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1. 发明授权

US06660139B1 Plating apparatus and method 有权
标题翻译：电镀装置及方法
公开(公告)号：US06660139B1
公开(公告)日：2003-12-09
申请号：US09706756
申请日：2000-11-07
申请人： Satoshi Sendai , Kenya Tomioka , Katsumi Tsuda , Naomitsu Ozawa
发明人： Satoshi Sendai , Kenya Tomioka , Katsumi Tsuda , Naomitsu Ozawa
IPC分类号： C25D1706
CPC分类号： H01L21/6723 , C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/67184 , H01L21/67742 , H01L21/68707 , H01L21/68792
摘要： A plating apparatus continuously plates a surface of a substrate with metal and performs its supplementary process in one housing unit. The plating apparatus comprises a cassette stage for placing a substrate cassette thereon, a pre-treatment unit for pre-treating a surface of a substrate, and a plating unit for plating a surface of the substrate pre-treated in the pre-treatment unit. The plating apparatus further comprises a first substrate stage disposed between the cassette stage and the pre-treatment unit, a cleaning and drying unit disposed between the cassette stage and the first substrate stage, a first transfer device, and a second transfer device. The first transfer device transfers a substrate between the substrate cassette, the cleaning and drying unit, and the first substrate stage. The second transfer device transfers a substrate between the first substrate stage, the pre-treatment unit, and the plating unit.
摘要翻译：电镀装置用金属连续地对基板的表面进行平板化，并在一个外壳单元中进行补充处理。电镀装置包括用于将基板盒放置在其上的盒台，用于预处理基板表面的预处理单元和用于对在预处理单元中预处理的基板的表面进行电镀的电镀单元。电镀装置还包括设置在盒台和预处理单元之间的第一衬底台，设置在盒台和第一衬底台之间的清洁和干燥单元，第一传送装置和第二传送装置。第一转印装置在衬底盒，清洁和干燥单元与第一衬底台之间传送衬底。第二转印装置在第一基板载台，预处理单元和电镀单元之间传送基板。

2. 发明授权

US07166204B2 Plating apparatus and method 失效
标题翻译：电镀装置及方法
公开(公告)号：US07166204B2
公开(公告)日：2007-01-23
申请号：US10204274
申请日：2002-01-23
申请人： Satoshi Sendai , Kenya Tomioka , Katsumi Tsuda , Masayuki Kumekawa , Koji Mishima
发明人： Satoshi Sendai , Kenya Tomioka , Katsumi Tsuda , Masayuki Kumekawa , Koji Mishima
IPC分类号： C25D17/16 , C25D5/00 , C25D7/12 , C25D17/00
CPC分类号： H01L21/2885 , C25D5/04 , C25D7/123 , C25D17/001 , C25D17/02 , H01L21/76877
摘要： A plating apparatus and method which smoothly perform contact of a plating liquid with a surface of the substrate and which can prevent air bubbles from remaining on the surface to be plated. The plating apparatus includes a plating bath containing a plating liquid in which an anode is immersed, a head portion for holding a substrate detachably and bringing a lower surface, to be plated, of the substrate into contact with an overflow surface of the plating liquid held in the plating bath, a drive mechanism for rotating the head portion, and a tilt mechanism for tilting the head portion so that the substrate held by the head portion is inclined relative to a horizontal plane.
摘要翻译：一种电镀装置和方法，其平滑地进行电镀液体与基板表面的接触，并且能够防止气泡残留在被镀表面上。电镀装置包括：电镀液，其含有浸渍有阳极的电镀液，可拆卸地保持基板的头部和被镀层的下表面与被保持的电镀液的溢流面接触; 在电镀槽中，用于使头部旋转的驱动机构，以及用于倾斜头部的倾斜机构，使得由头部保持的基板相对于水平面倾斜。

3. 发明授权

US06365020B1 Wafer plating jig 有权
标题翻译：晶圆电镀夹具
公开(公告)号：US06365020B1
公开(公告)日：2002-04-02
申请号：US09600028
申请日：2000-07-11
申请人： Junichiro Yoshioka , Kenya Tomioka , Satoshi Sendai , Atsushi Chono , Naomitsu Ozawa
发明人： Junichiro Yoshioka , Kenya Tomioka , Satoshi Sendai , Atsushi Chono , Naomitsu Ozawa
IPC分类号： C25B902
CPC分类号： C25D17/08 , C25D7/12 , C25D17/001 , C25D17/005 , C25D17/06
摘要： The present invention is to provide a wafer plating jig for a plating apparatus having a simple construction and capable of sealing conducting pins from the plating solution completely. The wafer plating jig for gripping a wafer, comprises a main jig body (11) having a plurality of gripping mechanisms (13) and a plurality of conducting pins disposed thereon. A seal packing (20) is provided to surround each of the conducting pins. When the wafer is gripped by the gripping mechanisms (13), each end of the conducting pins individually contacts conductive film formed on the wafer and being sealed by the seal packing (20).
摘要翻译：本发明提供一种电镀设备的晶片电镀夹具，其结构简单，能够完全从电镀液中密封导电引脚。用于夹持晶片的晶片电镀夹具包括具有多个夹紧机构（13）和设置在其上的多个导电销的主夹具本体（11）。设置密封垫圈（20）以围绕每个导电销。当晶片被夹持机构（13）夹持时，导电销的每一端分别接触形成在晶片上的导电膜并由密封垫圈（20）密封。

4. 发明授权

US07241372B2 Plating apparatus and plating liquid removing method 有权
标题翻译：电镀装置及电镀液除去方法
公开(公告)号：US07241372B2
公开(公告)日：2007-07-10
申请号：US10740630
申请日：2003-12-22
申请人： Satoshi Sendai , Kenya Tomioka , Katsumi Tsuda
发明人： Satoshi Sendai , Kenya Tomioka , Katsumi Tsuda
IPC分类号： C25D21/08 , C25D7/12
CPC分类号： H01L21/67005 , C25D17/00 , C25D17/001 , C25D17/004 , C25D17/005 , C25D17/06 , H01L21/2885 , H05K3/423 , Y10S134/902
摘要： A plating apparatus and a plating liquid removing method removes a plating liquid remaining on a substrate-contacting portion, or portions in its vicinity, of a substrate holding member. The plating apparatus comprises a head having a rotatable housing provided with a substrate holding member for holding a substrate, a plating process container, disposed below the head, for holding a plating liquid therein, and a plating liquid removing mechanism for removing plating liquid remaining on the substrate-contacting portion, or the portions in its vicinity, at an inner circumferential edge of the substrate holding member.
摘要翻译：电镀装置和电镀液除去方法除去残留在基板保持部件的基板接触部分或其附近的部分的电镀液。电镀装置包括具有可旋转壳体的头部，该壳体设置有用于保持基板的基板保持部件，设置在头部下方的用于保持电镀液体的电镀处理容器，以及用于除去剩余的电镀液体的电镀液除去机构基板接触部分或其附近的部分在基板保持构件的内周边缘处。

5. 发明申请

US20060185976A1 Plating apparatus and method 审中-公开
公开(公告)号：US20060185976A1
公开(公告)日：2006-08-24
申请号：US11408997
申请日：2006-04-24
申请人： Satoshi Sendai , Kenya Tomioka , Katsumi Tsuda , Naomitsu Ozawa
发明人： Satoshi Sendai , Kenya Tomioka , Katsumi Tsuda , Naomitsu Ozawa
IPC分类号： C25B9/00 , C25C7/00
CPC分类号： H01L21/6723 , C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/67184 , H01L21/67742 , H01L21/68707 , H01L21/68792
摘要： A plating apparatus continuously plates a surface of a substrate with metal and performs its supplementary process in one housing unit. The plating apparatus comprises a cassette stage for placing a substrate cassette thereon, a pre-treatment unit for pre-treating a surface of a substrate, and a plating unit for plating a surface of the substrate pre-treated in the pre-treatment unit. The plating apparatus further comprises a first substrate stage disposed between the cassette stage and the pre-treatment unit, a cleaning and drying unit disposed between the cassette stage and the first substrate stage, a first transfer device, and a second transfer device. The first transfer device transfers a substrate between the substrate cassette, the cleaning and drying unit, and the first substrate stage. The second transfer device transfers a substrate between the first substrate stage, the pre-treatment unit, and the plating unit.

6. 发明授权

US06689216B2 Plating apparatus and plating liquid removing method 有权
标题翻译：电镀装置及电镀液除去方法
公开(公告)号：US06689216B2
公开(公告)日：2004-02-10
申请号：US09922680
申请日：2001-08-07
申请人： Satoshi Sendai , Kenya Tomioka , Katsumi Tsuda
发明人： Satoshi Sendai , Kenya Tomioka , Katsumi Tsuda
IPC分类号： B05C300
CPC分类号： H01L21/67005 , C25D17/00 , C25D17/001 , C25D17/004 , C25D17/005 , C25D17/06 , H01L21/2885 , H05K3/423 , Y10S134/902
摘要： A plating apparatus and a plating liquid removing method removes a plating liquid remaining on a substrate-contacting portion, or portions in its vicinity, of a substrate holding member. The plating apparatus comprises a head having a rotatable housing provided with a substrate holding member for holding a substrate, a plating process container, disposed below the head, for holding a plating liquid therein, and a plating liquid removing mechanism for removing plating liquid remaining on the substrate-contacting portion, or the portions in its vicinity, at an inner circumferential edge of the substrate holding member.
摘要翻译：电镀装置和电镀液除去方法除去残留在基板保持部件的基板接触部分或其附近的部分的电镀液。电镀装置包括具有可旋转壳体的头部，该壳体设置有用于保持基板的基板保持部件，设置在头部下方的用于保持电镀液体的电镀处理容器，以及用于除去剩余的电镀液体的电镀液除去机构基板接触部分或其附近的部分在基板保持构件的内周边缘处。

7. 发明授权

US06558518B1 Method and apparatus for plating substrate and plating facility 有权
标题翻译：电镀基板和电镀设备的方法和装置
公开(公告)号：US06558518B1
公开(公告)日：2003-05-06
申请号：US09612218
申请日：2000-07-07
申请人： Satoshi Sendai , Akihisa Hongo , Kenya Tomioka , Katsumi Tsuda , Masayuki Kumekawa , Naoaki Ogure , Kenichi Sasabe
发明人： Satoshi Sendai , Akihisa Hongo , Kenya Tomioka , Katsumi Tsuda , Masayuki Kumekawa , Naoaki Ogure , Kenichi Sasabe
IPC分类号： C25B1500
CPC分类号： C25D17/12 , C25D5/08 , C25D7/123 , C25D17/001 , C25D17/06 , H01L21/02068 , H01L21/02087 , H01L21/0209 , H01L21/67051 , H01L21/6708 , H01L21/6723 , H01L21/76883
摘要： A substrate such as a semiconductor wafer is plated to fill a metal such as copper (Cu) or the like in interconnection grooves defined in the substrate. An apparatus for plating such a substrate has a plating chamber for holding a plating solution, the plating chamber housing an anode that is immersible in the plating solution held by the plating chamber. A plating solution ejector pipe produces an upward jet of plating solution from a plating solution supplied to the plating chamber from an external source, and a substrate holder removably holds a substrate and positions the substrate such that a surface to be plated of the substrate is held in contact with the jet of plating solution. The plating chamber has a plating solution outlet defined in a bottom thereof for discharging a portion of the supplied plating solution via through-holes defined in the anode and/or around the anode out of the plating chamber.
摘要翻译：电镀衬底如半导体晶片以在衬底中限定的互连槽中填充铜（Cu）等金属。用于电镀这种基板的装置具有用于保持电镀液的电镀室，电镀室容纳浸入由电镀室保持的镀液中的阳极。电镀溶液喷射管从外部源产生从供给到电镀室的镀液的向上喷射的电镀溶液，并且衬底保持器可移除地保持衬底并定位衬底，使得保持衬底的待镀表面与电镀液接触。电镀室具有限定在其底部的电镀溶液出口，用于通过限定在阳极中和/或阳极周围的通孔从电镀室中排出一部分供应的电镀溶液。

8. 发明授权

US06500317B1 Plating apparatus for detecting the conductivity between plating contacts on a substrate 失效
标题翻译：用于检测基板上的电镀触点之间的导电性的电镀装置
公开(公告)号：US06500317B1
公开(公告)日：2002-12-31
申请号：US09581761
申请日：2000-06-16
申请人： Junichiro Yoshioka , Satoshi Sendai , Atsushi Chono , Mitsuo Tada , Akihisa Hongo , Yoshitaka Mukaiyama , Kenya Tomioka , Akira Ogata , Kenichi Suzuki , Naomitsu Ozawa
发明人： Junichiro Yoshioka , Satoshi Sendai , Atsushi Chono , Mitsuo Tada , Akihisa Hongo , Yoshitaka Mukaiyama , Kenya Tomioka , Akira Ogata , Kenichi Suzuki , Naomitsu Ozawa
IPC分类号： C25B904
CPC分类号： G01R31/026 , C25D21/12
摘要： The present invention provides a conductivity sensing device capable of detecting the conductivity (contact state) of the plurality of feeder contacts contacting the conductive area of the substrate, and a plating apparatus capable of forming a plating film of uniform thickness by supplying a uniform plating current through a plurality of feeder contacts.
摘要翻译：本发明提供一种电导率检测装置，其能够检测与基板的导电区域接触的多个馈电触点的导电性（接触状态），以及能够通过提供均匀电镀电流形成均匀厚度的镀膜的电镀装置通过多个馈线接触。

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