaction chamber; first and second support members which respectively support the first and second electrodes in parallel relation; a high frequency power source for applying high frequency power between the first and second electrodes; and a heating section for heating one of the first and second electrodes; wherein the substrate is placed on the heated electrode, and at least one of the first and second electrodes is supported movably in the direction of thermal expansion by the corresponding support member. With this arrangement, the variation in the spacing between the first electrode (anode electrode) and the second electrode (cathode electrode) can be reduced when the first and second electrodes are heated.
    • 提供一种用于在基板上形成薄膜的薄膜形成装置,其包括:反应室; 用于将反应气体引入反应室的气体导入部, 用于从反应室排出反应气体的排气部; 设置在反应室中的第一和第二平面电极; 第一和第二支撑构件,其分别以平行关系支撑第一和第二电极; 用于在第一和第二电极之间施加高频电力的高频电源; 以及用于加热所述第一和第二电极之一的加热部分; 其中所述基板被放置在所述加热的电极上,并且所述第一和第二电极中的至少一个被所述相应的支撑构件沿热膨胀的方向可移动地支撑。 利用这种布置,当第一和第二电极被加热时,可以减小第一电极(阳极电极)和第二电极(阴极电极)之间的间隔的变化。
    • 10. 发明授权
    • Continuous forming method for functional deposited films
    • 功能沉积膜的连续成型方法
    • US5946587A
    • 1999-08-31
    • US741352
    • 1996-10-29
    • Yasushi FujiokaShotaro OkabeMasahiro KanaiTakehito YoshinoAkira SakaiTadashi Hori
    • Yasushi FujiokaShotaro OkabeMasahiro KanaiTakehito YoshinoAkira SakaiTadashi Hori
    • C23C14/56C23C16/54H01L31/20C23C16/00
    • H01L31/206C23C14/562C23C14/568C23C16/545H01L31/202Y02E10/50Y02P70/521
    • The present invention aims to provide a continuous forming method and apparatus for functional deposited films having excellent characteristics while preventing any mutual mixture of gases between film forming chambers having different pressures, wherein each of semiconductor layers of desired conduction type is deposited on a strip-like substrate within a plurality of film forming chambers, by plasma CVD, while the strip-like substrate is being moved continuously in a longitudinal direction thereof through the plurality of film forming chambers connected via a gas gate having the structure of introducing a scavenging gas into a slit-like separation passage, characterized in that at least one of the gas gates connecting the i-type layer film forming chamber for forming the semiconductor junction and the n- or p-type layer film forming chamber having higher pressure than the i-type layer film forming chamber has the scavenging gas introducing position disposed on the n- or p-type layer film forming chamber side off the center of the separation chamber of the gas gate.
    • 本发明的目的在于提供一种具有优异特性的功能性沉积膜的连续成型方法和装置,同时防止在具有不同压力的成膜室之间的气体之间的任何相互混合,其中期望的导电类型的每个半导体层沉积在带状 通过等离子体CVD在多个成膜室内的基板,同时带状基板沿着其长度方向连续移动通过多个成膜室,该多个成膜室通过具有引入清除气体的结构的气门连接到 狭缝状分离通道,其特征在于,连接形成半导体结的i型层成膜室和n型或p型层成膜室中的至少一个具有比i型 层成膜室具有设置在n型或p型层上的清除气体导入位置 成膜室一侧离开气门分离室的中心。