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    • 2. 发明申请
    • HOT WIRE CHEMICAL VAPOR DEPOSITION (CVD) INLINE COATING TOOL
    • 热线化学气相沉积(CVD)在线涂装工具
    • WO2011034751A2
    • 2011-03-24
    • PCT/US2010047972
    • 2010-09-07
    • APPLIED MATERIALS INCHAAS DIETERNARWANKAR PRAVIN KTHAKUR RANDHIR P S
    • HAAS DIETERNARWANKAR PRAVIN KTHAKUR RANDHIR P S
    • H01L21/205C23C16/54
    • C23C16/24C23C16/54H01L21/02532H01L21/0262
    • Methods and apparatus for hot wire chemical vapor deposition (HWCVD) are provided herein. In some embodiments, an inline HWCVD tool may include a linear conveyor for moving a substrate through the linear process tool; and a multiplicity of HWCVD sources, the multiplicity of HWCVD sources being positioned parallel to and spaced apart from the linear conveyor and configured to deposit material on the surface of the substrate as the substrate moves along the linear conveyor; wherein the substrate is coated by the multiplicity of HWCVD sources without breaking vacuum. In some embodiments, methods of coating substrates may include depositing a first material from an HWCVD source on a substrate moving through a first deposition chamber; moving the substrate from the first deposition chamber to a second deposition chamber; and depositing a second material from a second HWCVD source on the substrate moving through the second deposition chamber.
    • 本文提供了热线化学气相沉积(HWCVD)的方法和装置。 在一些实施例中,在线HWCVD工具可以包括用于通过线性处理工具移动衬底的线性输送机; 和多个HWCVD源,多个HWCVD源被定位成与线性传送器平行并与其间隔开,并且被配置为当衬底沿着线性传送器移动时将材料沉积在衬底的表面上; 其中所述衬底被多个HWCVD源涂覆而不破坏真空。 在一些实施例中,涂覆基底的方法可以包括在移动通过第一沉积室的基底上沉积来自HWCVD源的第一材料; 将衬底从第一沉积室移动到第二沉积室; 以及将第二材料从第二HWCVD源沉积在移动通过第二沉积室的衬底上。
    • 10. 发明专利
    • Substrate support, substrate processing device and method of placing substrate
    • 基板支撑,基板处理装置和放置基板的方法
    • JP2008291361A
    • 2008-12-04
    • JP2008116237
    • 2008-04-25
    • Applied Materials Incアプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated
    • HAAS DIETERBERGER THOMASLAU SIMON
    • C23C14/50C23C16/458H01L21/205H01L21/31
    • H01L21/68714H01L21/68Y10T29/49998
    • PROBLEM TO BE SOLVED: To provide a substrate support for supporting a substrate to be processed in a vacuum processing chamber. SOLUTION: The substrate support comprises: frames 2c, 2d for carrying the substrate 14; and at least a first fastening means fixedly attached to the frames for aligning the substrate 14 relative to the frames by attaching the substrate 14 to the first fastening means. The substrate support further comprises at least second fastening means 12, 13 movably attached to the frames, the second fastening means 12, 13 being movable relative to the frames and/or movable relative to the substrate 14 attached to the first fastening means in a direction at least towards and/or away from an edge 14' of the substrate 14 attached to the first fastening means. Furthermore, a coating chamber comprises an edge exclusion projecting over portion of the surface of the stored substrate in order to prevent processing of a portion of the substrate surface. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供用于在真空处理室中支撑待处理的基板的基板支撑件。 解决方案:基板支撑件包括:用于承载基板14的框架2c,2d; 以及至少第一紧固装置,其固定地附接到框架,用于通过将基板14附接到第一紧固装置来相对于框架对准基板14。 基板支撑件还包括至少可移动地附接到框架的第二紧固装置12,13,第二紧固装置12,13可相对于框架移动和/或可相对于在第一紧固装置上的方向 至少朝向和/或远离附接到第一紧固装置的基板14的边缘14'。 此外,涂覆室包括突出在存储的基板的表面的一部分上的边缘排除,以防止基板表面的一部分的处理。 版权所有(C)2009,JPO&INPIT