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1. 发明专利

JP2014110344A Capacitor module 审中-公开
标题翻译：电容器模块
公开(公告)号：JP2014110344A
公开(公告)日：2014-06-12
申请号：JP2012264528
申请日：2012-12-03
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： UECHI TATSUYUKI , SUZUKI TOMOYUKI
IPC分类号： H01G2/10 , H01G4/38 , H01G9/08
摘要： PROBLEM TO BE SOLVED: To achieve a capacitor module which suppresses the lowering of a strength in a peripheral wall of a metal case by formation of a recessed portion, and can set a depth of the recessed portion without being restrained by a thickness of the peripheral wall.SOLUTION: In a capacitor module 1, a metal case 10 has peripheral walls 11a to 11d forming an inner wall surface 15 surrounding the periphery of capacitors 30a to 30c. In the peripheral walls 11a to 11d, in such a region that an interval L between reference planes 16a to 16d and an outer peripheral surface 33 of the capacitors 30a to 30c is wider than a minimum interval, inside projection portions 17a to 17h projecting from the reference planes 16a to 16d are provided. The inside projection portions 17a to 17h are provided with a recessed portion 20, and a resin 4 is filled into a space between the inner wall surface 15 and the outer peripheral surface 33.
摘要翻译：要解决的问题：为了实现通过形成凹部来抑制金属壳体的周壁的强度降低的电容器模块，并且可以设置凹部的深度而不受周边的厚度的限制在电容器模块1中，金属壳体10具有围绕电容器30a至30c周围的内壁表面15的周壁11a至11d。在周壁11a至11d中，在参考平面16a至16d与电容器30a至30c的外周表面33之间的间隔L比最小间隔宽的区域中，从突出部分提供参考平面16a至16d。内突出部17a至17h设置有凹部20，并且树脂4填充在内壁表面15和外周表面33之间的空间中。

2. 发明专利

JP2010175474A Current detecting apparatus 有权
标题翻译：电流检测装置
公开(公告)号：JP2010175474A
公开(公告)日：2010-08-12
申请号：JP2009020538
申请日：2009-01-30
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： ITO KOHEI , UECHI TATSUYUKI , SUZUKI TOMOYUKI
IPC分类号： G01R15/20
CPC分类号： G01R15/207 , G01R19/0092
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive current detecting apparatus capable of detecting a current with a high accuracy by inhibiting an effect of a neighboring bus bar on a magnetic field when a plurality of bus bars are parallelly arranged on the basis of a simple configuration requiring only appropriate setting of a shape and arrangement of each part of the bus bars. SOLUTION: The current detecting apparatus, assuming at least one of the plurality of parallelly arranged bus bars 2 to be a target bus bar 3, detects the current I on the basis of the magnetic field B near the target bus bar 3. A sensor section 6 detecting the magnetic field B in a predetermined magnetic field detecting direction S is disposed near a detection part of the target bus bar 3, so that the magnetic field detecting direction S is nearly perpendicular to an extending direction L of the target bus bar 3 at the detection part. The extending direction L of each part of the neighboring bus bar 4 to the sensor section 6 is set so that nothing may pass through the sensor section 6 in a direction parallel to the magnetic field detecting direction S within an extending orthogonal plane 5 perpendicular to the extending direction L of each part of the neighboring bus bar 4 disposed adjacent to the target bus bar 3. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种便宜的电流检测装置，其能够在多个汇流条基于以下方式并行布置时，通过抑制相邻母线对磁场的影响来高精度地检测电流简单的配置仅需要适当地设置母线的每个部分的形状和布置。解决方案：电流检测装置假设多个平行布置的母线2中的至少一个成为目标母线3，基于目标母线3附近的磁场B检测电流I. 在目标母线3的检测部附近设置检测规定磁场检测方向S的磁场B的传感器部6，使得磁场检测方向S与目标总线的延伸方向L大致垂直检测部分的条3。相邻母线4的每一部分到传感器部分6的延伸方向L被设定为使得在垂直于该传感器部分6的延伸的正交平面5内，在与磁场检测方向S平行的方向上，任何物体都不能通过传感器部分6。相邻母线4的每个部分的延伸方向L设置在与目标母线3相邻的位置。（C）2010，JPO＆INPIT

3. 发明专利

JP2014192512A Arrangement structure of semiconductor element substrate, and semiconductor device 审中-公开
标题翻译：半导体元件基板和半导体器件的布置结构
公开(公告)号：JP2014192512A
公开(公告)日：2014-10-06
申请号：JP2013069698
申请日：2013-03-28
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： TSURUOKA JUNJI , SUZUKI TOMOYUKI , YASUI SEIJI
IPC分类号： H01L25/07 , H01L25/18 , H02M7/48
CPC分类号： H01L2224/40 , H01L2224/40137 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/13055 , H01L2924/13091 , H01L2924/00 , H01L2224/37099 , H01L2224/37599 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an arrangement structure of semiconductor element substrate which allows for compaction of a semiconductor device configured by arranging a plurality of semiconductor element substrates constituted by arranging a plurality of semiconductor elements.SOLUTION: An arrangement structure of semiconductor element substrate is an arrangement structure of a pair of semiconductor element substrates that are arranged in parallel while being opposite in a predetermined direction, and each having a mounting surface for mounting a semiconductor element and a connection terminal. The pair of semiconductor element substrates have a notch area provided with a notch, and a non-notch area not provided with a notch and on which the connection terminal is mounted, respectively, on the side opposite to the other semiconductor element substrate. The non-notch area of one semiconductor element substrate, out of the pair of semiconductor element substrates, is mounted in the notch area of the other semiconductor element substrate.
摘要翻译：要解决的问题：提供一种半导体元件基板的配置结构，其可以通过配置通过配置多个半导体元件而构成的多个半导体元件基板而构成的半导体器件的压实。半导体元件基板的配置结构一对半导体元件基板的排列结构，它们沿预定方向相反地平行布置，并且每个具有用于安装半导体元件和连接端子的安装表面。所述一对半导体元件基板具有设置有切口的切口区域和未设置有切口的非切口区域，并且其连接端子分别安装在与另一个半导体元件基板相对的一侧上。在一对半导体元件基板中的一个半导体元件基板的非凹槽区域安装在另一个半导体元件基板的凹口区域中。

4. 发明专利

JP2013017335A Inverter device 审中-公开
标题翻译：逆变器装置
公开(公告)号：JP2013017335A
公开(公告)日：2013-01-24
申请号：JP2011149413
申请日：2011-07-05
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： SUZUKI TOMOYUKI , ITO KOHEI , SUZUKI KENJI
IPC分类号： H02M7/48
摘要： PROBLEM TO BE SOLVED: To realize an inverter device which achieves the downsizing of the entire device and efficiently cools a capacitor.SOLUTION: An inverter device 1 includes: a switching element 22 forming an inverter circuit; a base plate 11 on which the switching element 22 is placed; a smoothing capacitor 31; and a case 61 housing the switching element 22, the base plate 11, and the capacitor 31. The base plate 11 has a heat radiation part on the opposite side of a surface on which the switching element 22 is placed and also has a case attachment part 13 for fixing the base plate 11 to the case 61 at a portion R2 located on the outer peripheral side relative to the switching element 22 and the heat radiation part. The capacitor 31 is disposed so as to have a portion overlapping with the case attachment part 13 in a plain view that is viewed in a direction perpendicular to the surface on which the switching element 22 is placed. Further, the capacitor 31 is fixed to the base plate 11.
摘要翻译：要解决的问题：实现实现整个装置的小型化并有效地冷却电容器的逆变器装置。解决方案：逆变器装置1包括：形成逆变器电路的开关元件22; 设置开关元件22的基板11; 平滑电容器31; 以及容纳开关元件22，基板11和电容器31的壳体61.基板11在放置有开关元件22的表面的相对侧上具有散热部，并且还具有壳体附件用于将基板11相对于开关元件22和散热部分在位于外周侧的部分R2处固定到壳体61的部分13。电容器31被布置成具有与壳体安装部13重叠的部分，其在与放置有开关元件22的表面垂直的方向上看到的平面视图中。此外，电容器31固定到基板11.版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2013099213A Inverter device 审中-公开
标题翻译：逆变器装置
公开(公告)号：JP2013099213A
公开(公告)日：2013-05-20
申请号：JP2011242913
申请日：2011-11-04
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： SUZUKI TOMOYUKI , KONDO TATSUYA , ITO KOHEI
IPC分类号： H02M7/48
CPC分类号： H02M7/003 , B60L2210/42 , Y02T10/7241
摘要： PROBLEM TO BE SOLVED: To optimize a fixing method of a control substrate thereby realizing further downsizing of an inverter device.SOLUTION: An inverter device includes a bus bar module 20 electrically connecting with multiple switching elements 14, and a control substrate 41 is disposed at the opposite side of the multiple switching elements 14 across the bus bur module 20. The bus bar module 20 is fixed to an inverter case 5 through a module fixing part 27 provided at the bus bar module 20. The control board 41 is fixed to a substrate fixed part 26 provided at the bus bar module 20.
摘要翻译：要解决的问题：为了优化控制基板的固定方法，从而实现逆变器装置的进一步的小型化。解决方案：逆变器装置包括与多个开关元件14电连接的汇流条模块20，并且控制基板41设置在多个开关元件14的跨越总线开关模块20的相反侧。汇流条模块 20通过设置在汇流条模块20上的模块固定部分27固定到逆变器壳体5上。控制板41固定到设置在汇流条模块20上的基板固定部分26上。（C） 2013年，JPO＆INPIT

6. 发明专利

JP2012217262A Inverter device 有权
标题翻译：逆变器装置
公开(公告)号：JP2012217262A
公开(公告)日：2012-11-08
申请号：JP2011080707
申请日：2011-03-31
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： ITO KOHEI , KONDO TATSUYA , SUZUKI TOMOYUKI
IPC分类号： H02M7/48 , H02K5/22
CPC分类号： H02M7/003 , H02K5/225 , H02K11/33 , H02M7/53871
摘要： PROBLEM TO BE SOLVED: To provide an inverter device that is compact as a whole.SOLUTION: The inverter device includes: a plurality of switching elements 14 for converting power between DC power and AC power; a baseplate 11 mounted with the switching elements 14; AC terminals 25 for inputting/outputting AC power; and capacitors 31 for smoothing DC power. The AC terminals 25 are arranged so as to project, in a plan view, in a first reference direction X from the baseplate 11, and the capacitors 31 are arranged in a capacitor arrangement region R1 set in a rectangular shape in a plan view. The capacitor arrangement region R1 is set such that longer sides are parallel to the first reference direction X and is set adjacent to a base arrangement region R2 in which the baseplate 11 and the AC terminals 25 are arranged, in a second reference direction Y.
摘要翻译：要解决的问题：提供整体紧凑的逆变器装置。解决方案：逆变器装置包括：多个开关元件14，用于在直流电源和交流电之间转换功率; 安装有开关元件14的底板11; 用于输入/输出交流电源的交流端子25; 以及用于平滑DC电力的电容器31。交流端子25被布置成从基板11在平面图上沿第一基准方向X突出，并且电容器31布置在平面图中设置为矩形的电容器布置区域R1中。电容器配置区域R1被设定为使得长边平行于第一参考方向X并且被设置为与第二参考方向Y上布置有基板11和AC端子25的基座布置区域R2相邻。 P>版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2012217263A Inverter device 有权
标题翻译：逆变器装置
公开(公告)号：JP2012217263A
公开(公告)日：2012-11-08
申请号：JP2011080708
申请日：2011-03-31
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： ITO KOHEI , KONDO TATSUYA , SUZUKI TOMOYUKI
IPC分类号： H02M7/48 , B60K1/04 , B60K6/40 , B60K6/48 , B60L9/18 , B60L11/14 , H02K5/04 , H02K5/22 , H02K11/00
CPC分类号： H02M7/003 , H02K5/18 , H02K11/33 , H05K7/20918
摘要： PROBLEM TO BE SOLVED: To optimize the arrangement of components so as to simplify a structure of electrical connection to a rotary electric machine and ensure cooling performance.SOLUTION: An inverter device 1 includes: a plurality of switching elements for converting power between DC power and AC power; a baseplate mounted with the switching elements; radiating fins disposed on the baseplate; AC terminals 25 for inputting/outputting AC power in conjunction with a rotary electric machine 3 as a driving force source for a vehicle V; and capacitors for smoothing DC power. A rotary shaft 3a of the rotary electric machine is arranged in a width direction of the vehicle V. The baseplate and the AC terminals 25 are arranged adjacently in the width direction of the vehicle. The plurality of AC phase terminals are sequentially arranged in a direction across the rotary shaft 3a of the rotary electric machine 3. The capacitors are arranged adjacently to the radiating fins in the rear directional side of the progressing direction of the vehicle V.
摘要翻译：要解决的问题：优化部件的布置，以简化与旋转电机的电连接结构，并确保冷却性能。解决方案：逆变器装置1包括：用于在直流电力和交流电力之间转换功率的多个开关元件; 安装有开关元件的底板; 设置在基板上的散热片; 用于与作为车辆V的驱动力源的旋转电机3一起输入/输出AC电力的AC端子25; 和用于平滑直流电源的电容器。旋转电机的旋转轴3a沿车辆V的宽度方向配置。基板和交流端子25相对于车辆的宽度方向排列。多个AC相端子沿着旋转电机3的旋转轴3a的方向依次配置。电容器与车辆V的前进方向的后方侧的散热片相邻配置。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2015012714A 車両用駆動装置有权
标题翻译：车辆驱动装置
公开(公告)号：JP2015012714A
公开(公告)日：2015-01-19
申请号：JP2013136968
申请日：2013-06-28
申请人：アイシン・エィ・ダブリュ株式会社 , Aisin Aw Co Ltd
发明人： SUZUKI TOMOYUKI , UECHI TATSUYUKI , KONDO TATSUYA , ITO YOSHINOBU
IPC分类号： B60L9/18 , B60K6/26 , B60K6/36 , B60K6/40 , B60K6/405 , B60K6/48 , B60K6/547 , B60L11/14
CPC分类号： Y02T10/6221 , Y02T10/7077
摘要：【課題】配線の簡素化と装置全体の小型化とを共に実現する。【解決手段】車両用駆動装置は、共通の直流電源に接続される、回転電機を制御する第一インバータ30とポンプ用電動機を制御する第二インバータ40とを備える。第一インバータ30及び第二インバータ40が、ケース2内に配置されている。直流電源から延びる第一配線部材60が、ケース2内で分岐して、第一インバータ30と第二インバータ40とのそれぞれに接続されている。【選択図】図8
摘要翻译：要解决的问题：实现整个装置的布线和小型化的简化。解决方案：一种车辆驱动装置，包括：用于控制旋转电机的第一逆变器30和用于控制泵电动机的第二逆变器40，其连接具有公共直流电源。第一逆变器30和第二逆变器40设置在壳体2中。从直流电源延伸的第一配线构件60在壳体2中分支以与第一逆变器30和第二逆变器40连接。

9. 发明专利

JP2014183150A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2014183150A
公开(公告)日：2014-09-29
申请号：JP2013056190
申请日：2013-03-19
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： SUZUKI TOMOYUKI
IPC分类号： H01L23/34 , H05K7/20
CPC分类号： H01L2224/40137
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which lowers a temperature of a bus bar without increasing a thickness of the bus bar.SOLUTION: A semiconductor device includes: a substrate; a semiconductor chip mounted on the substrate; a bus bar connected with the semiconductor chip; and a cooling plate which is placed adjacent to the bus bar and cools the bus bar. Preferably, the semiconductor device further includes a control board which is arranged in parallel with the substrate and is connected with the semiconductor chip. The bus bar is placed between the substrate and the control board, and the cooling plate is placed between the bus bar and the control board arranged in parallel with the substrate.
摘要翻译：要解决的问题：提供一种在不增加母线的厚度的情况下降低汇流条的温度的半导体器件。解决方案：一种半导体器件包括：衬底; 安装在基板上的半导体芯片; 与半导体芯片连接的母线; 以及与母线相邻放置并冷却母线的冷却板。优选地，半导体器件还包括与衬底并联布置并与半导体芯片连接的控制板。母线放置在基板和控制板之间，并且冷却板放置在母线和与基板平行设置的控制板之间。

10. 发明专利

JP2013099214A Inverter device 审中-公开
标题翻译：逆变器装置
公开(公告)号：JP2013099214A
公开(公告)日：2013-05-20
申请号：JP2011242914
申请日：2011-11-04
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： SUZUKI TOMOYUKI , ITO KOHEI , KONDO TATSUYA
IPC分类号： H02M7/48
CPC分类号： H02K5/225 , H02M7/003 , H02P27/06
摘要： PROBLEM TO BE SOLVED: To further miniaturize an inverter device by optimizing arrangement of individual members in the inverter device.SOLUTION: A rotary electric machine connection terminal 25 is disposed on the side of a short-side first direction X1 with respect to a switching element 14. A capacitor 31 is disposed so as to overlap with the rotary electric machine connection terminal 25 when viewed in an orthogonal direction Z. A capacitor connection terminal 33 for electrically connecting the capacitor 31 and the switching element 14 to each other is disposed on the side of a short-side second direction X2 with respect to a base plate 11.

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