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1. 发明专利

JP2008166358A Electronic circuit device and method for manufacturing the same 有权
标题翻译：电子电路装置及其制造方法
公开(公告)号：JP2008166358A
公开(公告)日：2008-07-17
申请号：JP2006351622
申请日：2006-12-27
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： AOKI KAZUO , TSURUOKA JUNJI , YASUI SEIJI , KAMATA YASUSHI , SOYANO SHIN
IPC分类号： H01L25/07 , H01L25/18
CPC分类号： H05K1/144 , H01L23/24 , H01L24/40 , H01L25/072 , H01L25/162 , H01L25/18 , H01L2224/40137 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H05K3/0061 , H05K3/284 , H05K2201/042 , H05K2201/10924 , H05K2201/2018 , Y10T29/49126 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： PROBLEM TO BE SOLVED: To provide a small-sized and low-price electronic circuit device provided with a pair of substrates arranged as upper and lower substrates with an area surrounding the lower substrate filled with a filler, assuring high and reliable vibration-proof characteristic of the upper substrate. SOLUTION: The electronic circuit device includes the lower substrate 5 on which a principal circuit is formed, the upper substrate 6 on which a drive control circuit for controlling drive of the principal circuit is formed, and a resin case 3 having external lead terminals 9 of the principal circuit and the drive control circuit at the external surface of the circumferential edge and having a substrate storage space inside of the circumferential edge. In order to constitute the electronic circuit device where the upper substrate 6 is located above the lower side substrate 5 and the upper space of the lower side substrate 5 is filled with the filler, resin is used as the filler, a supporting material 2 fixed to a position above the lower side substrate with the hardened resin is provided and the upper substrate 6 is fixed with this supporting material 2. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种小型和低价格的电子电路装置，其具有布置成上下基板的一对基板，其中包含填充有填料的下基板周围的区域，确保高且可靠的振动上层基板的特性。解决方案：电子电路装置包括形成有主电路的下基板5，形成用于控制主电路的驱动的驱动控制电路的上基板6和具有外引线的树脂壳体3 主电路的端子9和周缘的外表面处的驱动控制电路，并且在周向边缘内具有基板存储空间。为了构成上基板6位于下侧基板5上方并且下侧基板5的上部空间填充有填充物的电子电路装置，使用树脂作为填料，将支撑材料2固定到设置具有硬化树脂的下侧基板上方的位置，并且将上基板6固定在该支撑材料2上。（C）2008，JPO＆INPIT

2. 发明专利

JP2014192512A Arrangement structure of semiconductor element substrate, and semiconductor device 审中-公开
标题翻译：半导体元件基板和半导体器件的布置结构
公开(公告)号：JP2014192512A
公开(公告)日：2014-10-06
申请号：JP2013069698
申请日：2013-03-28
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： TSURUOKA JUNJI , SUZUKI TOMOYUKI , YASUI SEIJI
IPC分类号： H01L25/07 , H01L25/18 , H02M7/48
CPC分类号： H01L2224/40 , H01L2224/40137 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/13055 , H01L2924/13091 , H01L2924/00 , H01L2224/37099 , H01L2224/37599 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an arrangement structure of semiconductor element substrate which allows for compaction of a semiconductor device configured by arranging a plurality of semiconductor element substrates constituted by arranging a plurality of semiconductor elements.SOLUTION: An arrangement structure of semiconductor element substrate is an arrangement structure of a pair of semiconductor element substrates that are arranged in parallel while being opposite in a predetermined direction, and each having a mounting surface for mounting a semiconductor element and a connection terminal. The pair of semiconductor element substrates have a notch area provided with a notch, and a non-notch area not provided with a notch and on which the connection terminal is mounted, respectively, on the side opposite to the other semiconductor element substrate. The non-notch area of one semiconductor element substrate, out of the pair of semiconductor element substrates, is mounted in the notch area of the other semiconductor element substrate.
摘要翻译：要解决的问题：提供一种半导体元件基板的配置结构，其可以通过配置通过配置多个半导体元件而构成的多个半导体元件基板而构成的半导体器件的压实。半导体元件基板的配置结构一对半导体元件基板的排列结构，它们沿预定方向相反地平行布置，并且每个具有用于安装半导体元件和连接端子的安装表面。所述一对半导体元件基板具有设置有切口的切口区域和未设置有切口的非切口区域，并且其连接端子分别安装在与另一个半导体元件基板相对的一侧上。在一对半导体元件基板中的一个半导体元件基板的非凹槽区域安装在另一个半导体元件基板的凹口区域中。

3. 发明专利

JP2013098465A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2013098465A
公开(公告)日：2013-05-20
申请号：JP2011242205
申请日：2011-11-04
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： TSURUOKA JUNJI , YASUI SEIJI , YAMATO OSAMU , MAEDA TAKAYUKI
IPC分类号： H01L23/48 , H01L23/12 , H05K1/14
CPC分类号： H01L23/36 , H01L23/492 , H01L24/36 , H01L24/40 , H01L24/78 , H01L25/072 , H01L2224/40095 , H01L2224/40137 , H01L2224/48091 , H01L2224/48472 , H01L2224/73221 , H01L2224/73265 , H01L2224/78313 , H01L2224/83801 , H01L2224/84801 , H01L2224/85181 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H05K1/189 , H05K3/0061 , H05K2203/049 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/37099
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device that allows properly protecting a flexible circuit board from an edge of a metal substrate.SOLUTION: A semiconductor device 1 according to the present invention includes: a metal substrate; a semiconductor element disposed on the metal substrate; and a flexible circuit board that has one end disposed on the metal substrate, is electrically connected to the semiconductor element, and extends outside the metal substrate beyond an edge of the metal substrate. At a portion of the flexible circuit board located on the edge of the metal substrate, a thickness adding member is bonded to a metal substrate.
摘要翻译：要解决的问题：提供一种允许从金属基板的边缘适当地保护柔性电路板的半导体器件。解决方案：根据本发明的半导体器件1包括：金属基板; 设置在所述金属基板上的半导体元件; 并且具有设置在金属基板上的一端的柔性电路板电连接到半导体元件，并且延伸到金属基板的外部超过金属基板的边缘。在位于金属基板的边缘的柔性电路板的一部分上，将厚度增加部件接合到金属基板上。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2013021855A Electric power conversion apparatus 有权
标题翻译：电力转换装置
公开(公告)号：JP2013021855A
公开(公告)日：2013-01-31
申请号：JP2011154654
申请日：2011-07-13
申请人： Toyota Motor Corp , トヨタ自動車株式会社 , Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： TATEMATSU KAZUTAKA , TAKENAKA MASAYUKI , TSURUOKA JUNJI , ROKUURA KEITA
IPC分类号： H02M7/48 , H02K11/00 , H05K7/14
摘要： PROBLEM TO BE SOLVED: To provide a substrate connection structure which reduces vibrations of substrates of an electric power conversion apparatus in the electric power conversion apparatus mounted on a transaxle having a motor generator and a transmission gear.SOLUTION: An electric power conversion apparatus 20 is formed by arranging a power module 21, a drive substrate 22, a substrate bracket 23, and a control substrate 24 from the lower side and connecting the components with bolts 27, 28 and spacers 26. The substrate bracket 23 connects with the drive substrate 22 and the control substrate 24 at different positions, allows connection positions to be set for the respective substrates so that the vibration amplitude is reduced even if the substrates have different sizes, and fixes the substrates thereto. Further, providing a clamp in a connector inhibits the displacement of the connector which is caused by vibrations.
摘要翻译：解决的问题：提供一种降低安装在具有电动发电机和变速齿轮的变速驱动桥上的电力转换装置中的电力转换装置的基板的振动的基板连接结构。解决方案：电力转换装置20通过从下侧布置功率模块21，驱动基板22，基板支架23和控制基板24而形成，并且用螺栓27,28和间隔件衬底支架23与驱动衬底22和控制衬底24在不同位置处连接，允许为各个衬底设置连接位置，使得即使衬底具有不同的尺寸也能减小振动幅度，并固定衬底到此。此外，在连接器中提供夹具阻止由振动引起的连接器的位移。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2008172024A Heating element cooling structure and driving device equipped with it 有权
标题翻译：加热元件冷却结构和驱动装置
公开(公告)号：JP2008172024A
公开(公告)日：2008-07-24
申请号：JP2007003816
申请日：2007-01-11
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： AOKI KAZUO , TSURUOKA JUNJI , YASUI SEIJI , KAMATA YASUSHI
IPC分类号： H01L23/473 , H02K5/20
CPC分类号： H02K9/19 , F28F3/048 , F28F3/12 , H01L23/473 , H01L2924/0002 , H02K5/20 , H02K9/22 , H02K11/33 , H05K7/20927 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To realize a heating element cooling structure having a good cooling capability and achieve a highly reliable driving device by providing the heating element cooling structure in that device. SOLUTION: In this heating element cooling structure or the driving device equipped with it, coolant space R is formed between the radiating surface 53a thermally connected to the heating element and the opposed surface 6a, radiating fins 56 are installed toward the opposed surface 6a from the radiating surface 53a, and inter-fin passages Rp via which the coolant flows are formed between adjacent fins in the radiating fins 56. An inflow-side coolant reservoir Ri extending in the juxtaposition direction of the inter-fin passages Rp and communicating with one end side of the inter-fin passages Rp is provided, the inter-fin passages Rp and the inflow-side coolant reservoir Ri are connected into communication by a contraction portion Rs extending across at least the juxtaposition region of the inter-fin passages Rp, and the contraction portion Rs has a circulation resistance larger than that of the inflow-side coolant reservoir Ri. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：通过在该装置中设置加热元件冷却结构，实现具有良好冷却能力的加热元件冷却结构，并实现高可靠性的驱动装置。解决方案：在该加热元件冷却结构或其配备的驱动装置中，冷却剂空间R形成在与发热体热连接的散热面53a和相对面6a之间，散热片56朝向相对面散热片56a的相邻翅片之间形成有冷却剂流过的翅片间通路Rp。一个流入侧冷却剂储存器Ri，其沿翅片间通道Rp的并列方向延伸并且连通在翅片间通道Rp的一端侧设置有翅片间通道Rp和流入侧冷却剂储存器Ri，该收缩部Rs至少延伸穿过翅片间通道的并列区域 Rp，并且收缩部Rs的循环阻力大于流入侧冷却剂储存器Ri的循环阻力。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2015038903A 半導体モジュール审中-公开
标题翻译：半导体模块
公开(公告)号：JP2015038903A
公开(公告)日：2015-02-26
申请号：JP2011242883
申请日：2011-11-04
申请人：アイシン・エィ・ダブリュ株式会社 , Aisin Aw Co Ltd
发明人： TSURUOKA JUNJI , AOKI KAZUO , TAGUCHI MAKOTO , YASUI SEIJI
IPC分类号： H01L23/36 , H01L23/467 , H01L23/473
CPC分类号： H01L23/36 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要：【課題】ヒートスプレッダと放熱体との間に介在する樹脂シートへの圧力印加が可能な半導体モジュールを提供する。【解決手段】半導体チップ22が載置されるヒートスプレッダ24とフィン26bを有する放熱体26の接着面32とを接着結合する樹脂シート30と、を備え、半導体チップ22は、フィン26bが占めるフィン領域に重なるように位置し、かつ、ヒートスプレッダ24の端部が、フィン領域の外側の非フィン領域に位置している。【選択図】図1
摘要翻译：要解决的问题：提供能够对布置在散热器和散热器之间的树脂片施加压力的半导体模块。解决方案：半导体模块包括：树脂片30，其粘结和耦合散热器24，半导体芯片22 以及具有翅片26b的散热器26的接合表面32。半导体芯片22被定位成与翅片26b占据的翅片区域重叠。每个散热器24的端部位于位于散热片区域的外侧的非鳍片区域。

7. 发明专利

JP2012244040A Semiconductor device and method of manufacturing the same 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2012244040A
公开(公告)日：2012-12-10
申请号：JP2011114584
申请日：2011-05-23
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： TSURUOKA JUNJI , YASUI SEIJI
IPC分类号： H01L23/34 , H01L21/60
CPC分类号： H01L2224/36 , H01L2224/40 , H01L2224/40137 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/00 , H01L2224/37099 , H01L2224/37599 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device and the like capable of efficiently protecting a semiconductor chip from sputters at the time of laser welding by a relatively small quantity of resin and with a good workability, and having an excellent thermal diffusion property.SOLUTION: A semiconductor device 1, 2, 3 has: a heat spreader 20, 200 having recessed parts 22A and 22B; semiconductor chips 10A and 10B fixed in the recessed parts of the heat spreader; a connection conductor 12 fixed to the semiconductor chips 10A and 10B; an insulation resin part 70 covering the semiconductor chips 10A and 10B in the recessed parts 22A and 22B of the heat spreader while exposing a weld part 121 of the connection conductor; and an external terminal 80 bonded to the weld part of the connection conductor by laser welding.
摘要翻译：解决的问题：提供能够通过相对少量的树脂和良好的可加工性在激光焊接时有效地保护半导体芯片免于溅射的半导体器件等，并且具有优异的热扩散属性。解决方案：半导体器件1,2,3具有：具有凹部22A和22B的散热器20,200; 固定在散热器的凹部的半导体芯片10A，10B; 固定到半导体芯片10A和10B的连接导体12; 绝缘树脂部分70，其在暴露连接导体的焊接部分121的同时，覆盖散热器的凹部22A和22B中的半导体芯片10A和10B; 以及通过激光焊接结合到连接导体的焊接部分的外部端子80。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2008186820A Heat generation body cooling structure and drive 有权
标题翻译：热发生体冷却结构与驱动
公开(公告)号：JP2008186820A
公开(公告)日：2008-08-14
申请号：JP2007016279
申请日：2007-01-26
申请人： Aisin Aw Co Ltd , Nakamura Mfg Co Ltd , アイシン・エィ・ダブリュ株式会社 , 中村製作所株式会社
发明人： AOKI KAZUO , TSURUOKA JUNJI , YASUI SEIJI , KAMATA YASUSHI , MIYAHARA HIDEYUKI , KUMAGAI MASAHARU
IPC分类号： H05K7/20 , H01L23/36 , H01L23/473 , H02K9/19 , H02K11/00
CPC分类号： H05K7/20927 , H01L21/4878 , H01L23/473 , H01L2924/0002 , H02K5/20 , H02K9/19 , H02K11/33 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a drive capable of realizing a heat generation body cooling structure having an improved heat radiation capacity and further achieving miniaturization and energy-saving by the heat generation body cooling structure. SOLUTION: The heat generation body cooling structure has a refrigerant space R and inter-fin passages Rp. The refrigerant space R is formed between a heat radiation surface thermally connected to a heat generation body and an opposite surface placed so as to face the heat radiation surface. The inter-fin passages Rp are formed by parallelly arranging a plurality of heat radiation fins 56, rising from the heat radiation surface toward the opposite surface, and allow a refrigerant to flow between adjacent heat radiation fins 56. The drive has this heat generation body cooling structure. A heat radiation fin 56 is shaped in a serpentine pattern having a plurality of bends in the direction of flow of the refrigerant, and both sidewall surfaces 56c, 56d of the heat radiation fin 56 are shaped to be different from each other. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够实现具有改善的散热能力的发热体冷却结构的驱动器，并且通过发热体冷却结构进一步实现小型化和节能。解决方案：发热体冷却结构具有制冷剂空间R和肋间通道Rp。制冷剂空间R形成在热连接到发热体的热辐射表面和与热辐射表面相对放置的相对表面之间。翅片间通道Rp通过平行布置从散热表面向相对表面上升的多个散热翅片56并且允许制冷剂在相邻的散热翅片56之间流动而形成。驱动器具有该发热体冷却结构。散热翅片56成形为在制冷剂流动方向上具有多个弯曲部的蛇形图案，并且散热片56的两个侧壁表面56c，56d成形为彼此不同。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2013098466A Semiconductor device and manufacturing method of the same 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2013098466A
公开(公告)日：2013-05-20
申请号：JP2011242206
申请日：2011-11-04
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： TSURUOKA JUNJI , YASUI SEIJI , YAMATO OSAMU , MAEDA TAKAYUKI
IPC分类号： H01L23/28
CPC分类号： H01L24/40 , H01L23/24 , H01L23/3107 , H01L23/36 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/072 , H01L2224/32245 , H01L2224/40095 , H01L2224/40137 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49111 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01029 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： PROBLEM TO BE SOLVED: To provide a structure which properly prevents a resin from moving along a flexible circuit board and protruding to the exterior of the substrate.SOLUTION: A semiconductor device 1 includes: a metal substrate; a semiconductor element disposed on the metal substrate; a flexible circuit board having one end disposed on the metal substrate and electrically connecting with the semiconductor element, the flexible circuit board extending beyond an edge part of the metal substrate to the exterior of the metal substrate; a resin wall part 70 disposed at least in the edge part of the metal substrate beyond which the flexible circuit board extends, out of an outer peripheral part of the metal substrate, the resin wall part 70 provided on the flexible circuit board at the edge part; and a resin sealing part 72 provided at the inner side of the resin wall part 70 so as to cover the metal substrate.
摘要翻译：要解决的问题：提供一种适当地防止树脂沿着柔性电路板移动并突出到基板的外部的结构。解决方案：半导体器件1包括：金属基板; 设置在所述金属基板上的半导体元件; 柔性电路板，其一端设置在所述金属基板上并与所述半导体元件电连接，所述柔性电路板延伸超过所述金属基板的边缘部分到所述金属基板的外部; 至少设置在金属基板的边缘部分的树脂壁部70，该金属基板的边缘部分，柔性电路板从金属基板的外周部分延伸出设置在柔性电路板上的树脂壁部70的边缘部分 ; 以及设置在树脂壁部70的内侧以覆盖金属基板的树脂密封部72。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2012033815A Heat exchanger plate 审中-公开
标题翻译：热交换器板
公开(公告)号：JP2012033815A
公开(公告)日：2012-02-16
申请号：JP2010173678
申请日：2010-08-02
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： TSURUOKA JUNJI , YAMATO OSAMU , YASUI SEIJI
IPC分类号： H01L23/36
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat exchanger plate including projections and recesses and capable of preventing generation of a void in positions where the projections and the recesses are formed with respect to a flow of solder generated when solder is filled in a gap between a semiconductor unit and a mounting face of the heat exchanger plate.SOLUTION: A heat exchanger plate 1 includes: a mounting face 3 on which a semiconductor unit is mounted; projections 5 formed on the mounting face 3 to secure clearances for solder joining between the semiconductor unit and the mounting face 3; and recesses 6 formed in the mounting face 3 around the projections 5 to form the projections 5. Adjacent non-formation regions 7 located adjacent to the projections 5 and having no recesses 6 formed therein are provided at least in part of the entire circumferences of the projections 5 on the mounting face 3. An inclined face 8 is formed in the recess 6 at least in part of its boundary with the adjacent non-formation region 7. The inclined face 8 has an inclination having a recess depth that gradually decreases from the bottom of the recess 6 toward the adjacent non-formation region 7.
摘要翻译：要解决的问题：提供一种包括突起和凹陷的热交换器板，并且能够相对于在焊料填充时产生的焊料的流动而防止在形成有突起和凹部的位置处产生空隙半导体单元与热交换器板的安装面之间的间隙。解决方案：热交换器板1包括：安装面3，半导体单元安装在该安装面3上; 形成在安装面3上的突起5，以确保半导体单元和安装面3之间的焊料间隙; 以及形成在安装面3周围的凸起5的凹部6，以形成凸起5.邻近的非形成区域7设置在与凸部5相邻的位置，并且在其中形成有凹部6的至少一部分突起5在安装面3上。倾斜面8至少部分地与相邻的非成形区域7的边界形成在凹槽6中。倾斜面8具有从该凹部6的凹部深度逐渐减小的倾斜凹槽6的底部朝向相邻的非成形区域7。版权所有（C）2012，JPO＆INPIT

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