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    • 6. 发明授权
    • Process for producing single crystal semiconductor layer and
semiconductor device produced by said process
    • 通过所述方法制造单晶半导体层和半导体器件的制造方法
    • US5371381A
    • 1994-12-06
    • US587500
    • 1990-09-24
    • Kazuyuki SugaharaTadashi NishimuraShigeru KusunokiYasuo Inoue
    • Kazuyuki SugaharaTadashi NishimuraShigeru KusunokiYasuo Inoue
    • H01L21/20H01L21/268H01L21/822H01L29/04H01L27/04
    • H01L21/8221H01L21/2026H01L21/268H01L29/045Y10S117/904Y10S148/09Y10S148/091Y10S148/093
    • Disclosed herein is a process for producing a single crystal layer of a semiconductor device, which comprises the steps of providing an oxide insulator layer separated by an opening part for seeding, on a major surface of a single crystal semiconductor substrate of the cubic system, providing a polycrystalline or amorphous semiconductor layer on the entire surface of the insulator layer inclusive of the opening part, then providing a protective layer comprising at least a reflective or anti-reflection film comprising stripes of a predetermined width, in a predetermined direction relative to the opening part and at a predetermined interval, the protective layer capable of controlling the temperature distributions in the semiconductor layer at the parts corresponding to the stripes or the parts not corresponding to the stripes, thereby completing a base for producing a semiconductor device, thereafter the surface of the base is irradiated with an energy beam through the striped reflective or anti-reflection film to melt the polycrystalline or amorphous semiconductor and scanning the energy beam in a predetermined direction such that the direction of the crystal of the semiconductor re-solidified and converted into a single crystal accords with a {111} plane, to produce the single crystal of the semiconductor device. Also disclosed is a semiconductor device produced by the method, which comprises a single crystal layer having a wide range of a crystal in a predetermined direction relative to the facial orientation of the major surface of the substrate, and has a three-dimensional semiconductor circuit element construction.
    • 本发明公开了一种制造半导体器件的单晶层的方法,其包括以下步骤:在立方晶系的单晶半导体衬底的主表面上提供由用于接种的开口部分开的氧化物绝缘体层,提供 在包括开口部分的绝缘体层的整个表面上的多晶或非晶半导体层,然后提供保护层,该保护层至少包括反射膜或防反射膜,该反射膜或防反射膜包含预定宽度的条,相对于开口 部分并且以预定间隔,保护层能够控制对应于条纹的部分或不对应于条纹的部分的半导体层中的温度分布,从而完成用于制造半导体器件的基底,之后, 通过条纹反射照射能量束 e或抗反射膜,以熔化多晶或非晶半导体并沿预定方向扫描能量束,使得半导体晶体的方向重新固化并转换成单晶符合{111}面,至 产生半导体器件的单晶。 还公开了一种通过该方法制造的半导体器件,该半导体器件包括相对于衬底的主表面的面取向在预定方向上具有宽范围的晶体的单晶层,并且具有三维半导体电路元件 施工。
    • 7. 发明授权
    • Laser beam irradiating apparatus enabling uniform laser annealing
    • 激光束照射装置实现均匀的激光退火
    • US5357365A
    • 1994-10-18
    • US62631
    • 1993-05-18
    • Takashi IpposhiTadashi Nishimura
    • Takashi IpposhiTadashi Nishimura
    • B01J19/12B23K26/06B23K26/08C30B1/08H01L21/268H01S3/101G02B26/08H01L21/477
    • B23K26/08B23K26/06B23K26/064B23K26/0648B23K26/0665B23K26/082Y10S117/904Y10S359/90
    • A laser beam irradiating apparatus is capable of laser annealing with high precision and uniform over the entire surface of a sample. Luminous flux of the laser beam output from a laser source is expanded by a beam expander. The power of the laser beam which has passed through the beam expander is adjusted by a half-wave plate of synthetic quarts and a polarizing prism of synthetic quarts. The laser beam emitted from polarizing prism is guided to a prescribed position by mirrors, and swung in the direction of the X-axis by an X-axis rotation mirror. The laser beam reflected from X-axis rotation mirror has its diameter reduced by a f-.theta. lens to have a prescribed beam spot diameter on the surface of a silicon wafer, and laser beam scanning is carried out at a constant speed. Since half-wave plate and the polarizing prism are formed of synthetic quarts, thermal deformation of optical components caused by continuous irradiation of laser beam can be suppressed, beam profile of the laser beam can be stabilized, therefore highly uniform and highly precise laser annealing becomes possible.
    • 激光束照射装置能够在样品的整个表面上以高精度和均匀的激光退火。 从激光源输出的激光束的光通量由光束扩展器扩展。 已经通过扩束器的激光束的功率由合成夸脱的半波片和合成夸脱的偏振棱镜调节。 从偏振棱镜发射的激光束被反射镜引导到规定位置,并通过X轴旋转镜在X轴的方向上摆动。 从X轴旋转镜反射的激光束的直径通过f-θ透镜减小,以在硅晶片的表面上具有规定的光束点直径,并且以恒定的速度执行激光束扫描。 由于半波片和偏光棱镜由合成石英形成,可以抑制由激光束的连续照射引起的光学部件的热变形,激光束的光束轮廓可以稳定,因此高度均匀且高精度的激光退火成为 可能。
    • 8. 发明授权
    • Apparatus for detecting three-dimensional configuration of object
employing optical cutting method
    • 使用光学切割方法检测物体的三维构型的装置
    • US4993835A
    • 1991-02-19
    • US424979
    • 1989-10-23
    • Yasuo InoueTadashi Nishimura
    • Yasuo InoueTadashi Nishimura
    • G01B11/24G01B11/25
    • G01B11/25
    • Disclosed is an apparatus for detecting the three-dimensional configuration of an object employing an optical cutting method. A light projector pulse-flashes slit-shaped light and causes the light to scan an object at a predetermined speed. An image sensor having a plurality of pixels is disposed in opposition to the object. An optical system forms on the image sensor an image of an optical cutting line formed on the surface of the object by the light. A difference detector detects the difference between the on- and off- levels of each of pulses of the image detected by the pixels of the sensor. A time calculator calculates the time at which the image has passed each of the pixels, on the basis of the difference detected by the difference detector. A configuration calculator calculates the three-dimensional configuration of the object on the basis of the calculated passage time and the scanning speed of the slit-shaped light. Since the difference between the levels of each pulse of the image is obtained, any optical signals resulting from a factor other than the pertinent pulses, such as influence by the background of the object, or a flash can be excluded, and the configuration can be detected with a high level of precision.
    • 公开了一种使用光学切割方法检测物体的三维构造的装置。 光投射器脉冲闪烁狭缝状光,并使光以预定速度扫描物体。 具有多个像素的图像传感器设置成与物体相对。 光学系统在图像传感器上形成通过光形成在物体表面上的光学切割线的图像。 差分检测器检测由传感器的像素检测的图像的每个脉冲的开和关电平之间的差异。 时间计算器基于由差分检测器检测到的差异来计算图像已经通过每个像素的时间。 配置计算器基于所计算的通过时间和狭缝状光的扫描速度来计算物体的三维配置。 由于获得图像的每个脉冲的电平之间的差异,所以可以排除由诸如对象的背景或闪光的相关脉冲之外的因素产生的任何光信号,并且可以将配置 以高精度检测。