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    • 1. 发明授权
    • Continuously film-forming apparatus provided with improved gas gate means
    • 连续成膜装置具有改进的气门装置
    • US5919310A
    • 1999-07-06
    • US610076
    • 1996-02-29
    • Yasushi FujiokaShotaro OkabeMasahiro KanaiTakehito YoshinoAkira SakaiTadashi Hori
    • Yasushi FujiokaShotaro OkabeMasahiro KanaiTakehito YoshinoAkira SakaiTadashi Hori
    • C23C16/54C23C16/00
    • C23C16/545
    • A continuous film-forming apparatus includes a plurality of reaction chambers each capable of forming a semiconductor film with a different chemical composition. The reaction chambers are arranged such that a substrate web on which a film is to be formed can be hermetically moved through each of the reaction chambers under a vacuum condition. A gas gate is disposed at a central position between each pair of adjacent reaction chambers, with each gas gate provided with a slit for communication between the adjacent reaction chambers. The slit is provided with a clearance which allows the substrate web to move therethrough, is structured such that gate gas can be introduced therein from above and beneath the substrate which is moved through the clearance, and is dimensioned such that opposite sides proximate to the position where the gate gas is introduced have different heights in accordance with the inner pressure upon film formation of each of the adjacent reaction chambers in communication with each other by the slit.
    • 连续成膜装置包括能够形成化学成分不同的半导体膜的多个反应室。 反应室被布置成使得在其上形成膜的基材网可以在真空条件下气密地移动通过每个反应室。 气门设置在每对相邻反应室之间的中心位置处,每个气门设置有用于在相邻反应室之间连通的狭缝。 狭缝设置有允许衬底腹板通过其移动的间隙,其结构使得可以从移动通过间隙的衬底的上方和下方将栅极气体引入其中,并且其尺寸使得接近位置的相对侧 其中引入的栅极气体根据通过狭缝彼此连通的每个相邻反应室的成膜时的内部压力具有不同的高度。
    • 2. 发明授权
    • Continuous forming method for functional deposited films
    • 功能沉积膜的连续成型方法
    • US5946587A
    • 1999-08-31
    • US741352
    • 1996-10-29
    • Yasushi FujiokaShotaro OkabeMasahiro KanaiTakehito YoshinoAkira SakaiTadashi Hori
    • Yasushi FujiokaShotaro OkabeMasahiro KanaiTakehito YoshinoAkira SakaiTadashi Hori
    • C23C14/56C23C16/54H01L31/20C23C16/00
    • H01L31/206C23C14/562C23C14/568C23C16/545H01L31/202Y02E10/50Y02P70/521
    • The present invention aims to provide a continuous forming method and apparatus for functional deposited films having excellent characteristics while preventing any mutual mixture of gases between film forming chambers having different pressures, wherein each of semiconductor layers of desired conduction type is deposited on a strip-like substrate within a plurality of film forming chambers, by plasma CVD, while the strip-like substrate is being moved continuously in a longitudinal direction thereof through the plurality of film forming chambers connected via a gas gate having the structure of introducing a scavenging gas into a slit-like separation passage, characterized in that at least one of the gas gates connecting the i-type layer film forming chamber for forming the semiconductor junction and the n- or p-type layer film forming chamber having higher pressure than the i-type layer film forming chamber has the scavenging gas introducing position disposed on the n- or p-type layer film forming chamber side off the center of the separation chamber of the gas gate.
    • 本发明的目的在于提供一种具有优异特性的功能性沉积膜的连续成型方法和装置,同时防止在具有不同压力的成膜室之间的气体之间的任何相互混合,其中期望的导电类型的每个半导体层沉积在带状 通过等离子体CVD在多个成膜室内的基板,同时带状基板沿着其长度方向连续移动通过多个成膜室,该多个成膜室通过具有引入清除气体的结构的气门连接到 狭缝状分离通道,其特征在于,连接形成半导体结的i型层成膜室和n型或p型层成膜室中的至少一个具有比i型 层成膜室具有设置在n型或p型层上的清除气体导入位置 成膜室一侧离开气门分离室的中心。