专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06517689B1 Plating device 有权
标题翻译：电镀装置
公开(公告)号：US06517689B1
公开(公告)日：2003-02-11
申请号：US09463019
申请日：2000-01-19
申请人： Akihisa Hongo , Kenichi Suzuki , Atsushi Chono , Mitsuo Tada , Akira Ogata , Satoshi Sendai , Koji Mishima
发明人： Akihisa Hongo , Kenichi Suzuki , Atsushi Chono , Mitsuo Tada , Akira Ogata , Satoshi Sendai , Koji Mishima
IPC分类号： B23H302
CPC分类号： C25D21/12 , G01R31/026
摘要： The present invention is to provide a conduction detection device that can detect electrical conductivity (contact condition) of feeding contacts with conductive layers of a substrate. The present invention also provides an electroplating apparatus, which is able to produce uniform currents to flow through each of feeding contacts. The apparatus has a plating vessel, in which an electrode is disposed opposite to a substrate which is affixed to a plating jig electrically through a plurality of feeding contacts for applying a specific voltage between the electrode and conductive layers provided on a plating surface of the substrate. Plating current flows from the plating jig through the feeding contacts to the substrate. A conduction detection device is provided to detect electrical conductive states between the plurality of feeding contacts and the conductive layer on the substrate.
摘要翻译：本发明提供一种能够检测与基板的导体层的馈电触点的导电性（接触状态）的导电检测装置。本发明还提供了一种电镀设备，其能够产生均匀的电流以流过每个馈电触点。该装置具有电镀槽，其中电极与衬底相对设置，该衬底通过多个馈电触点电连接到电镀夹具上，用于在电极和设置在衬底的电镀表面上的导电层之间施加特定电压。电镀电流从电镀夹具通过馈电触点流到基板。提供导电检测装置以检测多个馈电触点与基板上的导电层之间的导电状态。

2. 发明授权

US06500317B1 Plating apparatus for detecting the conductivity between plating contacts on a substrate 失效
标题翻译：用于检测基板上的电镀触点之间的导电性的电镀装置
公开(公告)号：US06500317B1
公开(公告)日：2002-12-31
申请号：US09581761
申请日：2000-06-16
申请人： Junichiro Yoshioka , Satoshi Sendai , Atsushi Chono , Mitsuo Tada , Akihisa Hongo , Yoshitaka Mukaiyama , Kenya Tomioka , Akira Ogata , Kenichi Suzuki , Naomitsu Ozawa
发明人： Junichiro Yoshioka , Satoshi Sendai , Atsushi Chono , Mitsuo Tada , Akihisa Hongo , Yoshitaka Mukaiyama , Kenya Tomioka , Akira Ogata , Kenichi Suzuki , Naomitsu Ozawa
IPC分类号： C25B904
CPC分类号： G01R31/026 , C25D21/12
摘要： The present invention provides a conductivity sensing device capable of detecting the conductivity (contact state) of the plurality of feeder contacts contacting the conductive area of the substrate, and a plating apparatus capable of forming a plating film of uniform thickness by supplying a uniform plating current through a plurality of feeder contacts.
摘要翻译：本发明提供一种电导率检测装置，其能够检测与基板的导电区域接触的多个馈电触点的导电性（接触状态），以及能够通过提供均匀电镀电流形成均匀厚度的镀膜的电镀装置通过多个馈线接触。

3. 发明申请

US20080274670A1 Substrate Peripheral Portion Measuring Device, and Substrate Peripheral Portion Polishing Apparatus 审中-公开
标题翻译：基板外围部分测量装置和基板外围部分抛光装置
公开(公告)号：US20080274670A1
公开(公告)日：2008-11-06
申请号：US11596714
申请日：2005-05-23
申请人： Mitsuo Tada , Yasunari Suto , Hirofumi Ichihara , Kenya Ito , Tamami Takahashi
发明人： Mitsuo Tada , Yasunari Suto , Hirofumi Ichihara , Kenya Ito , Tamami Takahashi
IPC分类号： B24B49/12
CPC分类号： H01L21/67242 , B24B9/065 , B24B49/12 , G01N21/9501 , G01N29/44 , H01L21/67023 , H01L21/67075
摘要： A projecting/receiving unit (52) projects a laser light to a peripheral portion (30) and receives the reflected light while a liquid is being fed to a substrate (14) and is flowing on the peripheral portion (30). A signal processing controller (54) processes the electric signal of the reflected light to decide the state of the peripheral portion (30). The state of the peripheral portion being polished is monitored. Moreover, the polish end point is detected. A transmission wave other than the laser light may also be used. The peripheral portion (30) may also be enclosed by a passage forming member thereby to form a passage properly. The peripheral portion can be properly measured even in the situation where the liquid is flowing on the substrate peripheral portion.
摘要翻译：投射/接收单元（52）将激光投射到周边部分（30）并且在液体被供给到基板（14）的同时接收反射光并在周边部分（30）上流动。信号处理控制器（54）处理反射光的电信号以决定周边部分（30）的状态。监视被抛光的周边部分的状态。此外，检测到抛光终点。也可以使用激光以外的透射波。周边部分（30）也可以由通道形成部件包围，从而适当地形成通道。即使在液体在基板周边部分上流动的情况下，也可以适当地测量周边部分。

4. 发明申请

US20070239309A1 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US20070239309A1
公开(公告)日：2007-10-11
申请号：US11730891
申请日：2007-04-04
申请人： Mitsuo Tada , Taro Takahashi , Motohiro Niijima , Shinro Ohta , Atsushi Shigeta
发明人： Mitsuo Tada , Taro Takahashi , Motohiro Niijima , Shinro Ohta , Atsushi Shigeta
IPC分类号： G06F19/00
CPC分类号： B24B37/005 , B24B49/105 , B24B49/12
摘要： A polishing apparatus is used for polishing and planarizing a substrate such as a semiconductor wafer on which a conductive film such as a copper (Cu) layer or a tungsten (W) layer is formed. The polishing apparatus includes a polishing table having a polishing surface, a motor for rotating the polishing table, a top ring for holding a substrate and pressing the substrate against the polishing surface, a film thickness measuring sensor disposed in the polishing table for scanning a surface of the substrate, and a computing device for processing signals of the film thickness measuring sensor to compute a film thickness of the substrate.
摘要翻译：抛光装置用于抛光和平面化诸如形成诸如铜（Cu）层或钨（W）层的导电膜的半导体晶片的衬底。抛光装置包括具有抛光面的研磨台，用于旋转研磨台的马达，用于保持基板并将基板压靠在抛光面上的顶环，设置在抛光台中用于扫描表面的膜厚测量传感器以及用于处理膜厚测量传感器的信号的计算装置，以计算衬底的膜厚度。

5. 发明授权

US06935935B2 Measuring apparatus 失效
标题翻译：测量装置
公开(公告)号：US06935935B2
公开(公告)日：2005-08-30
申请号：US10835059
申请日：2004-04-30
申请人： Mitsuo Tada , Yasunari Suto
发明人： Mitsuo Tada , Yasunari Suto
IPC分类号： G01N25/16 , B24B37/015 , B24B49/00 , B24B49/04 , B24B49/10 , B24B49/14 , G01B11/06 , G01B17/02 , H01L21/304 , H01L21/66
CPC分类号： B24B37/015 , B24B49/003 , B24B49/04 , B24B49/10 , G01B11/0666
摘要： A measuring apparatus includes a heating unit for applying heat to a first point within a workpiece or on a surface of a workpiece and propagating the heat to a second point within the workpiece or on the surface of the workpiece. The measuring apparatus further includes a measuring unit for measuring a displacement of the surface of the workpiece at the second point to which the heat has been propagated, and an analyzing unit for analyzing a structure of the workpiece based on the displacement measured by the measuring unit in consideration of a distance between the first point and the second point.
摘要翻译：测量装置包括加热单元，用于将热量加热到工件内的第一点或工件的表面上，并将热量传播到工件内或工件的表面上的第二点。测量装置还包括测量单元，用于测量在传播热量的第二点处的工件表面的位移;以及分析单元，用于基于由测量单元测量的位移来分析工件的结构考虑到第一点和第二点之间的距离。

6. 发明授权

US08696924B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US08696924B2
公开(公告)日：2014-04-15
申请号：US11730891
申请日：2007-04-04
申请人： Mitsuo Tada , Taro Takahashi , Motohiro Niijima , Shinro Ohta , Atsushi Shigeta
发明人： Mitsuo Tada , Taro Takahashi , Motohiro Niijima , Shinro Ohta , Atsushi Shigeta
IPC分类号： G06F19/00
CPC分类号： B24B37/005 , B24B49/105 , B24B49/12
摘要： A polishing apparatus is used for polishing and planarizing a substrate such as a semiconductor wafer on which a conductive film such as a copper (Cu) layer or a tungsten (W) layer is formed. The polishing apparatus includes a polishing table having a polishing surface, a motor for rotating the polishing table, a top ring for holding a substrate and pressing the substrate against the polishing surface, a film thickness measuring sensor disposed in the polishing table for scanning a surface of the substrate, and a computing device for processing signals of the film thickness measuring sensor to compute a film thickness of the substrate.
摘要翻译：抛光装置用于抛光和平面化诸如形成诸如铜（Cu）层或钨（W）层的导电膜的半导体晶片的衬底。抛光装置包括具有抛光面的研磨台，用于旋转研磨台的马达，用于保持基板并将基板压靠在抛光面上的顶环，设置在抛光台中用于扫描表面的膜厚测量传感器以及用于处理膜厚测量传感器的信号的计算装置，以计算衬底的膜厚度。

7. 发明授权

US07508201B2 Eddy current sensor 有权
标题翻译：涡流传感器
公开(公告)号：US07508201B2
公开(公告)日：2009-03-24
申请号：US10573593
申请日：2004-10-18
申请人： Mitsuo Tada , Yasunari Suto
发明人： Mitsuo Tada , Yasunari Suto
IPC分类号： G01B7/06 , G01R33/12 , G01N27/72
CPC分类号： G01B7/105
摘要： An eddy current sensor (10) has a sensor coil (100) disposed near a conductive film (6) formed on a semiconductor wafer (W) and a signal source (124) configured to supply an AC signal to the sensor coil (100) to produce an eddy current in the conductive film (6). The eddy current sensor (10) includes a detection circuit operable to detect the eddy current produced in the conductive film (6). The detection circuit is connected to the sensor coil (100). The eddy current sensor (10) also includes a housing (200) made of a material having a high magnetic permeability. The housing (200) accommodates the sensor coil (100) therein. The housing (200) is configured so that the sensor coil (100) forms a path of a magnetic flux (MF) so as to effectively produce an eddy current in the conductive film (6).
摘要翻译：涡电流传感器（10）具有设置在形成在半导体晶片（W）上的导电膜（6）附近的传感器线圈（100）和被配置为向传感器线圈（100）提供AC信号的信号源（124）以在导电膜（6）中产生涡流。涡流传感器（10）包括可操作以检测在导电膜（6）中产生的涡流的检测电路。检测电路连接到传感器线圈（100）。涡流传感器（10）还包括由具有高磁导率的材料制成的壳体（200）。壳体（200）容纳传感器线圈（100）。壳体（200）构造成使得传感器线圈（100）形成磁通（MF）的路径，以便有效地在导电膜（6）中产生涡流。

8. 发明申请

US20070103150A1 Eddy current sensor 有权
标题翻译：涡流传感器
公开(公告)号：US20070103150A1
公开(公告)日：2007-05-10
申请号：US10573593
申请日：2004-10-18
申请人： Mitsuo Tada , Yasunari Suto
发明人： Mitsuo Tada , Yasunari Suto
IPC分类号： G01B7/06
CPC分类号： G01B7/105
摘要： An eddy current sensor (10) has a sensor coil (100) disposed near a conductive film (6) formed on a semiconductor wafer (W) and a signal source (124) configured to supply an AC signal to the sensor coil (100) to produce an eddy current in the conductive film (6). The eddy current sensor (10) includes a detection circuit operable to detect the eddy current produced in the conductive film (6). The detection circuit is connected to the sensor coil (100). The eddy current sensor (10) also includes a housing (200) made of a material having a high magnetic permeability. The housing (200) accommodates the sensor coil (100) therein. The housing (200) is configured so that the sensor coil (100) forms a path of a magnetic flux (MF) so as to effectively produce an eddy current in the conductive film (6).
摘要翻译：涡电流传感器（10）具有设置在形成在半导体晶片（W）上的导电膜（6）附近的传感器线圈（100）和被配置为向传感器线圈（100）提供AC信号的信号源（124）以在导电膜（6）中产生涡流。涡流传感器（10）包括可操作以检测在导电膜（6）中产生的涡流的检测电路。检测电路连接到传感器线圈（100）。涡流传感器（10）还包括由具有高磁导率的材料制成的壳体（200）。壳体（200）容纳传感器线圈（100）。壳体（200）构造成使得传感器线圈（100）形成磁通（MF）的路径，以便有效地在导电膜（6）中产生涡流。

9. 发明授权

US06746319B2 Measuring apparatus 失效
标题翻译：测量装置
公开(公告)号：US06746319B2
公开(公告)日：2004-06-08
申请号：US10213109
申请日：2002-08-07
申请人： Mitsuo Tada , Yasunari Suto
发明人： Mitsuo Tada , Yasunari Suto
IPC分类号： B24B4900
CPC分类号： B24B37/015 , B24B49/003 , B24B49/04 , B24B49/10 , G01B11/0666
摘要： A measuring apparatus includes a heating unit for applying heat to a first point within a workpiece or on a surface of a workpiece and propagating the heat to a second point within the workpiece or on the surface of the workpiece. The measuring apparatus further includes a measuring unit for measuring a displacement of the surface of the workpiece at the second point to which the heat has been propagated, and an analyzing unit for analyzing a structure of the workpiece based on the displacement measured by the measuring unit in consideration of a distance between the first point and the second point.
摘要翻译：测量装置包括加热单元，用于将热量加热到工件内的第一点或工件的表面上，并将热量传播到工件内或工件的表面上的第二点。测量装置还包括测量单元，用于测量在传播热量的第二点处的工件表面的位移;以及分析单元，用于基于由测量单元测量的位移来分析工件的结构考虑到第一点和第二点之间的距离。

10. 发明授权

US4375917A Single-chip, MOS-LSI microprocessor controlled electrophotographic copying machine 失效
标题翻译：单芯片，MOS-LSI微处理器控制电子照相复印机
公开(公告)号：US4375917A
公开(公告)日：1983-03-08
申请号：US40535
申请日：1979-05-21
申请人： Shizuka Hiraike , Yukihiro Yoshida , Shintaro Hashimoto , Mitsuo Tada , Toshio Yamagishi
发明人： Shizuka Hiraike , Yukihiro Yoshida , Shintaro Hashimoto , Mitsuo Tada , Toshio Yamagishi
IPC分类号： G03G15/20 , G03G21/00 , G03G21/14 , G03G15/00
CPC分类号： G03G21/14
摘要： Within an electrophotographic copying machine having a predetermined number of sensing elements each deriving an output indicative of respective one of operating states of the machine, there is provided a single chip, MOS-LSI microprocessor responsive to the outputs of the sensing elements to control the machine in a sequential or serial mode. The microprocessor contains storage means storing a string of instructions, processing means to fetch sequentially the instructions from the storage means and to deal with the fetched instructions, first input means to receive synchronizing signals generated within the body of the machine, first output means to determine with aid of the processing means whether any synchronizing signal is inputted via the first input means and to produce confirmation signals after confirming the sensed operating states of the machine, second input means to introduce through the sensing elements the confirmation signals supplied via the first output means, and a second output means to process with aid of the processing means the signals received by the first input means and the second input means and to consequently produce control signals effective to control operation of the machine.
摘要翻译：在具有预定数量的感测元件的电子照相复印机中，每个导出表示机器的相应操作状态的输出，提供了单个芯片的MOS-LSI微处理器，其响应感测元件的输出来控制机器在顺序或串行模式下。微处理器包括存储一串指令的存储装置，用于从存储装置顺序取出指令并处理所取指令的处理装置，用于接收在机体内生成的同步信号的第一输入装置，第一输出装置，用于确定借助于处理装置，通过第一输入装置是否输入了任何同步信号，并且在确认所感测到的机器的操作状态之后产生确认信号，第二输入装置通过感测元件引入经由第一输出装置提供的确认信号以及第二输出装置，借助于处理装置处理由第一输入装置和第二输入装置接收的信号，并因此产生有效控制机器的操作的控制信号。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式