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    • 5. 发明授权
    • Thin film formation apparatus including engagement members for support during thermal expansion
    • 薄膜形成装置包括用于在热膨胀期间支撑的接合构件
    • US07032536B2
    • 2006-04-25
    • US10680213
    • 2003-10-08
    • Yusuke FukuokaYasushi FujiokaKatsushi KishimotoHiroyuki FukudaKatsuhiko Nomoto
    • Yusuke FukuokaYasushi FujiokaKatsushi KishimotoHiroyuki FukudaKatsuhiko Nomoto
    • C23C16/50
    • H01J37/32009C23C16/5096H01J37/32082H01J37/32568H01J37/32724
    • A thin film formation apparatus for forming a thin film on a substrate is provided, which comprises: a reaction chamber; a gas introduction section for introducing a reactant gas into the reaction chamber; an evacuation section for exhausting the reactant gas from the reaction chamber; first and second planar electrodes provided in the reaction chamber; first and second support members which respectively support the first and second electrodes in parallel relation; a high frequency power source for applying high frequency power between the first and second electrodes; and a heating section for heating one of the first and second electrodes; wherein the substrate is placed on the heated electrode, and at least one of the first and second electrodes is supported movably in the direction of thermal expansion by the corresponding support member. With this arrangement, the variation in the spacing between the first electrode (anode electrode) and the second electrode (cathode electrode) can be reduced when the first and second electrodes are heated.
    • 提供一种用于在基板上形成薄膜的薄膜形成装置,其包括:反应室; 用于将反应气体引入反应室的气体导入部, 用于从反应室排出反应气体的排气部; 设置在反应室中的第一和第二平面电极; 第一和第二支撑构件,其分别以平行关系支撑第一和第二电极; 用于在第一和第二电极之间施加高频电力的高频电源; 以及用于加热所述第一和第二电极之一的加热部分; 其中所述基板被放置在所述加热的电极上,并且所述第一和第二电极中的至少一个被所述相应的支撑构件沿热膨胀的方向可移动地支撑。 利用这种布置,当第一和第二电极被加热时,可以减小第一电极(阳极电极)和第二电极(阴极电极)之间的间隔的变化。
    • 6. 发明授权
    • Silicon-based thin-film photoelectric conversion device and method of manufacturing thereof
    • 硅系薄膜光电转换装置及其制造方法
    • US06979589B2
    • 2005-12-27
    • US10942958
    • 2004-09-17
    • Katsushi KishimotoYusuke FukuokaKatsuhiko Nomoto
    • Katsushi KishimotoYusuke FukuokaKatsuhiko Nomoto
    • H01L31/04H01L21/00H01L31/075H01L31/18
    • H01L31/077H01L31/1824Y02E10/545Y02P70/521
    • An excellent silicon-based thin-film photoelectric conversion device is manufactured simply and efficiently at a low cost. Specifically, a method of manufacturing the silicon-based thin-film photoelectric conversion device including a p-type semiconductor layer, an i-type microcrystalline silicon-based photoelectric conversion layer and an n-type semiconductor layer deposited by plasma CVD includes the steps of: successively depositing the p-type semiconductor layer, the i-type microcrystalline silicon-based photoelectric conversion layer and the n-type semiconductor layer on a substrate within the same plasma CVD film deposition chamber; transferring the substrate out of the film deposition chamber; and subsequently to the step of depositing the p-type semiconductor layer, the i-type microcrystalline silicon-based photoelectric conversion layer and the n-type semiconductor layer, eliminating influences of remaining n-type impurities on a cathode and/or within the film deposition chamber.
    • 以低成本简单高效地制造出优异的硅系薄膜光电转换元件。 具体而言,包括通过等离子体CVD沉积的p型半导体层,i型微晶硅系光电转换层和n型半导体层的硅基薄膜光电转换装置的制造方法包括以下步骤: :在相同的等离子体CVD膜沉积室内的基板上依次沉积p型半导体层,i型微晶硅基光电转换层和n型半导体层; 将所述衬底转移到所述成膜室内; 并且随后沉积p型半导体层,i型微晶硅基光电转换层和n型半导体层的步骤,消除了残留的n型杂质对阴极和/或膜内的影响 沉积室。
    • 10. 发明申请
    • VACUUM PROCESSING DEVICE AND VACUUM PROCESSING FACTORY
    • 真空加工设备和真空加工设备
    • US20120155994A1
    • 2012-06-21
    • US13391886
    • 2010-08-23
    • Katsushi KishimotoYusuke Fukuoka
    • Katsushi KishimotoYusuke Fukuoka
    • H01L21/677
    • H01L21/67724C23C16/54H01L21/6719H01L21/6773H01L21/67736H01L21/67775
    • A vacuum processing device includes a first processing chamber for housing a workpiece and performing vacuum processing on the workpiece, an evacuatable second processing chamber for housing a workpiece to be vacuum-processed and a workpiece having been vacuum-processed, a gate unit provided between the first and second processing chambers so that the gate unit is attachable to and detachable from the first processing chamber, a transport device for loading the workpiece to be vacuum-processed from a loading unit to a vacuum processing unit through the gate unit, and unloading the workpiece having been vacuum-processed from the vacuum processing unit to an unloading unit through the gate unit, and a movement mechanism for separating the first and second processing chambers from each other.
    • 真空处理装置包括:用于容纳工件并对工件进行真空处理的第一处理室,用于容纳要被真空处理的工件的可抽空的第二处理室和被真空处理的工件; 第一处理室和第二处理室,使得门单元可附接到第一处理室和可从第一处理室拆卸;传送装置,用于通过门单元将从加载单元被真空处理的工件装载到真空处理单元, 工件已经从真空处理单元被真空处理到通过门单元的卸载单元,以及用于将第一和第二处理室彼此分离的移动机构。