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1. 发明授权

US07508201B2 Eddy current sensor 有权
标题翻译：涡流传感器
公开(公告)号：US07508201B2
公开(公告)日：2009-03-24
申请号：US10573593
申请日：2004-10-18
申请人： Mitsuo Tada , Yasunari Suto
发明人： Mitsuo Tada , Yasunari Suto
IPC分类号： G01B7/06 , G01R33/12 , G01N27/72
CPC分类号： G01B7/105
摘要： An eddy current sensor (10) has a sensor coil (100) disposed near a conductive film (6) formed on a semiconductor wafer (W) and a signal source (124) configured to supply an AC signal to the sensor coil (100) to produce an eddy current in the conductive film (6). The eddy current sensor (10) includes a detection circuit operable to detect the eddy current produced in the conductive film (6). The detection circuit is connected to the sensor coil (100). The eddy current sensor (10) also includes a housing (200) made of a material having a high magnetic permeability. The housing (200) accommodates the sensor coil (100) therein. The housing (200) is configured so that the sensor coil (100) forms a path of a magnetic flux (MF) so as to effectively produce an eddy current in the conductive film (6).
摘要翻译：涡电流传感器（10）具有设置在形成在半导体晶片（W）上的导电膜（6）附近的传感器线圈（100）和被配置为向传感器线圈（100）提供AC信号的信号源（124）以在导电膜（6）中产生涡流。涡流传感器（10）包括可操作以检测在导电膜（6）中产生的涡流的检测电路。检测电路连接到传感器线圈（100）。涡流传感器（10）还包括由具有高磁导率的材料制成的壳体（200）。壳体（200）容纳传感器线圈（100）。壳体（200）构造成使得传感器线圈（100）形成磁通（MF）的路径，以便有效地在导电膜（6）中产生涡流。

2. 发明申请

US20070103150A1 Eddy current sensor 有权
标题翻译：涡流传感器
公开(公告)号：US20070103150A1
公开(公告)日：2007-05-10
申请号：US10573593
申请日：2004-10-18
申请人： Mitsuo Tada , Yasunari Suto
发明人： Mitsuo Tada , Yasunari Suto
IPC分类号： G01B7/06
CPC分类号： G01B7/105
摘要： An eddy current sensor (10) has a sensor coil (100) disposed near a conductive film (6) formed on a semiconductor wafer (W) and a signal source (124) configured to supply an AC signal to the sensor coil (100) to produce an eddy current in the conductive film (6). The eddy current sensor (10) includes a detection circuit operable to detect the eddy current produced in the conductive film (6). The detection circuit is connected to the sensor coil (100). The eddy current sensor (10) also includes a housing (200) made of a material having a high magnetic permeability. The housing (200) accommodates the sensor coil (100) therein. The housing (200) is configured so that the sensor coil (100) forms a path of a magnetic flux (MF) so as to effectively produce an eddy current in the conductive film (6).
摘要翻译：涡电流传感器（10）具有设置在形成在半导体晶片（W）上的导电膜（6）附近的传感器线圈（100）和被配置为向传感器线圈（100）提供AC信号的信号源（124）以在导电膜（6）中产生涡流。涡流传感器（10）包括可操作以检测在导电膜（6）中产生的涡流的检测电路。检测电路连接到传感器线圈（100）。涡流传感器（10）还包括由具有高磁导率的材料制成的壳体（200）。壳体（200）容纳传感器线圈（100）。壳体（200）构造成使得传感器线圈（100）形成磁通（MF）的路径，以便有效地在导电膜（6）中产生涡流。

3. 发明授权

US06746319B2 Measuring apparatus 失效
标题翻译：测量装置
公开(公告)号：US06746319B2
公开(公告)日：2004-06-08
申请号：US10213109
申请日：2002-08-07
申请人： Mitsuo Tada , Yasunari Suto
发明人： Mitsuo Tada , Yasunari Suto
IPC分类号： B24B4900
CPC分类号： B24B37/015 , B24B49/003 , B24B49/04 , B24B49/10 , G01B11/0666
摘要： A measuring apparatus includes a heating unit for applying heat to a first point within a workpiece or on a surface of a workpiece and propagating the heat to a second point within the workpiece or on the surface of the workpiece. The measuring apparatus further includes a measuring unit for measuring a displacement of the surface of the workpiece at the second point to which the heat has been propagated, and an analyzing unit for analyzing a structure of the workpiece based on the displacement measured by the measuring unit in consideration of a distance between the first point and the second point.
摘要翻译：测量装置包括加热单元，用于将热量加热到工件内的第一点或工件的表面上，并将热量传播到工件内或工件的表面上的第二点。测量装置还包括测量单元，用于测量在传播热量的第二点处的工件表面的位移;以及分析单元，用于基于由测量单元测量的位移来分析工件的结构考虑到第一点和第二点之间的距离。

4. 发明申请

US20080274670A1 Substrate Peripheral Portion Measuring Device, and Substrate Peripheral Portion Polishing Apparatus 审中-公开
标题翻译：基板外围部分测量装置和基板外围部分抛光装置
公开(公告)号：US20080274670A1
公开(公告)日：2008-11-06
申请号：US11596714
申请日：2005-05-23
申请人： Mitsuo Tada , Yasunari Suto , Hirofumi Ichihara , Kenya Ito , Tamami Takahashi
发明人： Mitsuo Tada , Yasunari Suto , Hirofumi Ichihara , Kenya Ito , Tamami Takahashi
IPC分类号： B24B49/12
CPC分类号： H01L21/67242 , B24B9/065 , B24B49/12 , G01N21/9501 , G01N29/44 , H01L21/67023 , H01L21/67075
摘要： A projecting/receiving unit (52) projects a laser light to a peripheral portion (30) and receives the reflected light while a liquid is being fed to a substrate (14) and is flowing on the peripheral portion (30). A signal processing controller (54) processes the electric signal of the reflected light to decide the state of the peripheral portion (30). The state of the peripheral portion being polished is monitored. Moreover, the polish end point is detected. A transmission wave other than the laser light may also be used. The peripheral portion (30) may also be enclosed by a passage forming member thereby to form a passage properly. The peripheral portion can be properly measured even in the situation where the liquid is flowing on the substrate peripheral portion.
摘要翻译：投射/接收单元（52）将激光投射到周边部分（30）并且在液体被供给到基板（14）的同时接收反射光并在周边部分（30）上流动。信号处理控制器（54）处理反射光的电信号以决定周边部分（30）的状态。监视被抛光的周边部分的状态。此外，检测到抛光终点。也可以使用激光以外的透射波。周边部分（30）也可以由通道形成部件包围，从而适当地形成通道。即使在液体在基板周边部分上流动的情况下，也可以适当地测量周边部分。

5. 发明授权

US06935935B2 Measuring apparatus 失效
标题翻译：测量装置
公开(公告)号：US06935935B2
公开(公告)日：2005-08-30
申请号：US10835059
申请日：2004-04-30
申请人： Mitsuo Tada , Yasunari Suto
发明人： Mitsuo Tada , Yasunari Suto
IPC分类号： G01N25/16 , B24B37/015 , B24B49/00 , B24B49/04 , B24B49/10 , B24B49/14 , G01B11/06 , G01B17/02 , H01L21/304 , H01L21/66
CPC分类号： B24B37/015 , B24B49/003 , B24B49/04 , B24B49/10 , G01B11/0666
摘要： A measuring apparatus includes a heating unit for applying heat to a first point within a workpiece or on a surface of a workpiece and propagating the heat to a second point within the workpiece or on the surface of the workpiece. The measuring apparatus further includes a measuring unit for measuring a displacement of the surface of the workpiece at the second point to which the heat has been propagated, and an analyzing unit for analyzing a structure of the workpiece based on the displacement measured by the measuring unit in consideration of a distance between the first point and the second point.
摘要翻译：测量装置包括加热单元，用于将热量加热到工件内的第一点或工件的表面上，并将热量传播到工件内或工件的表面上的第二点。测量装置还包括测量单元，用于测量在传播热量的第二点处的工件表面的位移;以及分析单元，用于基于由测量单元测量的位移来分析工件的结构考虑到第一点和第二点之间的距离。

6. 发明授权

US07714572B2 Method of detecting characteristics of films using eddy current 有权
标题翻译：使用涡流检测膜的特性的方法
公开(公告)号：US07714572B2
公开(公告)日：2010-05-11
申请号：US11442274
申请日：2006-05-30
申请人： Mitsuo Tada , Hironobu Yamasaki , Yasunari Suto
发明人： Mitsuo Tada , Hironobu Yamasaki , Yasunari Suto
IPC分类号： G01B7/06 , G01R33/12
CPC分类号： B24B37/013 , B24B49/04 , B24B49/10 , B24B49/105 , G01B7/105 , G01D5/202 , G01R23/10
摘要： A method of detecting a characteristic (such as thickness) of first and second films formed on a substrate includes supplying a sensor coil with a first alternating current having a first frequency when detecting the first film, and a second alternating current having a second frequency when detecting the second film. An eddy current is thereby generated in the first film or the second film. An impedance across the sensor coil is measured, and the characteristic of any one of the first film and the second film is detected based on the impedance.
摘要翻译：检测形成在基板上的第一和第二膜的特性（例如厚度）的方法包括在检测第一膜时向传感器线圈供给具有第一频率的第一交流电流;以及第二交流电流，检测第二片。由此在第一膜或第二膜中产生涡流。测量传感器线圈两端的阻抗，并且基于阻抗检测第一膜和第二膜中的任何一个的特性。

7. 发明授权

US07670206B2 Substrate polishing apparatus and substrate polishing method 有权
公开(公告)号：US07670206B2
公开(公告)日：2010-03-02
申请号：US10559135
申请日：2004-06-17
申请人： Tetsuji Togawa , Koichi Fukaya , Mitsuo Tada , Taro Takahashi , Yasunari Suto
发明人： Tetsuji Togawa , Koichi Fukaya , Mitsuo Tada , Taro Takahashi , Yasunari Suto
IPC分类号： B24B49/00
CPC分类号： B24B37/013 , B24B49/105 , B24B49/12 , B24B49/16
摘要： The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a substrate (W) against the polishing surface (101) of the polishing table (100), and a film thickness measuring device (200) for measuring a thickness of a film on the substrate (W). The substrate holder (1) has a plurality of pressure adjustable chambers (22 to 25), and pressures in the respective chambers (22 to 25) are adjusted based on the film thickness measured by the film thickness measuring device (200).

8. 发明申请

US20060214657A1 Polishing device using eddy current sensor 有权
公开(公告)号：US20060214657A1
公开(公告)日：2006-09-28
申请号：US11442274
申请日：2006-05-30
申请人： Mitsuo Tada , Hironobu Yamasaki , Yasunari Suto
发明人： Mitsuo Tada , Hironobu Yamasaki , Yasunari Suto
IPC分类号： G01B7/06
CPC分类号： B24B37/013 , B24B49/04 , B24B49/10 , B24B49/105 , G01B7/105 , G01D5/202 , G01R23/10
摘要： An eddy current sensor and a method for detecting the thickness of a film formed on a substrate. The eddy current sensor, which is capable of stable operation, is operable to accurately detect a polishing endpoint. The eddy current sensor detects the thickness of a conductive film from a change in an eddy current loss generated in the conductive film. The eddy current sensor comprises a sensor coil for generating an eddy current in the conductive film, and an active element unit connected to the sensor coil for oscillating a variable frequency corresponding to the eddy current loss. The sensor coil and active element unit are integrated to form the eddy current sensor. Alternatively, the eddy current sensor comprises a sensor coil for generating an eddy current in the conductive film, and a detector for detecting a change in the thickness of the conductive film from a change in a resistance component in an impedance formed by the sensor coil and conductive film.

9. 发明申请

US20060164104A1 Measuring apparatus 审中-公开
标题翻译：测量装置
公开(公告)号：US20060164104A1
公开(公告)日：2006-07-27
申请号：US10559476
申请日：2004-06-10
申请人： Mitsuo Tada , Yasunari Suto
发明人： Mitsuo Tada , Yasunari Suto
IPC分类号： G01R27/04
CPC分类号： G01N22/00 , G01B15/02
摘要： The present invention relates to a measuring apparatus for measuring a thickness or the like of a thin film formed on a surface of a substrate such as a semiconductor wafer. The measuring apparatus includes a microwave emission device (40) for emitting a microwave to a substance, a microwave generator (45) for supplying the microwave to the microwave emission device (40), a detector (47) for detecting an amplitude or a phase of the microwave which has been reflected from or passed through the substance, and an analyzer (48) for analyzing a structure of the substance based on the amplitude or the phase of the microwave which has been detected by the detector (47).
摘要翻译：本发明涉及一种用于测量形成在诸如半导体晶片的基板的表面上的薄膜的厚度等的测量装置。测量装置包括用于向物质发射微波的微波发射装置（40），用于向微波发射装置（40）提供微波的微波发生器（45），用于检测振幅或相位的检测器的已经从物质反射或通过的微波的分析器（48），以及用于基于由检测器（47）检测到的微波的振幅或相位来分析物质的结构的分析器（48）。

10. 发明授权

US07078894B2 Polishing device using eddy current sensor 有权
标题翻译：抛光装置采用涡流传感器
公开(公告)号：US07078894B2
公开(公告)日：2006-07-18
申请号：US10639526
申请日：2003-08-13
申请人： Mitsuo Tada , Hironobu Yamasaki , Yasunari Suto
发明人： Mitsuo Tada , Hironobu Yamasaki , Yasunari Suto
IPC分类号： G01B7/06
CPC分类号： B24B37/013 , B24B49/04 , B24B49/10 , B24B49/105 , G01B7/105 , G01D5/202 , G01R23/10
摘要： An eddy current sensor and a method for detecting the thickness of a film formed on a substrate. The eddy current sensor, which is capable of stable operation, is operable to accurately detect a polishing endpoint. The eddy current sensor detects the thickness of a conductive film from a change in an eddy current loss generated in the conductive film. The eddy current sensor comprises a sensor coil for generating an eddy current in the conductive film, and an active element unit connected to the sensor coil for oscillating a variable frequency corresponding to the eddy current loss. The sensor coil and active element unit are integrated to form the eddy current sensor. Alternatively, the eddy current sensor comprises a sensor coil for generating an eddy current in the conductive film, and a detector for detecting a change in the thickness of the conductive film from a change in a resistance component in an impedance formed by the sensor coil and conductive film.
摘要翻译：涡电流传感器和用于检测在基板上形成的膜的厚度的方法。能够稳定运行的涡流传感器可操作以精确地检测抛光终点。涡电流传感器从导电膜中产生的涡流损耗的变化来检测导电膜的厚度。涡电流传感器包括用于在导电膜中产生涡流的传感器线圈和连接到传感器线圈的有源元件单元，用于振荡对应于涡流损耗的可变频率。传感器线圈和有源元件单元被集成以形成涡流传感器。或者，涡电流传感器包括用于在导电膜中产生涡流的传感器线圈和用于检测由传感器线圈形成的阻抗中的电阻分量的变化导致的导电膜的厚度变化的检测器，以及导电膜。

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