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    • 2. 发明授权
    • Method of producing material patterns by evaporating material through a
perforated mask having a reinforcing bridge
    • 通过具有加强桥的穿孔掩模蒸发材料来生产材料图案的方法
    • US4273812A
    • 1981-06-16
    • US8587
    • 1979-02-01
    • Ken TsutsuiAkira SasanoToshio NakanoHaruo MatsumaruEiichi Maruyama
    • Ken TsutsuiAkira SasanoToshio NakanoHaruo MatsumaruEiichi Maruyama
    • C23C14/04H05K3/14H05K3/10C23C13/00C23C13/02
    • H05K3/143C23C14/042
    • A method of producing material patterns in which at least one substrate is fixed together with a mask to a substrate holder, and an evaporated film of desired substances is formed on the surface of the substrate by means of evaporation sources provided to confront the substrate. The mask is fabricated to have a plurality of reinforcing bridges formed in the desired portions of the mask openings of desired shape formed in the mask. The mask is held spaced from the substrate by a small distance during the evaporation, so that the evaporation may be effected at least through two pattern openings defined at both sides of each bridge. The evaporation is performed by means of evaporation sources which are located such that the line interconnecting one of the edges of each bridge and the evaporation source located at the same side with respect to the substantial bridging direction of the bridge and another line interconnecting the other edge of the bridge and the evaporation source located at the same side as the other edge intersect each other at a point on the surface of the substrate or in the clearance between the substrate surface and the mask. This method makes it possible to produce patterns which could never be produced by the conventional evaporation method.
    • 一种生产材料图案的方法,其中至少一个基板与掩模一起固定到基板保持器上,并且通过设置成面对基板的蒸发源在基板的表面上形成所需物质的蒸发膜。 掩模被制造成具有形成在形成在掩模中的所需形状的掩模开口的所需部分中的多个加强桥。 掩模在蒸发期间与衬底间隔开一小段距离,使得蒸发可以至少通过限定在每个桥的两侧的两个图案开口进行。 通过蒸发源进行蒸发,所述蒸发源被定位成使得相对于桥的基本桥接方向互连每个桥的边缘之一的线和位于同一侧的蒸发源的线,另一条线与另一边相互连接 和位于与另一边缘相同侧的蒸发源在基板的表面上的点处或基板表面与掩模之间的间隙中彼此相交。 这种方法使得可以产生由常规蒸发方法所不能产生的图案。
    • 5. 发明授权
    • Method of manufacturing target of image pickup tube
    • 摄像管目标的制造方法
    • US4331506A
    • 1982-05-25
    • US212213
    • 1980-12-02
    • Akira SasanoToshio NakanoKen TsutsuiChushiro KusanoTadaaki HiraiEiichi Maruyama
    • Akira SasanoToshio NakanoKen TsutsuiChushiro KusanoTadaaki HiraiEiichi Maruyama
    • H01J9/233H01J31/46H01J31/26
    • H01J31/46H01J9/233
    • A method of manufacturing a target of an image pickup tube comprising the steps of: forming a plurality of groups of transparent conductive signal electrodes on a transparent insulating base plate; forming a first layer on at least a portion constituting an image area of the image pickup tube, said first layer being substantially insoluble in etching liquid used for etching an insulating layer to constitute an intermediate layer insulator in a double layered interconnection structure; forming, after formation of said first layer, an insulating layer to constitute said intermediate-layer insulator; removing a predetermined portion of said insulating layer, removing said first layer together with said insulating layer located thereon; forming bus bars; and forming a photoconductive layer on said plurality of groups of the transparent conductive signal electrodes.This invention provides an excellent method for mass production.
    • 一种制造图像拾取管的目标的方法,包括以下步骤:在透明绝缘基板上形成多组透明导电信号电极; 在构成图像拾取管的图像区域的至少一部分上形成第一层,所述第一层基本上不溶于用于蚀刻绝缘层的蚀刻液,以构成双层互连结构中的中间层绝缘体; 在形成所述第一层之后形成构成所述中间层绝缘体的绝缘层; 去除所述绝缘层的预定部分,与位于其上的所述绝缘层一起去除所述第一层; 形成母线; 以及在所述多个透明导电信号电极组上形成光电导层。 本发明提供了一种很好的批量生产方法。
    • 6. 发明授权
    • Thin film transistor substrate, manufacturing method thereof, liquid
crystal display panel and liquid crystal display equipment
    • 薄膜晶体管基板,其制造方法,液晶显示面板和液晶显示设备
    • US5889573A
    • 1999-03-30
    • US928719
    • 1997-09-12
    • Hideaki YamamotoHaruo MatsumaruYasuo TanakaKen TsutsuiToshihisa TsukadaKazuo ShirahashiAkira SasanoYuka Matsukawa
    • Hideaki YamamotoHaruo MatsumaruYasuo TanakaKen TsutsuiToshihisa TsukadaKazuo ShirahashiAkira SasanoYuka Matsukawa
    • G02F1/1343G02F1/1345G02F1/136G02F1/1362G02F1/1368G09F9/30G09G3/36H01L21/3205H01L21/336H01L27/12H01L29/49H01L29/78H01L29/786H01L29/04
    • G02F1/136286G02F1/1345G02F1/136213H01L29/4908H01L2924/0002
    • The present invention concerns an active-matrix addressed TFT substrate using a thin film transistor, a manufacturing method and an anodic oxidation method thereof, a liquid crystal display panel using the TFT substrate and a liquid crystal display equipment using the liquid crystal display panel and, more in particular, it relates to a structure and a manufacturing method which enables to improve the characteristics thereof.In the present invention, Cr or Ta is used for gate terminals, aluminum or a metal mainly composed of aluminum is used for gate bus-lines extended therefrom, gate electrodes and thin film capacitances (additional capacitance, storage capacitance) and an anodic oxidized film composed of the metal and free from defect is used for at least one of gate insulators, dielectric films of the thin film capacitances and interlayer insulation films for the intersections between the bus-lines. In a more preferred structure, the anodic oxidized film is used for all of the gate insulators, the dielectric films for the thin film capacitances and the interlayer insulation films for the intersections between the bus-lines.The present invention also relates to a method of selectively forming an anodic oxidized film on an aluminum pattern. That is, in a case of forming a selective oxidation mask to a desired region on the aluminum pattern with a positive type photoresist, in the present invention, an angle (.theta.) formed between the selective oxidation mask and the aluminum pattern is made as: .theta..gtoreq.110-20T (T: film thickness of the positive type photoresist).
    • 本发明涉及使用薄膜晶体管的有源矩阵寻址TFT基板,其制造方法和阳极氧化方法,使用TFT基板的液晶显示面板和使用该液晶显示面板的液晶显示设备, 更具体地,涉及能够改善其特性的结构和制造方法。 在本发明中,Cr或Ta用于栅极端子,铝或主要由铝组成的金属用于从其延伸的栅极总线,栅电极和薄膜电容(附加电容,存储电容)和阳极氧化膜 由金属构成并且没有缺陷用于栅极绝缘体,薄膜电容的介电膜和用于总线之间的交叉点的层间绝缘膜中的至少一个。 在更优选的结构中,阳极氧化膜用于所有栅极绝缘体,用于薄膜电容的介电膜和用于总线之间的交叉点的层间绝缘膜。 本发明还涉及在铝图案上选择性地形成阳极氧化膜的方法。 也就是说,在使用正型光致抗蚀剂在铝图案上的期望区域上形成选择性氧化掩模的情况下,在本发明中,在选择性氧化掩模和铝图案之间形成的角度(θ)为: θ= 110-20T(T:正型光致抗蚀剂的膜厚度)。