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1. 发明授权

US06525264B2 Thin-film solar cell module 有权
标题翻译：薄膜太阳能电池模块
公开(公告)号：US06525264B2
公开(公告)日：2003-02-25
申请号：US09901618
申请日：2001-07-11
申请人： Takashi Ouchida , Katsushi Kishimoto , Yasushi Fujioka
发明人： Takashi Ouchida , Katsushi Kishimoto , Yasushi Fujioka
IPC分类号： H01L31024
CPC分类号： H01L31/0468 , H01L31/03767 , H01L31/046 , H01L31/048 , H01L31/186 , H02S40/40 , Y02E10/50 , Y02P70/521
摘要： A thin-film solar cell module of a light transmission type includes a light-transmissive substrate; a front electrode layer; a rear electrode layer, and a photovoltaic conversion layer. The rear electrode layer, front electrode layer, and photovoltaic conversion layer are sequentially laminated on the light-transmissive substrate. A heat retention member covers the rear electrode layer, and a sealing layer is provided for sealing the rear electrode layer. In certain embodiments, the heat retention member has a light absorptance of 40% or more within a near-infrared wavelength range of 1,500 to 2,000 nm.
摘要翻译：透光型薄膜太阳能电池模块包括透光基板; 前电极层; 背面电极层和光电转换层。后电极层，前电极层和光电转换层依次层叠在透光性基板上。保温构件覆盖后电极层，并且设置密封层以密封后电极层。在某些实施方案中，保温构件在1,500-2,000nm的近红外波长范围内具有40％以上的光吸收率。

2. 发明授权

US07195673B2 Plasma CVD apparatus, and method for forming film and method for forming semiconductor device using the same 有权
公开(公告)号：US07195673B2
公开(公告)日：2007-03-27
申请号：US10735621
申请日：2003-12-16
申请人： Akira Shimizu , Yuhsuke Fukuoka , Yasushi Fujioka , Katsushi Kishimoto , Katsuhiko Nomoto
发明人： Akira Shimizu , Yuhsuke Fukuoka , Yasushi Fujioka , Katsushi Kishimoto , Katsuhiko Nomoto
IPC分类号： C23C16/00
CPC分类号： H01J37/32532 , C23C16/4583 , C23C16/5096
摘要： A plasma CVD apparatus comprises an anode electrode and a cathode electrode, and is for forming a thin film on a substrate by performing plasma discharge between the anode electrode and the cathode electrode, comprising: a substrate holder disposed between the anode electrode and the cathode electrode; and one conductive member disposed between the substrate holder and one electrode of either the anode electrode or the cathode electrode, wherein the substrate holder supports the substrate, the one conductive member is provided between the one electrode and the substrate holder so as to substantially cover an entire space between the one electrode and the substrate holder, and the one conductive member is electrically connected to the one electrode and the substrate holder.

3. 发明授权

US07722738B2 Semiconductor device manufacturing unit and semiconductor device manufacturing method 有权
标题翻译：半导体器件制造单元和半导体器件制造方法
公开(公告)号：US07722738B2
公开(公告)日：2010-05-25
申请号：US10704129
申请日：2003-11-10
申请人： Katsushi Kishimoto , Yusuke Fukuoka , Yasushi Fujioka , Hiroyuki Fukuda , Katsuhiko Nomoto
发明人： Katsushi Kishimoto , Yusuke Fukuoka , Yasushi Fujioka , Hiroyuki Fukuda , Katsuhiko Nomoto
IPC分类号： C23F1/00 , H01L21/306 , C23C16/00
CPC分类号： C23C16/5096 , C23C16/24 , H01J37/32568 , H01J2237/2001 , H01L21/67069 , Y10T29/49108
摘要： A semiconductor device manufacturing unit is provided, wherein a cathode and an anode can be placed in a simple structure; wherein excellent film deposition and film thickness distribution can be gained; and wherein no cooling devices are required to be provided.A chamber 11 is formed so that the inside thereof can be controlled at a vacuum of an arbitrary degree. Anode supports 6 for supporting an anode 4 are placed at the bottom of the internal structure 8. The anode 4 is made of a material having a high electrical conductivity and a high heat resistance. The temperature of the anode 4 is controlled by a heater 24 so as to be in a range of from room temperature to 600° C. A cathode 2 is placed on a cathode support 5 so as to face the anode 4. The cathode support 5 is attached to an internal structure 8 made of a frame in a rectangular prism form provided within the chamber 11.
摘要翻译：提供一种半导体器件制造单元，其中可以以简单的结构放置阴极和阳极; 其中可以获得优异的成膜和膜厚分布; 并且其中不需要设置冷却装置。形成室11，使得其内部能够被任意程度的真空度控制。阳极支撑6用于支撑阳极4放置在内部结构8的底部。阳极4由具有高导电性和高耐热性的材料制成。阳极4的温度由加热器24控制在室温至600℃的范围内。阴极2被放置在阴极支撑件5上以面对阳极4.阴极支撑件5 附接到由设置在室11内的矩形棱镜形式的框架构成的内部结构8。

4. 发明申请

US20070131170A1 Plasma CVD apparatus, and method for forming film and method for forming semiconductor device using the same 失效
标题翻译：等离子体CVD装置，以及用于形成膜的方法以及使用其形成半导体装置的方法
公开(公告)号：US20070131170A1
公开(公告)日：2007-06-14
申请号：US11700895
申请日：2007-02-01
申请人： Akira Shimizu , Yuhsuke Fukuoka , Yasushi Fujioka , Katsushi Kishimoto , Katsuhiko Nomoto
发明人： Akira Shimizu , Yuhsuke Fukuoka , Yasushi Fujioka , Katsushi Kishimoto , Katsuhiko Nomoto
IPC分类号： C23C16/00
CPC分类号： H01J37/32532 , C23C16/4583 , C23C16/5096
摘要： A plasma CVD apparatus comprises an anode electrode and a cathode electrode, and is for forming a thin film on a substrate by performing plasma discharge between the anode electrode and the cathode electrode, comprising: a substrate holder disposed between the anode electrode and the cathode electrode; and one conductive member disposed between the substrate holder and one electrode of either the anode electrode or the cathode electrode, wherein the substrate holder supports the substrate, the one conductive member is provided between the one electrode and the substrate holder so as to substantially cover an entire space between the one electrode and the substrate holder, and the one conductive member is electrically connected to the one electrode and the substrate holder.
摘要翻译：等离子体CVD装置包括阳极电极和阴极电极，用于通过在阳极电极和阴极电极之间执行等离子体放电来在衬底上形成薄膜，其包括：设置在阳极电极和阴极之间的衬底保持器 ; 以及设置在所述基板保持件和所述阳极电极或所述阴极电极的一个电极之间的一个导电部件，其中，所述基板保持器支撑所述基板，所述一个导电部件设置在所述一个电极和所述基板保持件之间，一个电极和衬底保持器之间的整个空间，并且一个导电构件电连接到一个电极和衬底保持器。

5. 发明授权

US07032536B2 Thin film formation apparatus including engagement members for support during thermal expansion 失效
标题翻译：薄膜形成装置包括用于在热膨胀期间支撑的接合构件
公开(公告)号：US07032536B2
公开(公告)日：2006-04-25
申请号：US10680213
申请日：2003-10-08
申请人： Yusuke Fukuoka , Yasushi Fujioka , Katsushi Kishimoto , Hiroyuki Fukuda , Katsuhiko Nomoto
发明人： Yusuke Fukuoka , Yasushi Fujioka , Katsushi Kishimoto , Hiroyuki Fukuda , Katsuhiko Nomoto
IPC分类号： C23C16/50
CPC分类号： H01J37/32009 , C23C16/5096 , H01J37/32082 , H01J37/32568 , H01J37/32724
摘要： A thin film formation apparatus for forming a thin film on a substrate is provided, which comprises: a reaction chamber; a gas introduction section for introducing a reactant gas into the reaction chamber; an evacuation section for exhausting the reactant gas from the reaction chamber; first and second planar electrodes provided in the reaction chamber; first and second support members which respectively support the first and second electrodes in parallel relation; a high frequency power source for applying high frequency power between the first and second electrodes; and a heating section for heating one of the first and second electrodes; wherein the substrate is placed on the heated electrode, and at least one of the first and second electrodes is supported movably in the direction of thermal expansion by the corresponding support member. With this arrangement, the variation in the spacing between the first electrode (anode electrode) and the second electrode (cathode electrode) can be reduced when the first and second electrodes are heated.
摘要翻译：提供一种用于在基板上形成薄膜的薄膜形成装置，其包括：反应室; 用于将反应气体引入反应室的气体导入部，用于从反应室排出反应气体的排气部; 设置在反应室中的第一和第二平面电极; 第一和第二支撑构件，其分别以平行关系支撑第一和第二电极; 用于在第一和第二电极之间施加高频电力的高频电源; 以及用于加热所述第一和第二电极之一的加热部分; 其中所述基板被放置在所述加热的电极上，并且所述第一和第二电极中的至少一个被所述相应的支撑构件沿热膨胀的方向可移动地支撑。利用这种布置，当第一和第二电极被加热时，可以减小第一电极（阳极电极）和第二电极（阴极电极）之间的间隔的变化。

6. 发明授权

US07565880B2 Plasma CVD apparatus, and method for forming film and method for forming semiconductor device using the same 失效
标题翻译：等离子体CVD装置，以及用于形成膜的方法以及使用其形成半导体装置的方法
公开(公告)号：US07565880B2
公开(公告)日：2009-07-28
申请号：US11700895
申请日：2007-02-01
申请人： Akira Shimizu , Yuhsuke Fukuoka , Yasushi Fujioka , Katsushi Kishimoto , Katsuhiko Nomoto
发明人： Akira Shimizu , Yuhsuke Fukuoka , Yasushi Fujioka , Katsushi Kishimoto , Katsuhiko Nomoto
IPC分类号： C23C16/00
CPC分类号： H01J37/32532 , C23C16/4583 , C23C16/5096
摘要： A plasma CVD apparatus comprises an anode electrode and a cathode electrode, and is for forming a thin film on a substrate by performing plasma discharge between the anode electrode and the cathode electrode, comprising: a substrate holder disposed between the anode electrode and the cathode electrode; and one conductive member disposed between the substrate holder and one electrode of either the anode electrode or the cathode electrode, wherein the substrate holder supports the substrate, the one conductive member is provided between the one electrode and the substrate holder so as to substantially cover an entire space between the one electrode and the substrate holder, and the one conductive member is electrically connected to the one electrode and the substrate holder.
摘要翻译：等离子体CVD装置包括阳极电极和阴极电极，用于通过在阳极电极和阴极电极之间执行等离子体放电来在衬底上形成薄膜，其包括：设置在阳极电极和阴极之间的衬底保持器 ; 以及设置在所述基板保持件和所述阳极电极或所述阴极电极的一个电极之间的一个导电部件，其中，所述基板保持器支撑所述基板，所述一个导电部件设置在所述一个电极和所述基板保持件之间，一个电极和衬底保持器之间的整个空间，并且一个导电构件电连接到一个电极和衬底保持器。

7. 发明申请

US20120155994A1 VACUUM PROCESSING DEVICE AND VACUUM PROCESSING FACTORY 审中-公开
标题翻译：真空加工设备和真空加工设备
公开(公告)号：US20120155994A1
公开(公告)日：2012-06-21
申请号：US13391886
申请日：2010-08-23
申请人： Katsushi Kishimoto , Yusuke Fukuoka
发明人： Katsushi Kishimoto , Yusuke Fukuoka
IPC分类号： H01L21/677
CPC分类号： H01L21/67724 , C23C16/54 , H01L21/6719 , H01L21/6773 , H01L21/67736 , H01L21/67775
摘要： A vacuum processing device includes a first processing chamber for housing a workpiece and performing vacuum processing on the workpiece, an evacuatable second processing chamber for housing a workpiece to be vacuum-processed and a workpiece having been vacuum-processed, a gate unit provided between the first and second processing chambers so that the gate unit is attachable to and detachable from the first processing chamber, a transport device for loading the workpiece to be vacuum-processed from a loading unit to a vacuum processing unit through the gate unit, and unloading the workpiece having been vacuum-processed from the vacuum processing unit to an unloading unit through the gate unit, and a movement mechanism for separating the first and second processing chambers from each other.
摘要翻译：真空处理装置包括：用于容纳工件并对工件进行真空处理的第一处理室，用于容纳要被真空处理的工件的可抽空的第二处理室和被真空处理的工件; 第一处理室和第二处理室，使得门单元可附接到第一处理室和可从第一处理室拆卸;传送装置，用于通过门单元将从加载单元被真空处理的工件装载到真空处理单元，工件已经从真空处理单元被真空处理到通过门单元的卸载单元，以及用于将第一和第二处理室彼此分离的移动机构。

8. 发明授权

US08137046B2 Substrate transfer apparatus and substrate transfer method 有权
标题翻译：基板转印装置和基板转印方法
公开(公告)号：US08137046B2
公开(公告)日：2012-03-20
申请号：US12536912
申请日：2009-08-06
申请人： Katsushi Kishimoto , Yusuke Fukuoka , Noriyoshi Kohama , Yusuke Ozaki
发明人： Katsushi Kishimoto , Yusuke Fukuoka , Noriyoshi Kohama , Yusuke Ozaki
IPC分类号： B65G35/00
CPC分类号： H01L21/67784 , H01L21/67748
摘要： A substrate transfer apparatus comprising: a plurality of floating-transfer guide plates adjacent to each other, each of guide plates having a plurality of floating gas ejecting holes; a gas supplying source; a tray to mount a substrate to be transferred, and that is floated by the floating gas; and a transfer arm for transferring the floated tray from the guide plate to the adjacent other guide plate, wherein the tray includes both side edges, and a contact/engagement portion formed at the respective both side edges for the transfer arm, each of the transfer arms including a base portion that can horizontally reciprocate along a rail provided so as to be parallel to the transfer direction, a guide portion provided to the base portion, that can horizontally reciprocate in a direction orthogonal to the transfer direction, and an arm portion provided to the guide portion, that can horizontally reciprocate in the direction parallel to the transfer direction.
摘要翻译：一种基板传送装置，包括：彼此相邻的多个浮动传送导向板，每个导板具有多个浮动气体喷射孔; 气体供应源; 用于安装待转移的基板并由浮动气体浮动的托盘; 以及用于将浮托盘从引导板传送到相邻的另一个引导板的传送臂，其中托盘包括两个侧边缘，以及形成在传送臂的相应两个侧边缘处的接触/接合部分，每个传送包括可沿着设置成平行于传送方向的轨道水平往复运动的基部的臂，设置在基部上的引导部，该引导部能够沿与传送方向正交的方向水平往复运动;以及臂部，导向部分能够沿平行于传送方向的方向水平往复运动。

9. 发明申请

US20110312167A1 PLASMA PROCESSING APPARATUS, AND DEPOSITION METHOD AN ETCHING METHOD USING THE PLASMA PROCESSING APPARATUS 审中-公开
标题翻译：等离子体处理装置和使用等离子体处理装置的蚀刻方法的沉积方法
公开(公告)号：US20110312167A1
公开(公告)日：2011-12-22
申请号：US12995579
申请日：2009-05-28
申请人： Katsushi Kishimoto , Yusuke Fukuoka , Nobuyuki Tanigawa
发明人： Katsushi Kishimoto , Yusuke Fukuoka , Nobuyuki Tanigawa
IPC分类号： H01L21/205 , H01L21/3065 , C23C16/50
CPC分类号： H01J37/32568 , C23C16/509 , H01J37/32091
摘要： A plasma processing apparatus, comprising: a reaction chamber; a plurality of discharge portions each made up of a pair of a first electrode and a second electrode disposed inside the reaction chamber so as to oppose to each other and to cause a plasma discharge under an atmosphere of a reactant gas; and a dummy electrode, wherein a plurality of the first electrodes are connected to a power supply portion, a plurality of the second electrodes are grounded, and the dummy electrode is disposed so as to oppose to an outer surface side of an external first electrode in terms of a parallel direction out of the plurality of the first electrodes which are disposed in the parallel direction, and is grounded.
摘要翻译：一种等离子体处理装置，包括：反应室; 多个放电部分，每个由一对第一电极和第二电极构成，设置在反应室内部以彼此相对，并在反应气体的气氛下引起等离子体放电; 和虚拟电极，其中多个所述第一电极连接到电源部分，多个所述第二电极接地，并且所述虚拟电极被设置为与所述外部第一电极的外表面侧相对并排设置在平行方向上的多个第一电极中的并联方向的接地。

10. 发明申请

US20100193915A1 PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD, AND SEMICONDUCTOR DEVICE 失效
标题翻译：等离子体处理装置和等离子体处理方法以及半导体器件
公开(公告)号：US20100193915A1
公开(公告)日：2010-08-05
申请号：US12676526
申请日：2008-09-02
申请人： Katsushi Kishimoto , Yusuke Fukuoka
发明人： Katsushi Kishimoto , Yusuke Fukuoka
IPC分类号： H01L29/30 , C23C16/00 , H01L21/203
CPC分类号： C23C16/4412 , C23C16/45502 , C23C16/509 , H01J37/32091 , H01J37/3244 , H01J37/32449 , H01J37/32724 , H01J37/32834 , H01L21/02532 , H01L21/0262
摘要： In a chamber of a plasma processing apparatus, a cathode electrode and an anode electrode are disposed at a distance from each other. The cathode electrode is supplied with electric power from an electric power supply portion. The anode electrode is electrically grounded and a substrate is placed thereon. The anode electrode contains a heater. In an upper wall portion of the chamber, an exhaust port is provided and connected to a vacuum pump through an exhaust pipe. In a lower wall portion of a wall surface of the chamber, a gas introduction port is provided. A gas supply portion is provided outside the chamber.
摘要翻译：在等离子体处理装置的室中，阴极电极和阳极电极彼此间隔开设置。阴极由电力供给部供给电力。阳极电极接地，衬底放置在其上。阳极电极包含加热器。在室的上壁部分中，设置排气口并通过排气管与真空泵连接。在室的壁面的下壁部分设置有气体导入口。气体供给部设置在室外。

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